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- Advanced Telemetrics International
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Inductively Powered Telemetry Systems
Advanced Telemetrics International
ATi Inductively Powered Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver.
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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Inductively Coupled Plasma
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensitivity while reducing solvent based interferences such as oxides and hydrides. The Aridus3 is particularly advantageous for small volume and highly corrosive samples such as those generated in the earth sciences and the semiconductor industry.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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ICP-OES Analyzer
ARCOS
SPECTRO Analytical Instruments GmbH
For the most demanding elemental analyses in industry and research. ARCOS analyzer represents a new pinnacle of productivity and performance for inductively coupled plasma optical emission spectrometers. SPECTRO ARCOS excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Multichamber Plasma CVD & RIE Processing Systems
Model MPS-2000
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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UV Plasma Sources
UVS300|UVS 10/35
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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RF Plasma Generators
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements. From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Remote Plasma Sources For Process Applications
MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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Plasma CVD & Reactive Ion Etching System
MODEL DRIE-1100-LL-ECR
The Tek-Vac DRIE-1100-LL-ECR series systems are designed for both high-density plasma chemical vapor deposition and reactive ion etching of sub-micron integrated circuits, optical devices and RF microwave electron devices.
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DC Coupled Differential Switching System
BS1553F(X)
Universal Switching Corporation
The BS1553F(X) is a modular passive DC coupled differential switching system. It is designed as an automated "patch panel" for interconnecting numerous MIL-STD-1553 devices, cables and hardware, or for routing other differential signals such as '422 clock/data or kelvin ATE measurements. The I/O capacity is scalable from a small 8x8, up to 64x64 in one 5RU unit.
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LXI WTB Probe, Thru connect, DC coupled
60-981-001
The 60-981 LXI Wired Trigger Probe provides a simple method of monitoring the LXI Wired Trigger Bus activity. It provides a through line active probe that can be used to non-intrusively monitor the waveforms of the M-LVDS drivers on all 8 channels. Each channel has two single ended outputs from the differential pair that can be subtracted by an oscilloscope to display each driver output and the differential signal.
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RF Plasma Generators & Amplifiers
100 W to 2400 W 13.56 MHz Analog/Digital, RS-232, USB interfaces Low Harmonic Distortion Automatic and Manual Gain Control High Speed Pulsing (Bursting) controls Compatible with T&C''''s Matching Networks GUI Software (complete PC control) Includes all essential RF power/communication cables and mounting brackets Air cooled (Air & Water 1200 W +) Half rack mount or stand alone versions Ideal for: Industrial, Scientific, and Medical Applications
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Microwave Plasma Atomic Emission Spectroscopy / MP-AES Systems
Agilent’s industry-leading microwave plasma-atomic emission spectrometer (MP-AES) systems are powerful, cost-efficient and easy-to-use for a wide range of applications from routine analysis to complex precious metals analysis. By running on air, Agilent MP-AES systems both cost less and are safer than alternative methods that rely on flammable gases. The innovative Agilent 4210 MP-AES system offers higher sensitivity and faster throughput capabilities than flame atomic absorption.
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Elite™ 13.56 MHz RF Plasma Generators
The elite™ Series of RF plasma generators provides state-of-the art technology in a compact air-cooled package. The elite is designed with high speed closed loop control, a class E RF deck and a switching modulator for superior output performance. The elite design utilizes a single printed circuit board assembly for the full rack product virtually eliminating all internal wires and connectors and thereby providing the highest reliability available.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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R*evolution® Remote Plasma Source
The innovative R*evolution® Remote Plasma Source combines field-proven, low-field toroidal plasma technology with an actively cooled plasma chamber made of high purity quartz, significantly reducing oxygen, hydrogen and nitrogen atomic gas loss through wall recombination. Self-contained and compact, R*evolution delivers up to 10 slm of oxygen radicals from a 6kW power supply with true power accuracy of <1% resulting in a high density, extremely clean radical source for photoresist strip and an optimal clean rate greater than 12 microns/min-1. R*evolution can be used for other surface preparation applications.
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Remote Plasma Source
MAXstream
Advanced Energy’s MAXstreamTM line is the next generation of remote plasma sources for chamber cleaning. The MAXstream is available in 3, 6, 8, 10, and 12 SLPM NF3 flow rates to optimize price and performance.
