Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
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The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Compact Professional IC Tester
ChipMaster
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The ABI ChipMaster Compact Professional is a low-cost, hand-held out-of-circuit IC tester. The ChipMaster is designed for testing digital ICs with up to 40 pins through a ZIF socket (see LinearMaster for analogue devices). A range of adapters is also available for SOIC and PLCC devices.
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Mobile Forensics Tool-Chip off
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Mobile phone forensics-chip-off data recovery -system verifydebug and internal-analyzequality review.etc
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Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
DIGITAL TACHOMETER
IBL-DT2235A
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International Biological Laboratories
This is a Digital Hand Held Contact type Tachometer and has Micro Computer LSI Chip
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Product
Multilayer PCB
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ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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Product
PCIe Mini Module
PCIe-Mini-SYNCHRO
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The PCIe-Mini-SYNCHRO module is a one channel Synchro/Resolver controller. It uses a state of the art 16-bit monolithic Resolver-to-Digital converter. This single chip converter offers programmable features such as resolution, bandwidth, velocity output scaling and encoder emulation.
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ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
TSL1401 Linescan Sensor Daughterboard
28317
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The Parallax TSL1401 Linescan Imaging Daughterboard provides one-dimensional sight to almost any microcontroller. It is designed for plug-in compatibility with Parallax’s BS2pe Motherboard but can be used with other BASIC Stamp modules, the Parallax Propeller, the SX, PICs, and AVRs, to name just a few. It is a platform suitable not only for evaluating TAOS’s TSL1401R imaging chip, but also for incorporation into OEM products, as well as hobbyist, robotic, and educational platforms.
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Flight Processor Emulator
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Flight Processor Emulators are an essential part of satellite simulators – both for testing of flight software and at the heart of operational simulators. The Terma Emulator is a suite of instruction-level emulators, based in the ESOC Emulator Suite, supporting several processors used in the Space industry: MIL-STD-1750 in both A and B variants. ERC32 in both 3-chips configuration (691-E) and single chip configuration (695-F). LEON 2 (AT-697)...
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UV TOCONs
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SiC based UV sensor with integrated amplifier and 0 – 5 V voltage output. Measures intensities from 1.8pW/cm² up to 18W/cm². Spectral response for broadband UV or filtered for UVA, UVB, UVC or UV-Index. Also available for blue light (GaP chip) or visible light (Si chip) measurement. Available in TO5 housings or as miniature sensor probes (stainless steel or plastic). Special TOCONs for hydrogen flame sensing (TOCON_F) and for fire detection (TOCON_N) available. Also available for operating temperatures up to 120°C (standard is 85°C). Please learn more about the sglux TOCONs here: TOCON selection guide and here: TOCON User Guide.
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Product
Mixers/Receivers In Terahertz Range
Hot Electron Bolometer (HEB)
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Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz. Advantages: Above about 1 THz Hot Electron Bolometer mixers offer the best sensitivity and lowest noise of all the technology for the coherent detection of radiation.
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Receivers
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Macom Technology Solutions Holdings Inc.
MACOM's receivers are widely used in point-to-point radio, aerospace and defense, and other broadband communications applications. Operating between the 4.5 - 45 GHz frequency range, our receivers feature an integrated LNA, mixer and LO buffer amplifier onto a single chip. Available in lead-free QFN or SMD packages, our receivers boast excellent noise figure and conversion gain performance.
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, Anti-sulfuration resistor. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
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The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Low cost Device Programmer for PC/Parallel
ChipMax
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ChipMax is a cost-effective, high quality industrial-grade device programmer with parallel-port interface that is suitable for most programming needs without using any extraneous personal family modules.
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32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
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Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Product
Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Product
60 GHz WR-15 Waveguide Tx Module
PEM010
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The PEM010 is a highly integrated millimeter wave transmitter that covers the 60 GHz global unlicensed spectrum allocations packaged in a standard waveguide module. Transmitter architecture is a double conversion, sliding IF with wide bandwidth capability through the up-conversion chain from baseband to carrier. The I/Q interface accepts analog baseband signals which provides for flexibility in design and applications. The baseband input optionally supports FSK/MSK modulation for non-coherent applications. The transmitter incorporates a complete waveguide interface with low-loss transition between the chip and the WR15 waveguide port. The integrated package is small and lightweight, with a simple to use multi-pin ST4 connector for power, reference clock, digital control port and baseband signals. Either of two reference clocks can be used for setting 540 MHz or 500 MHz channel spacing.
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AFDX®/ARINC664P7 Modules
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AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.
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DisplayPort v1.3 Protocol Analysis Probe
FS4500
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The FuturePlus FS4500 DisplayPort Analysis Probe provides a mechanical, electrical and software interface to the DisplayPort bus, a digital display interface standard supported by the Video Electronics Standards Association (VESA). The FS4500 is used to design and debug computer motherboards, monitors, home theater systems, and silicon chips incorporating DisplayPort technology.
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Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
