Tandex Test Labs, Inc.
Providing assembly, screening and qualification for electronic piece parts.
- 800-729-8378
626.962.7166 - 626.960.6896
- craiggoolsby@tandexlabs.com
- 15849 Business Ctr Dr
Irwindale, Ca 91706-2053
United States of America
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product
Destructive Physical Analysis (DPA)
Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
