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THT AOI
Mek THT AOI overcomes these challenges of automated through-hole inspection with a unique combination of mechanical, optical and software design alternatives, unavailable in many conventional systems.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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4-Channel High Speed Position Comparison and Trigger Module
ECAT-TRG4
The ECAT-TRG4 is EtherCAT slave module with high-speed position comparison trigger and encoder single redriver function, helping machine and equipment builders to use multiple triggers simultaneously for AOI, glue dispensing, display tests, and storage assembly applications.
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Inline AOI Machine
Sherlock-300I
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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SCANNER BASED IN-LINE & DESKTOP AOI
SS15000-PAL & SS15000-IL
AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with these being entered to a Model training phase. The second algorithm group is for solder and lead inspection and offers the ability to use the optimum algorithm for the type of inspection to be carried out. In addition the solder inspection and lead inspection can be attached to a package type rather than component type to assist in programming.
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Inspection of Glue Dot Assembly
ScanINSPECT's ADI
ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Conformal Coating Inspection (CI AOI)
They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solar Cell Frontside Printing and Surface Defect Inspector
7212-HS
Chroma 7212-HS is a linescan AOI inspector used to provide superior PV cells defect inspection. As the fine grid printing process goes even faster than before, a reliable printing quality inspector is inevitable to reduce the cost during the PV cells metallization.
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3D Automated Optical Inspection Systems
New 3Di Series
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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4-Channel Motion Control and High-Speed Trigger and Module for the Bridge Connected to EtherCAT
ECAT-4XMO
The ECAT-4XMO is EtherCAT slave module with high-speed position comparison trigger and encoder single redriver function, helping machine and equipment builders to use multiple triggers simultaneously for AOI, glue dispensing, display tests, and storage assembly applications. Additionally, the ECAT-4XMO has 4-axis motion control with bridge function between EtherCAT and non-EtherCAT. Advanced motion control functions help machine and equipment builders to increase their motor selection portfolio, like leaner, step, servo, direct drive, and AC motors, making it ideal for a variety of automation industry applications.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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2-port/4-port PCI Express GigE Frame Grabber Card
AX92320
The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.
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AOI Handlings System
The AOI handling system is a compact facility with various test units. Via an ionization cleaning station the ceramics are transferred to the contacting station. There, the resistance values of the substrates are tested with a rigid needle adapter. Afterward, the ceramics are further conveyed to the three (optionally four) AOI test stations (for automatic optical inspection) and are tested for cracks, unevenness, faulty imprints, contamination, etc. The poorly evaluated ceramics arrive at a review station where the operator can assess and evaluate the errors on the monitor. If the operator is uncertain about a fault, the ceramic in question can be positioned under the microscope position and inspected by eye. Poorly defined ceramics are marked accordingly with an ink pen.
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3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Bottom-up and Top-down 3D Modular AOI
SpectorBOX
With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Optical Inspection
3D AOI
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Industry-Standard, Automated Precision Inspection Systems
Circuit AOI 4.0
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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Compact IPC
Designed to function as the intelligent edge for manufacturing equipment, IPC-seires is an ultra-compact modular system equipped with 2/4 PCIe/PCI slots for integrating diverse add-on cards, such as I/O cards, motion cards, vision cards, and GPU cards to support machine control and vision applications, or provide artificial intelligence for automated optical inspection (AOI) operations.
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2-Phase Stepper Drives Based On EtherCAT Field Bus
Nu-Step DA Series
The ADLINK Nu-Step DA Series is a stepper driver based on the EtherCAT bus featuring a 32-bit ARM processor and advanced variable current and frequency conversion technology. The driver generates less heat and motor vibration for more stable operation. It not only supports the standard EtherCAT specification, but also supports table comparison triggers for automated optical inspection (AOI) and linear comparison triggers for line scanning.
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Automated Optical Inspection
AV871 Series
The AV871 Series of AOI solutions from ASC International builds upon the industry leading AV862 Series with the addition of a larger platform to manage oversized boards. Accepting boards as large as 22" x 26", the AV871 Series meets the needs of those companies requiring large board capacity.
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
