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PCI Express 5.0 and Compute Express Link Protocol Exerciser
Summit Z516
The Summit Z516 is a PCIe 5.0 and CXL protocol traffic generation test tool used for critical test and verification intended to assist engineers in developing and improving the reliability of their systems. The Summit Z516 can emulate PCI Express 5.0 and CXL root complexes or device endpoints, allowing new designs to be tested against corner case issues.
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Compute Express Link (CXL)
Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyzer
Summit T516
The Summit T516 is targeted at high-speed PCI Express 5.0 and CXL I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.
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PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyze
Your product description goes here.
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PXIe-8381, x8, MXI-Express Interface, PXI Remote Control Module
782362-01
PXIe, x8, MXI-Express Interface, PXI Remote Control Module—The PXIe‑8381 allows you to control PXI and CompactPCI systems from your PC using a fully transparent MXI‑Express link. It is installed in a PXI chassis and uses a PCI Express‑to‑PCI bridge to interface with an installed PCIe‑8381 through a copper, x1 MXI‑Express cable.
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PXIe-8399, Gen 3, x16, 2-Port PXI Remote Control Module
784180-01
PXIe, Gen 3, x16, 2-Port PXI Remote Control Module—The PXIe-8399 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8399 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection. An additional port allows daisy-chaining for multi-chassis configurations.
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PXIe System Module: Single Port (x8), Gen 3
M9022A
The M9022A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The module can also be used with an M9037A PXIe embedded controller to interconnect two chassis in a multi-chassis system.
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PXIe High Performance System Module: Dual Port (x16), Gen 3
M9023A
The M9023A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The M9023A has a flexible configuration capability. Each card has two Gen 3 x8 PCIe cable links capable of achieving speeds up to 8 GB/s on each port. These two ports can be combined into a single x16 cable link providing a speed of up to 16 GB/s. This means a data-intensive system can be built using high-performance desktop or rack-mounted computers.
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Embedded MIL-STD-1553 PCI Express Mini Card
AMEE1553-x
The AMEE1553-x is AIM’s new PCI Express Mini Card module targeted for embedded MIL-STD-1553B applications in an ultra-compact form factor.
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COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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COM-HPC Server Type Modules
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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6x 3U OpenVPX MOSA Mission Computer
SIU36-MCVARM-01
SIU36-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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PICMG 1.3 Full-Size SBC With 14/13/12th Gen Intel® Core™ Processors And Intel® Q670E Chipset
NuPRO-E47
The NuPRO-E47 is a high-performance embedded single board computer that features with 14/13/12th Gen Intel® Core™ i7/i5/i3 processor and an Intel® Q670E Express chipset, which supports PCIe Gen 3. It comes equipped with 2 DIMM sockets that can support up to 64GB of Non-ECC DDR5 memory running at 4800MHz. The NuPRO-E47 also includes 6 SATA 3.0 ports with RAID support and 4 COM ports (including RS-232/422/485) for increased connectivity options. Additionally, the NuPRO-E47 supports Intel® PCIe bifurcation, allowing for flexible and efficient use of PCIe lanes. This single board computer is designed for use in a variety of industrial applications that require high-performance computing and reliable connectivity
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COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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PXIe-8398, Gen 3, x16 PXI Remote Control Module
784178-01
PXIe, Gen 3, x16 PXI Remote Control Module—The PXIe-8398 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8398 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection.
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Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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4x 3U OpenVPX MOSA Flight Control Computer
SIU34-FCCVARM-01
SIU34-FCCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Flight Control Computer (FCC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
