Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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product
PLCC-to-DIP Adaptor
Series 652000/653000
PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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product
PLCC-to-DIP Adaptor
1109342
PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors.
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product
Elevator Socket with Bifurcated Contacts
Series 8XXX
Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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product
Deci-Center™ Jumpers
SERIES 150/151
DECI-CENTER JUMPERS. Pitch bars help maintain .100 [2.54] conductor spacing.Consult factory for jumper lengths under the specified minimum length.
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product
160-Position QFP-to-PGA Adapter
96-160M65
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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product
Pin-Line™ Header with Screw Machine Contacts
Series 0625
Pin-Line Headers with Screw Machine Contacts. Aries Pin-Line headers are available with a variety of screw machined contacts. Consult Data Sheet No. 12034 for strip-line headers with coined contacts. Break feature allows header to be cut to the number of positions desired.
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product
Mini-Link™ Miniature Jumper
Series ML-100
Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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product
JEDEC TO Collet Socket
Series 514
TO Collet Sockets. Aries TO sockets feature molded chamfer lead-ins for easy device insertion. High stand-off design for heat dissipation and easy cleaning. External polarization for positive location.
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product
SOIC-to-SOWIC Adaptor
XX-666000-00
SOIC to SOWIC Adapter. Allows the use of a narrow package IC in place of a wide one.
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product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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product
SSOP-to-DIP Adaptor
Series 351000
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
