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Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Advanced Telemetrics International
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Prop Shaft Torque Measurement Systems
Advanced Telemetrics International
ATi Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver. The Miniature Strain Gage Transmitter can be attached to strain gages adhered to your shaft in order to transmit shaft torque and thrust while the system is running.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Impurity Checker
STA-2
Necessity for on-site lead-free solder management.Applicable for RoHS Directive. (WEEE: Directional on Waste from Electrical and Electronic Equipment, Pb mixed rate under 0.1%) Lead measurement accuracy is +/-150 PPM. Manage increases and decreases of Pb and Cu in your lead-free solder.
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Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Pressure Measurement
A wide variety of pressure sensors with an option for nearly every pressure measurement application. Pressure transducers, pressure gauges, pressure switches manometers, calibrators, and regulators.
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Ambient Measurement
A measurement of the concentration of a substance or pollutant within the immediate environs of an organism; taken to relate it to the amount of possible exposure.
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Nanometer Measurement
The Nano-Gauge™ is an ultra high precision, single axis, displacement measuring instrument capable of resolving dimensions down to 1.5 nanometers (0.06 microinches) over a full scale range of 25mm (1 inch). Combining ease-of-use and small physical size, the Nano-Gauge™ can be quickly adapted to a wide variety of precision measurement situations without lengthy or complex setup procedures.
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Measurement Module
DEPOLOX® 5
The DEPOLOX® 5 measurement module can be used with either the SFC electronic package for single point analysis and control or the versatile MFC electronic package for multiple measurements and control.
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Measurement
Frequency Meter
Frequency Meter is used for measuring the frequency of the signal coming to the input channels of ADC modules and FFT spectrum analyzers. The indicator displays the measured frequency value (frequency of periodic oscillations) and signal cycle time corresponding to the measured frequency. It is possible to change the averaging of the displayed value (0.1; 1, or 10 s) and to select a necessary channel of the ADC module, FFT spectrum analyzer or a virtual channel.
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Measurement Microphone
UMM-6 USB
Precision condenser microphone for critical measurement and recording applicationsConnects to your PC or Mac via USB portTrue omnidirectional pattern with calibrated flat frequency responseRugged construction with high-quality componentsCompact design; includes sturdy carrying case with foam insertCompatible with most industry-standard measurement software
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Optical Measurement
• Vertical optical measuring machine for static and dynamic measurement of various elements on small cylindrical parts.• The parts can be mounted between two centres or held in place using various accessories.• Attractive design and robust construction with many new features: New touch screen control panel for easy operation directly at the workplace, bi-telecentric optical system, high resolution CMOS camera, precision sliding headstock with integrated and protected daily standard, quick and easy accessory changing system, integrated temperature sensors, dynamic LED indicator of the general status of the measured part (GO/NG) and operator messages. Equipped with an exclusive optics tilting system.• Machines specially designed to measure threads such as, parallel, trapezoidal, conical, round, square, conical, worms, ball screws, bone screws, dental implants, etc.• Reflex SCAN+ concept for measuring parts without prior programming at the touch of a button• Delivered complete with a PC and the Reflex SCAN+ software, which allows a multitude of elements to be measured easily and intuitively.
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Magnetic Measurement
DiskMapper H7 System
The DiskMapper H7 system quickly determines the uniformity of the perpendicular recording layer of Heat Assisted Magnetic Recording (HAMR), also called Thermally Assisted Recording (TAR) disks, immediately after deposition, an important factor in the yield of disk drives. Utilizing a custom 7 Tesla bi-polar high speed superconducting magnet, the hysteresis loop of any disk location can be measured in less than 3 minutes.
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Measurement
Strain Gauge Meter
The program Strain gauge meter is intended for various strain gauge measurements with the use of strain gauge transducers (e.g., force and torque transducers, RPM sensors, bridge and half-bridge circuits based on strain gauges, etc.) and a measurement module for strain gauges ZET 017-T.
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Replacement Solder tip lead set for D420/D620
Dx20-SI
- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
