Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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product
Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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product
Discharge Test System
The automated testing equipment automatically performs charge and discharge of energy devices such as the rechargeable batteries(cells, modules, packs) that are installed in PHV/ EV and mobile devices, while measuring the voltage, current, temperature, and impedance.
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product
*CNC Surface Texture Measuring Instrument
Surfcom C5
SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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*Coordinate Measuring Machine
PRISMO ultra
PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge accuracy, speed, rigidity, and cost performance. This 3D coordinate measuring machine is best suited for research and development of high-precision parts and calibration inspection of reference gages.
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Polish Grinders
The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
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Auxiliary Equipment For Probing Machines
We have a lineup of products that support the probing process.
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product
Coordinate Measuring Machines
Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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product
Roundness And Cylindrical Profile Measuring Instruments
We respond to a variety of needs with our lineup including both rotating table types that enable high precision measurement of cylindrical workpieces, and rotating type detectors that handle eccentric or heavy workpieces.
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X-ray CT System
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Air Micrometers
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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Non-contact Displacement Sensors
This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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product
Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
