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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Internal Vapor Analyzer
IVA® MODEL 210S
The IVA® system is specifically designed for the quantitative analysis of low molecular weight gases contained in hermetic packages, cavities and other enclosures. The Model 210s concept integrates automated hardware with easy-to-use icon-driven software. Its design permits routine quality control, failure analysis and research level testing operation as a turn-key analytical system. The IVA® Model 210s includes a high-performance, quadrupole-mass spectrometer analyzer, a sample-mounting interface and precision hardware. The instrument is also computer-controlled and equipped with exclusive ORS integrated system control software — which provides instrument control, data analysis, data archiving and ease of operation.
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Test System
Griffin III
The Griffin III system brings new price/performance efficiency to the Tester-in-a-Head tradition, a concept created and introduced by HILEVEL in 1987. This tester is a superior cost-effective solution for Engineering, Production, and Failure Analysis test applications.
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Inspection Microscope
Z-NIR
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Real-time X-ray Inspection System
JewelBox 70T™
The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
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Surface Insulation Resistance Testing
AutoSIR2™
One AutoSIR chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2-point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), ensuring that dendrites are preserved for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.
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Scanning Electron Microscope w/ EDX Laboratory
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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PWB Interconnect Stress Test
PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Acoustic Microscope
AMI D9650Z
The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Precision Curve Tracer
CurveMasterTM
The CurveMasterTM delivers new price/performance efficiency to curve tracing and Failure Analysis. Curve trace has been a standard feature in our full-power chip tester for years, so the CurveMasterTM is built with today’s components and technology. With all new high-accuracy DC Parametrics, you’ll enjoy the most powerful curve tracer you have ever used.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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High Impedance Probes
Everbeing offers GGB’s high impedance active probe for failure analysis of your devices. The high impedance with low capacitive design allows measurements of internal nodes without loading the device. For more information, please visit http://www.ggb.com.Everbeing offers GGB’s high impedance active probe for failure analysis of your devices. The high impedance with low capacitive design allows measurements of internal nodes without loading the device. For more information, please visit http://www.ggb.com.
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Field Triage System™
Developed with our customer’s Remote Customer Quality Engineers, who support their customers with rapid in-field failure analysis.
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Automated DC Parametric Curve Tracer
MultiTrace
MultiTrace curve tracer is a mid-sized benchtop model supporting pin counts from 216-625 pins and includes the PGA-625 fixture as a standard interface. MultiTrace supports a wide range of test applications: Failure analysis, Reliability testing, Counterfeit device analysis, Nondestructive electrical counterfeit test, Opens, shorts leakage testing (OSL), Post decap electrical inspection, Optical fault localization, ESD testing, Latch-up testing, Supply current measurements, and more!
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ISDD Tool Suite
The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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High-resolution, Portable AXI System
AXI X1# Series
The X1# is a high-resolution, low-footprint and portable AXI system. It is a dedicated platform for FATP and advanced failure analysis applications in connection with smart devices.
