Wafer Level
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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High Voltage 50 Ω Pulse Generator
TLP-8010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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System to Handle Wafer Levels
AMI AW Series
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Level System
Universal II
The Universal II level transmitter offers increased reliability, low maintenance and an intrinsically safe design for dependable level measurements in all kinds of process liquids, slurries, granulars and interfaces.Universal IIThe Universal II is a two wire level transmitter that eliminates the need for line power in the field and saves costs for additional hardware. It provides reliable level measurements in all kinds of process liquids, slurries, granulars and interfaces.When powered from an approved source this level transmitter can be made intrinsically safe. Its rugged contruction resists corrosion and abraision. The no moving parts design eliminates break downs.The Universal II level transmitter utilizes RF Admittance technology with manual calibration and a 4 – 20 mA output signal. The patented Cote-Shield circuitry ensures accuracy and reliability regardless of product build-up on the level transmitter.This level system is unaffected by changes in the process material density, pressure, or temperature variations.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Laser Levels
Use a laser, an amplified, focused beam of light emitted from a solid-state device called a diode.
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Single Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Level Sensors
Intelligent solutions for level and point level measurementWhether for continuous level measurement, point level measurement or both – SICK offers a wide range of solutions for process engineering, storage, and protection. Based on the installation situation, medium properties, and environmental conditions, SICK provides sensors that ensure efficient processes. As the provider of one of the broadest technology portfolios, SICK brings its knowledge to the forefront.
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Sound Level Meter
SoundTrack LxT N/Forcer
For Community Noise Ordinance Enforcement and Nuisance Complaint Response. Portable, compact and simple to use, the Larson Davis LxT N/Forcer Sound Level Meter produces accurate, citation-ready noise data on-the-spot, with its compact portable printer.
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Entry level potentiostat-galvanostat
VERTEX
The Vertex is an entry level potentiostat/galvanostat with optional FRA/EIS and optional I/O port. Its price easily matches its application in educational and applied electrochemistry. A complete suite of IviumSoft control and data processing software is included (for Windows based PC's).
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Level Measurement
HighReach Measuring & Controlling System Co.,Ltd
The process of measuring the level of a liquid or solid material inside a vessel for monitoring and process control.
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Radar Level Transmitter
DR6400
The DR6400, FMCW 24-26 GHz open air radar is a market entry level transmitter for solids from granulates to rocks. This model has proven PP Drop antenna design which is insensitive to product build-up.
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Radar Level Transmitter
DR6500
The Drexelbrook DR6500 is a two-wire open air radar level transmitter for measuring level in applications with powder and dusty atmosphere.
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Radar Level Gauge
HRRD730 Series
HighReach Measuring & Controlling System Co.,Ltd
At The Radar Level gauge Antenna emits and Narrows at The Microwave Pulse. This Pulse propagates in Space AT at The Speed of Light. The When IT Encounters at The Surface of at The the Measured Medium, Part of the ITS Energy IS the REFLECTED the Back and Received by at The Same, Antenna. At The Time interval The Between the transmitted pulse and the received pulse is proportional to the distance from the antenna to the surface of the measured medium.Because the electromagnetic wave propagation speed is extremely high, the time interval between the transmitted pulse and the received pulse is very small (on the order of nanoseconds). It is difficult to confirm. The 90X series 26G radar level gauge uses a special demodulation technology To accurately identify the transmitted pulse and the time interval of the pulse is received to further calculate the distance of the antenna from the surface of the measured medium.
