Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
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Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis Services
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Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis Services
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BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Acoustic Microscope
AMI D9650
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Specifically designed to serve as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection, the capabilities of the D9650 are truly unmatched. Representing the latest in C-SAM acoustic micro imaging, the D9650 delivers the unrivaled accuracy and robustness that you would expect from Nordson Test & Inspection instruments, plus improved electronics and software that raises the performance level for laboratory acoustic microscopes.
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Field Triage System™
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Developed with our customer’s Remote Customer Quality Engineers, who support their customers with rapid in-field failure analysis.
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Real-time X-ray Inspection System
JewelBox 70T™
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The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
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Root Cause Failure Analysis
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Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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FTIR Spectrometers
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FTIR spectroscopy is used to quickly and definitively identify compounds such as compounded plastics, blends, fillers, paints, rubbers, coatings, resins, and adhesives. It can be applied across all phases of the product lifecycle including design, manufacture, and failure analysis.
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Atomic Force Microscope
NX-Hivac
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Park NX-Hivac allows failure analysis engineers to improve the sensitivity of their measurements through high vacuum Scanning Spreading Resistance Microscopy (SSRM). Because high vacuum scanning offers greater accuracy, better repeatability, and less tip and sample damage than ambient or dry N2 conditions, users can measure a wide range of dope concentration and signal response in failure analysis applications.
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Cross-Section Analysis Laboratory
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PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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ISDD Tool Suite
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The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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Precision Curve Tracer
CurveMasterTM
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The CurveMasterTM delivers new price/performance efficiency to curve tracing and Failure Analysis. Curve trace has been a standard feature in our full-power chip tester for years, so the CurveMasterTM is built with today’s components and technology. With all new high-accuracy DC Parametrics, you’ll enjoy the most powerful curve tracer you have ever used.
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IC Product Testing & Analysis Services
Integrated Service Technology
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Integrated Service Technology Inc.
iST (Integrated Service Technology Inc.) is a leading lab-service company, specializing in the development of IC product testing & analysis, failure analysis, debugging, reliability test, material analysis. Apart from developing testing technologies for the upstream IC design and semiconductor industries, iST also expanded to provide a full-spectrum of services for the mid and downstream companies in the electronics industry.
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Network Surveillance System
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The network backbone contains a wealth of information that can be monitored and collected to support diagnostic, troubleshooting, and fraud prevention activities. Surveillance of network characteristics is becoming more important than ever before. Few important aspects of network surveillance include, Performance Monitoring, Security, Fraud Prevention, Physical Layer monitoring, Billing Verification, Remote Protocol Analysis, Failure Prediction, Traffic Engineering, Call Quality Monitoring and Troubleshooting.
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Test System
ETS788XL
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The 50/100 MHz ETS788XL system is the compact protable version of our ETS788. Made with the new high-performance precision components of our Griffin series, this portable powerhouse offers an optional tough road case and ready to go to any test site needed. Just pop off the covers and get started. Whether it's research, Failure Analysis, or single-event effects testing, his powerful member of the HiLevel family takes advantage of all of the tried and true features that have served users so successfully to date.
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ADLINK Software
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The plug and play Edge IoT solution for machine condition monitoring enabling remote equipment monitoring, health scoring and predictive failure analysis to maximize overall equipment effectiveness (OEE).
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Data Reduction
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Data reduction systems with or without time history recording to throughput disc are frequently used in critical aerospace testing applications where complete measurements of a high number of channels are required for post-test and possible failure analysis. The m+p VibControl data reduction system configurations are tailored to the specific needs of high-performance measurement applications requiring hundreds or thousands of input channels.
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Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Product
Standard Electromagnetic Vibrator
KD-9363-EM
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King Design Industrial Co., Ltd.
The purpose of vibration testing is to make a series of controllable vibration simulation in lab, no matter generated by natural or man-made vibration environment; such as waves, tidal flaps, wind, earthquake or rain and so on. It is to test if the product is capable of sustaining the vibration environment exerted from transporting or usage along its effective life cycle; and certify the standard of design & functional requirement of product. The value of vibration testing is to confirm the reliability of products and effectively screen out the bad products in factory; avoiding damages occurred at arrival; and to assess the failure analysis on the non-performing products; expecting to reach a high standard, high-reliability products. The vibration test stresses on the continuity and fatigue; and contributes to the understanding of product’s status under vibration circumstance in a normal environment; and avoids the product’s unpredictable damage caused under certain vibrating frequency for a long time.
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Test System
Griffin III
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The Griffin III system brings new price/performance efficiency to the Tester-in-a-Head tradition, a concept created and introduced by HILEVEL in 1987. This tester is a superior cost-effective solution for Engineering, Production, and Failure Analysis test applications.
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Diagnostic Test System™
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The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Surface Insulation Resistance Testing
AutoSIR2™
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One AutoSIR chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2-point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), ensuring that dendrites are preserved for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.
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Electrical Testing
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Innovative Testing Solutions, Inc.
Our specialty is Direct Current automotive components. We perform product validation and design verification testing on both electrical components and systems. Also, we perform warranty investigation testing and failure analysis. We have voltage capabilities to 300 volts and current capabilities to 1000 amperes. Both two-wire and four-wire resistance measurements are supported from NanoOhms to GigaOhms.
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Thermal Image Analysis Software
Thermalyze
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Thermalyze software provides a stable platform from which to perform sophisticated temperature analysis and failure analysis testing. Tools such as Emissivity Tables allow you to perform true temperature mapping on the surface with varying emissivity. Lock-in thermography tests enable you to detect heating below 0.001°C.
