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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Parallel Memory Test Solution
Magnum2
Teradyne’s Magnum 2 test system delivers high throughput and high parallel test efficiency for high performance non-volatile memories, static RAM memories and logic devices.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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NI Automated Test Software Suite
The NI Automated Test Software Suite features all three NI IDEs and NI's most popular application software and add-ons specifically for building your automated test system with confidence. This package offers the power of LabVIEW, LabWindows/CVI, and Measurement Studio combined with the TestStand ready-to-run, test executive and the Switch Executive intelligent switch management application
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Test Workflow Pro
Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
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Test Instruments
Test instrumentation from COTS to custom, including VXI, PXI and LXI-based platforms.
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NI Vehicle Radar Test System
VRTS provides automated radar measurement and obstacle simulation capabilities for 76 to 81 GHz automotive radar systems. With VRTS, you can perform precision RF measurements and simulate a wide range of test scenarios for radar hardware and software subsystems, including sensors, advanced driver assistance systems (ADAS), and embedded software. Use VRTS for all phases, from design to manufacturing, of ADAS and radar system test.
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EV Power Components End of Line Test Platform
Test and Validate all EV Power Electronics with One Flexible and Scalable Solution
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Audio and Acoustic Functional Test Solution
With the growing popularity of Internet of Things devices worldwide, many electrical products are adopting voice commands as their user interface. This means that acoustic and audio test challenges are likely to impact more products than ever before. Test teams must meet extended test coverage requirements to ensure product quality while maintaining throughput and operational efficiency. For a solution to meet these sorts of demands, it must:
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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W-CDMA/HSPA+ Analysis Using NI PXI RF Test Instruments
RFmx W-CDMA/HSPA+
The NI-RFmx W-CDMA personality is a highly optimized API for performing physical layer measurements on W-CDMA cellular standard signals. NI-RFmx W-CDMA is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development efforts.
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SoC Test Systems
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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NI's Electrical Functional Test Solution
PXI instrumentation ensures complete and accurate test coverage with a modular architecture mounted in ultra-reliable PXI chassis.TestStand and LabVIEW software provide rapid development of complex test steps and sequences. PXI systems conserve floorspace because of their small, light form factor. Order them preassembled and installed using NI ATE Core Configurations.SystemLink™ software deploys updates and democratizes data insights to optimize operational efficiency.