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2D
two dimensions.
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Laser Microgage
2D
The Microgage 2D laser alignment tool can be adapted to a wide variety of industrial measuring and alignment requirements. Each receiver measures in two axial directions (X & Y) and can be used for checking straightness, flatness, parallelism, squareness, bores, spindles, and other alignment needs.
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Sensors
2D Fiber Probe
Smallest and most accurate probe for 2D evaluations world-wideMechanical fiber sensor with optical evaluation from image processorTransmitted light and self illumination modeLowest contact force of 1 µNSphere diameters down to 25 µmControl and evaluation software for fully automatic measurements
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PCB Systems Vibration and Acceleration Simulation Solution
Xpedition
As the industry’s market share leader in PCB design software, the Mentor Graphics® Xpedition product augments mechanical analysis and physical testing by introducing virtual accelerated lifecycle testing much earlier in the design process. This is the industry’s first PCB-design-specific vibration and acceleration simulation solution targeting products where harsh environments can compromise product performance and reliability, including the military, aerospace, automotive and industrial markets. Traditional, physical HALT (highly accelerated lifecycle testing) is conducted just before volume manufacturing, and requires expert technicians, which can result in costly schedule delays. Bridging mechanical and electronic design disciplines, the Xpedition product provides vibration simulation significantly faster than any existing method. This results in increased test coverage and shortened design cycles to ensure product reliability and faster time to market. The Xpedition component modeling library is the most extensive in the industry, comprised of over 4,000 unique 3D solid models which are used to create highly defined parts for simulation. The 3D library allows users to easily match geometries to their 2D cell database. Designers can assemble the parts models on board and automatically mesh them for performance analysis, including stiffeners and mechanical parts. The system modeling tool is ultra-fast since it can model over 1,000 components per minute.
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Display Processors For Automotive
Designed for OEM Automotive applications, Renesas' highly integrated AEC-Q100 qualified automotive display processor ICs include an analog video decoder, high quality H/V scaler, 2D de-interlacer, and embedded timing controllers.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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2D CMOS Image Sensors
Emerald 67M
Extreme Precision for Enhanced Manufacturing Yield and Long Distance Identification - 67 Megapixels delivers 8k of resolution on each side - Comprehensive ROI features, enable more objects to be captured in a single high resolution shot - High sensitivity with ultra low-noise performance for powerful identification.
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NIR Hyperspectral Imaging
Specim
Push broom imaging is a technique that enables acquiring hyperspectral images or hyperspectral imaging. Each pixel of the image will thus contain an NIR or visible spectrum. This technology uses one dimension of a 2D sensor for measuring a line of the sample (x dimension).
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PC Edition Ynit
RH-2000
"RH-2000" is a digital microscope which can evolve and customize. 2D Measurement, 3D Measurement, and Tilting. "RH-2000" enables you to make a high performance observation and analysis.
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MXI Computerized Tomography (CT) Option
The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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IR Linear and 2D Sensor Array Modules
Excelitas offers Linear and 2D IR Imager Arrays based upon our Thermopile Technology. All Arrays are provided as plug-and-play Modules featuring a sensing chip, robust metal housing with focusing lens, a PCB with microprocessor for calibration and bus interface and a quick connector for streamlined plug-and-play integration. We offer 8-pixel, 16-pixel and 32-pixel Linear IR Imager Array Modules for field-proven effectiveness in scanning presence detection, non-contact temperature measurement, smart-home products, and office electronics. Custom solutions also available upon request.
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Laser Scan Heads
Aerotech supplies high-performance 2D, 3D and 5D laser scan heads to meet a diverse range of precision manufacturing challenges. Choose from standard options or leverage our expertise in designing laser manufacturing systems.
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Confocal Raman Microscope
LabRAM HR Evolution
The LabRAM HR Evolution Raman microscopes are ideally suited for both micro and macro measurements, and offer advanced confocal imaging capabilities in 2D and 3D. The true confocal Raman microscope enables the most detailed images and analyses to be obtained with speed and confidence. With guaranteed high performance and intuitive simplicity, the LabRAM HR Evolution is the ultimate instrument for Raman spectroscopy. They are widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods.
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Universal Offline AXI Systems
AXI XT-6 Series
The XT-series provides the advanced inspection capability of Nordson TEST & INSPECTION's inline system in a smaller footprint manual load/island of automation system. The platforms are designed for flexibility and ease of use for a wide variety of products requiring 2D and 2.5D automated X-ray inspection. The XT-6/XT-6A platform is a highly flexible automated X-ray inspection system with minimum footprint and a parallel-kinematic Hexaglide manipulation unit for extreme-angle off-axis image acquisition with high resolution. It is suitable for high-quality X-ray analysis of electronic assemblies and material analysis of parts that require flexible part manipulation with multiple inspection angles. For batch modes and volume inspection the XT-6 can be equipped with a single-sided conveyor setup and magazine load/unload station (XT-6A).
