Wafer Level
-
Product
High Power Devices
-
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
-
Product
High Voltage 50 Ω Pulse Generator
TLP-8010C
-
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
-
Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
-
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
-
Product
Test Socket Based Elastomeric Matrix Connectors
-
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
-
Product
Nano-focus X-ray Inspection System
X-eye NF120
-
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
-
Product
Wafer Prober
Precio XL
-
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
-
Product
Wafer Test
-
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
-
Product
Wafer Analyzer
RAMANdrive
-
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
-
Product
Wafer Probers
-
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
-
Product
WAFER MVM-SEM
E3300 Family
-
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
Wafer Sorter and Inspection
SolarWIS Platform
-
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
-
Product
Level Measurement
-
Omega provides contact and non-contact instruments for liquids, and non-contact instruments for solids. Choose from continious measurement or point level measurement with one of our level switches.
-
Product
Bare Wafer Inspection System
LS-6700
-
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
-
Product
Level Switch
Z-Tron IV
-
The Z-Tron IV level switch is one of our most popular on/off level switches offering an effective, low-cost material level detection in a wide variety of applications. It is widely used as an alternative to electromechanical level switches.
-
Product
Wafer Bonder
AML
-
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
Product
Level Measurement
-
As a market leader in level detection with the largest selection of agency approved level switch technologies, the K-TEK level products line has the proven technology to provide solutions for the most difficult liquids and solids level applications.
-
Product
Laser Levels
-
Use a laser, an amplified, focused beam of light emitted from a solid-state device called a diode.
-
-
Product
Level Measurement & Level Sensors
-
With so many technologies, products and parameters to consider, selecting the best technology for level measurement can be challenging. Choose from the comprehensive Rosemount portfolio of level devices for the best solution for your level application.
-
Product
Wafer Testing
Trio Vertical
-
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Inline Wafer Testing
IL-800
-
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
-
Product
Wafer Demounting And Cleaning Machines
-
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
-
Product
Laser Levels
-
Shenzhen UYIGAO Electronic Technology Co., Ltd
UYIGAO laser level is a construction tool which measures levelness by projecting a red or green light beam onto a flat surface. Laser levels are used to deduct how level or straight a surface is by projecting a light beam across or around it.
-
Product
Sound Level Meter
-
Is a digital noise meter auto-shifting function that can be applied to the measurements for both environmental noise and mechanical noise.
-
Product
Sound Level Indicators
-
A sound level meter is a measuring instrument used to assess noise or sound levels by measuring sound pressure. Often referred to as a sound pressure level (SPL) meter, decibel (dB) meter, noise meter or noise dosimeter, a sound level meter uses a microphone to capture sound. The sound is then evaluated within the sound level meter and acoustic measurement values are shown on the display of the sound level meter. The most common unit of acoustic measurement for sound is the decibel (dB); however, some sound level meter devices also determine the equivalent continuous sound level (Leq) and other acoustic parameters. With a portable sound level meter, industrial hygiene and workplace safety professionals can measure sound levels in multiple locations to ensure environmental conditions fall within recommended exposure limits (RELs). Some sound level meter devices can be permanently installed for continuous monitoring of sound levels at a work or job site.An important attribute to consider when searching for a suitable sound level meter is its type or class. The type or class of a sound level meter defines the device's accuracy as per American National Standards Institute (ANSI) or International Electrotechnical Commission (IEC) guidelines. Typically, "type" is the grade according to the ANSI S1.4 standard, whereas "class" is the grade according to the IEC 61672 standard. There are two types or classes assigned to sound level meters: type 1 / class 1 or type 2 / class 2. For assessing noise in basic industrial, commercial, educational, recreational or residential applications, a type 2 / class 2 sound level meter usually will suffice. For precision-grade assessments often made in a laboratory, a type 1 / class 1 sound level meter primarily is used. PCE sound level meter products are lightweight, easy-to-use and manufactured in accordance with the highest industrial standards.
-
Product
Sound Level Meter
-
Maschinenbau Haldenwang GmbH & Co. KG.
Ideal sound level measuring device for almost every acoustical environment.
-
Product
Wafer Analysis Systems
Tropel®
-
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
