Olympus Corp.
Manufacture and sales of precision machineries and instruments.
- (81) 3-3340-2111
- Shinjuku Monolith, 3-1 Nishi-Shinjuku
2-chome
Shinjuku-ku, Tokyo 163-0914
Japan
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Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Hall Effect Thickness Gage
Magna-Mike 8600
The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Scrap Handheld XRF Analyzer
DELTA
DELTA Scrap Sorting Handheld XRF Analyzers provide reliable ID in 1-2 seconds for most alloy grades and pure metals. They are designed for durability to withstand the toughest processing environments. Get fast, reliable alloy sorting and analysis for a wide variety of ferrous and non-ferrous materials in seconds.
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Benchtop XRD System
BTX
The BTX Benchtop XRD System is a fast, low cost, small footprint, benchtop XRD for full phase ID of major, minor and trace components and quick XRF scan of elements Ca – U. Its unique, minimal sample prep technique and sample chamber allow for fast, benchtop analysis rivaling the performance of large costly lab units.
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Deep Ultraviolet Observation System for Microscope
U-UVF248
Model Capable of High-magnification/High-contrast Deep Ultraviolet (DUV) Observation. A Semiconductor / FPD Inspection Microscopes.
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3D Measuring Laser Microscope
LEXT OLS5000
The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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Laser Scanning Microscopes
The Olympus FLUOVIEW confocal microscopes are designed for high-resolution, confocal observation of both fixed and living cells, enabling visualization deep within samples. From the New FV3000, optimized for the most robust interactive live cell and tissue experiments, to easy-to-use high content imaging, explore the wide range of options with Olympus exclusive optical technologies.
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Multiphoton Laser Scanning Microscope
FVMPE-RS
The Olympus FVMPE-RS multiphoton imaging system is purpose-built for deep imaging in biological tissue, aimed at revealing both detail and dynamics. Innovative features for efficient delivery and detection of photons in scattering media enable high signal-to-noise ratio acquisition. This translates to bright images with precise details — even from deep within the specimen. High sensitivity is matched with high-speed imaging to capture rapid in vivo responses. For advanced applications, dual-wavelength excitation extending to 1300 nm is available. Independent control of visible or multiphoton laser light stimulation and the ability to synchronize with patch clamp data are also possible.
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Industrial Microscope for Materials Science & Industrial Applications
BX53M
Designed with modularity in mind, the BX3M series provide versatility for a wide variety of materials science and industrial applications. With improved integration with OLYMPUS Stream software, the BX3M provides a seamless workflow for standard microscopy and digital imaging users from observation to report creation.
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Cleanliness Inspection System / Microscope
CIX90
The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Lead Paint Handheld XRF Analyzer
DELTA Lead Based Paint Handheld XRF Analyzers test for Lead (Pb) in seconds. These reliable, tube-based units are light in weight and ergonomically designed for all-day testing. They start fast and stay fast - no isotope fade. And, they have a low total cost of ownership. Before you begin structural repair - grinding, cutting or painting - screen for Pb; then, check your work area after clean-up.
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Ultrasonic Thickness Gage
27MG
The Olympus 27MG is an affordable ultrasonic thickness gage designed to make accurate, measurements from one side on internally corroded or eroded metal pipes, tanks, and other equipment. It weighs only 12 oz. (340 g) and is ergonomically designed for easy, one-hand operation. Thickness range 0.50 mm to 635 mm (0.020 in. to 25.0 in.) depending on material, transducer, surface conditions, temperature.
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Inverted Metallurgical Microscope
GX53
Designed for use in the steel, automotive, electronics, and other manufacturing industries, the GX53 microscope delivers crisp images that can be difficult to capture using conventional microscopy observation methods. When combined with OLYMPUS Stream image analysis software, the microscope streamlines the inspection process from observation to image analysis and reporting.
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Micro Spectrophotometer
USPM-RU III
The USPM-RU III is a reflectometer that provides highly accurate spectral reflectivity measurements of small, curved, and thin samples without interference from rear surface-reflected light. The curved surface of the lens can be measured from a minute spot as small as ø60 µm formed on the sample surface. This provides the ability to use a goniometer to examine even the curved side lenses or other optical component.
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Portable Flaw Detector
EPOCH 6LT
Portable and easy to use, the EPOCH 6LT flaw detector is an ergonomic, rugged instrument that delivers user comfort and more uptime. Weighs just 1.95 pounds (890 g) with a grip-oriented weight distribution for one-handed operation with minimal wrist fatigue. Rotary knob and simple button design make it easy to use, even when wearing gloves. Engineered to IP65/67 and drop tested. Clear, bright screen for readable A-scans in any light. The EPOCH 6LT flaw detector’s workflow is simple and straightforward. Despite the instrument’s small size, it has the features and functions to meet the requirements of nearly any conventional ultrasonic inspection application.