Onto Innovation
Onto Innovation collaborates with its customers around the globe to develop innovative, data-driven solutions that increase the yield and profitability of their microelectronics and display manufacturing operations. Onto Innovation's comprehensive, state-of-the-art measurement, inspection, data analysis and lithography solutions for semiconductor manufacturing and advanced packaging processes accelerate product and process development, increase yields and reduce costs to enable its customers to be first-to-market with premium products at premium prices.
- 978-253-6200
- info@ontoinnovation.com
- 16 Jonspin Road
Wilmington, Massachusetts 01887
United States
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product
Epi Thickness & Composition System
Element
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Lithography System
JetStep S3500
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Lithography System
JetStep X500
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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Metrology System
IVS
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Lithography
With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Metrology System
IMPULSE V
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Probe Card Test & Analysis
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. In cases where the card is not meeting performance specification, repairs may be performed such as tip adjustment or card cleaning, thus returning the card quickly to a production state.
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Defect Inspection
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Epi Thickness & Composition
FTIR (Fourier Transform Infrared) is the most important technology for measuring epitaxial film (Epi) thickness, measuring impurities in Silicon and monitoring dielectrcis, like Borophosphosilicate glass (BPSG), FSG, PSG, etc in semiconductor industry. FTIR is evolving from a primarily quality control (wafer supply chain) technology to a tool/process/chamber (test wafers) monitoring technology and more importantly, a device (product wafers) monitoring tool.
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product
G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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product
Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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VX4 System
PrecisionWoRx
The PrecisionWoRx VX4 System gives test facilities and probe card manufacturers the ability to confidently test tighter pitches and smaller probe tips. The system can be easily configured to specific requirements for a variety of probe card technologies. For processes using cards with very small probe tips, the system’s high-resolution optics deliver a detailed field-of-view for high accuracy and repeatability.
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Metrology System
Echo
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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product
Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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4D Technology
4D Technology is the leader in high-resolution surface and wavefront measurements for challenging locations and applications. 4D pioneered “dynamic” measurement technology, paving the way for entirely new classes of instruments that change how manufacturers and scientists think about measurement. From the world’s premiere astronomical observatories, to optical manufacturing shops, to aircraft flight lines, 4D gages and instruments provide 3D measures accurately, despite vibration and noise that stop other instruments in their tracks.