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Manual Vision Measuring System
Manual Vision Measuring MachineQS-LAF/B QS-LZB QS-EB Series. 2-D Manual Type Vision Measuring MachineQuick Image
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Coordinate Measuring Machines
FlatScope
Perfect for the measurement of larger 2D profiles (e.g.),films, circuit boards, laser cut and stamped parts large and smallMachine design with the image processing sensor under the glass plate, eliminates time-consuming focusing as the workpiece is always in the correct distance to the opticsIn raster scanning mode the machine also quickly captures the selected measurement range completelyAll geometric features are then evaluated automatically in the imageQuick dimensional measurements in the scanned image and automatic gaging with ToleranceFit® comparisons
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Software Development Kit for 2D Imaging Sonar
Sonar Software Development Kit (SDK)
Teledyne BlueView offers a software development kit (SDK) for its 2D Imaging Sonar to enable integration onto complex platforms and/or customized systems for OEMs and vehicle manufactures. The SDK enables control of the sonar, and provides access to the raw data files to facilitate sonar operation and data flow-through.
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Antenna Measurement Software
Raymond RF's Antenna Measurement Software performs 2-D (polar/rectangular) and 3-D (spherical) antenna pattern measurements for passive antennas and active wireless mobile stations (cell phones). Insertion loss of passive devices is included as part of the calibration component. Data management and reporting of antenna properties such as half power beam-width, directivity, gain, radiation efficiency, total radiated power, and total isotropic sensitivity. AMS performs and reports all measurements required by the CTIA Over-the-Air Performance Test Plan.
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Horizontal Profile Projector
Sinowon Innovation Metrology Manufacture Ltd.
◆ The lifting system adopts cross roller rail and precision screw drive, which makes lifting drive more comfortable and stable;◆ Coating process reflector, clearer image and great dustproof;◆ Adjustable contour and surface illumination, to meet with difference workpiece demand;◆ Imported high light and long using life LED illumination ,to ensure precision measurement demand;◆ High resolution optical system with clear image and magnification error is less than 0.08%;◆ Powerful Bi-axial fan cooling system，highly increase using life;◆ Powerful and colorful DRO DP400，realized fast and accurate 2D Measurement;◆ Built-in Mini-printer, can print and save data;◆ With standard 10X objective, optional 5X,20X，50X，100X objective，rotary table, foot switch ,clamp, etc.
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Solid Optical 3D Measurement Instrument
IF-SensorR25
The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Micro-ohmmeters
MMR-650
Designed to measure very low resistances of both resistive and inductive types of objects, including amorphous core transformers. This product is made to be used in power plants, railways and maintenance companies, to measure welded and soldered connections, equipotential bondings, earthing conductors, contacts, bolted connections, windings of motors and power transformers and other resistive and inductive objects. MMR-650 can be also utilized on a production lines (eg. at the final production control stage). An innovative combination of a high-performance measuring device with a modern user interface and advanced data management system. Wireless data transmission, enhanced system of 2D codes and ability to print labels to identify test items, all contribute to bringing new quality of work and allow the user to perform a wide range of measurements.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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RTX
ROM-3420
ROM-3420 RTX2.0 module integrates an ARM Cortex A9 Dual 1 GHz NXP i.MX6 series ultra low power SoC and I/O solution with Linux. NXP i.MX6 supports 2D, 3D graphics acceleration, and a full HD 1080P video decoding encoding hardware engine. ROM-3420 supports 5V~24V wide range power inputs and a wide temperature design for industrial applications.
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Height Gauges
V7
This Height Gauge 2D combine technological innovation and tradition. With their touch-display and lateral insert holders, the V7 rank as universal instruments for the workshop.
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High-speed Dual-channel 2D GPR
CrossOver
First dual-channel RTS (Real-Time Sampling technology) antenna. The dual-channel configuration provides you with both low and high frequency bands in one package, making it possible to cover a broad range of applications with only one instrument. RTS-based GPR antenna designs have already proven their effectiveness against conventional designs in relation to performance improvements (increased dynamic range, sensitivity, and depth penetration).
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Image-Based Code Readers
Versatile, high-performance, straightforwardImage-based code readers provide flexibility, high performance, convenience and simplicity. Even at fast conveyor speeds, SICK image code readers can reliably detect and evaluate 1D, 2D, DPM (direct part marking), and partially damaged codes. These readers identify markings on nearly any surface, including metal, glass, plastic or paper. Plus, different models, interfaces, and networking capabilities provide application flexibility.
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Fiber Optic Sensing Instrument
RTS125+
The fully ruggedized RTS125+ fiber optic sensing instrument was created in partnership with NASA to support the test and validation of their new vehicles. It delivers the most reliable measurements for structural testing, design optimization, structural health monitoring, thermal mapping and 2D shape sensing.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Full Bundle
Cost effective bundle of eVision 2D librariesIncludes EasyImage, EasyGauge, EasyFind, EasyMatch, EasyObject, EasyColor, EasyOCR, EasyOCR2, EasyBarCode, EasyMatrixCode and EasyQRCodeDoes not include 3D and Deep Learning libraries
