EV
automobile singly powered by electrical energy.
See Also: Electric Vehicle, Hybrid Electric Vehicle, EV Charging Station
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product
multiprocessor
EVP6472
Sundance Multiprocessor Technology Ltd.
The EVP6472 is the industry’s first off-the-shelf multiprocessor, multicore solution that features dual Texas Instruments (TI) TMS320C6472 Digital Signal Processors (DSPs)
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Power Converter Test Solution for HEV/EV and HEMS
EV1003A
The hybrid-electric and electric vehicle (HEV/EV) market has been growing rapidly. The addition of these vehicles in the automotive market brings with them new challenges in design and manufacturing. Probably the most noticeable change is the addition of high-voltage, high-power batteries to a platform that is traditionally 12 volts. Hybrid electric and full electric vehicle batteries are 300 volts and higher. These high voltages bring with them additional costs and risks.
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Shaft Alignment
EVO
The evolution of laser shaft alignment towards simplicity and confidence continues with the EVO.
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EVS for Experimental and Homebuilt Aircraft
Give your aircraft a safety boost with a Max-Viz enhanced vision system (EVS) from Astronics. These systems help you see through smoke, fog, and night to help you avoid runway obstructions, severe weather, and more.
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product
VHF/UHF Nav/Drone Analyzer
EVSD1000
The R&S®EVSD1000 VHF/UHF nav/drone analyzer is a signal level and modulation analyzer for use aboard medium sized drones. It measures ILS, GBAS and VOR ground stations during startup, maintenance and servicing and analyzes air traffic control communications (ATC COM) signals. The mechanical and electrical design is optimized for drone based measurements of terrestrial navigation systems.
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product
Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
