Particle Size
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Break The Rules Of Power, Size And Cost In Your Connectivity And Acceleration Applications
ECP5 / ECP5-5G
*Up to 3.2 Gbps SERDES rate with ECP5, and up to 5 Gbps with ECP5-5G*Up to 4 channels per device in dual channel blocks for higher granularity*Enhanced DSP blocks provide 2x resource improvement for symmetrical filters*Single event upset (SEU) mitigation support*Programmable IO support for LVCMOS 33/25/18/15/12, XGMII, LVTTL, LVDS, Bus-LVDS, 7:1 LVDS, LVPECL and MIPI D-PHY input/output interfaces
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Pocket Sized Dial Thermometer w/ 5 Inch Stem
T160
UEi Test & Measurement Instruments
Farenheit scale thermometer with 1 inch dial and 5 inch stem with a -40˚ to 160˚F range
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Air Particle Counters
These air particle counters can measure particle in air, with airflow 2.83L/min and 28.3L/min large air flow .
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Poket Size DMM
SDM102
Compact Pen type. Fits easily into shirt pocket. Easy to Use Rotary switch allows easy access and operation
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Cryogenic Mill for Sample Sizes 0.1 - 100 Grams
Cryogenic Gringer 6870
Large cryogenic mill that accommodates sample sizes ranging from 0.1 - 50 grams. Specifically designed for cryogenic grinding and pulverizing tough and/or temperature sensitive samples immersed in liquid nitrogen. CE Approved.
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Pocket Sized Celsius Scale Dial Thermometer w/ 5 Inch Stem
TC100
UEi Test & Measurement Instruments
Celsius scale thermometer with a 1 inch dial and 5 inch stem with a -10˚ to 100˚C range
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Particle Impact Noise Detection
BW-LPD-DAQ4000
Computer based controller with predefined MIL-STD test sequences stored (New)Create unlimited custom tests with multiple vibration frequencies and acceleration and other parameters to meet unique requirements (New)
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SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Small, High-Energy Ball Mill for Sample Sizes 0.2 - 1.5 Grams
Mixer/Mill 5100*
Small high-energy ball mill that accommodates sample sizes ranging from 0.2 - 1.5 grams. Ideal for grinding and pulverizing brittle samples, slurry grinding, and mixing powders.
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Particle Impact Detection System 10
BW-LPD-DAQ4000HD
This system is capable of vibration testing up to 10 pounds and detecting defects that produce noise, such as loose screws, particles, etc. Right from the start of PIND testing, B&W patented the first MIL-STD compliant system outperforming the competition by over 30% better detection rate as tested by the NBS (now National Institute of Science and Technology) in a well known 1978 study (NBSIR 78-1590 NASA).
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Pocket Size Analog Multimeter
HH2704A
Analog Multimeter. Basic Accuracy 3.0%. 5 Functions / 17 Ranges. Voltage test up to AC500V and DC1000V. Current test up to 250mA. Resistance test R X 1KΩ. Tset Batteries 1.5V and 9V
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PXI-6115, 4 AI (12-Bit, 10 MS/s/ch), Buffer Size 32MS, 2 AO, 8 DIO, PXI Multifunction I/O Module
778204-01
4 AI (12-Bit, 10 MS/s/ch), 2 AO, 8 DIO, PXI Multifunction I/O Module - The PXI‑6115 is a simultaneous sampling, multifunction DAQ device. It offers analog I/O, digital I/O, two 24‑bit counters, and digital triggering. It is ideal for a variety of applications, such as stimulus/response applications where synchronization among analog input, analog output, and digital I/O is required, 42 V automotive applications, radar, sonar, and ultrasound. The included NI‑DAQmx driver and configuration utility simplify configuration and measurements.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
