SIP
Session Initiation Protocol, Standard Interchange Protocol
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Product
Built-in MOSFET Integrated SiP
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Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
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Product
High Voltage Mini-SIL / SIP Reed Relays
Series 131
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The Pickering Series 131 is a new range of very small Single-In-Line reed relays intended for voltages very much higher than standard small SIL relays. The vacuumed, sputtered ruthenium reed switches have a superb low level performance also, which makes them an ideal choice where a wide range of signals are involved.
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
Single-in-Line (SIL / SIP) Reed Relays
Reed Relay
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications.
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Product
SDIO SiP module
SX-SDPAC
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The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 5.0+HS “Smart Ready” SDIO SiP module specifically designed for low cost high volume embedded applications.
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Product
High-density Power Drivers
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Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
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Product
DC toDC Converters
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Low Cost Single Dual and Triple outputs Isolated Outputs Low Ripple, Regulated Outputs Standard packages and pin outs Custom Designs availableNew Miniature V3 Series features HighVoltage Isolation, SIP and DIP packages
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Product
Modules
1x9 BIDI Transceiver Modules
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The module supplies best solution of short-haul 20 km for fiber optical system and link distance. The module with the Differential PECL of 3.3 or 5 Voltage and provide the system designer with products to implement a range of ATM (Asynchronous Transfer Mode) and SONET for Telecommunication. The module was all supplied in the new industry standard 1x9 SIP package style with a Bi-directional BIDI SC ST or FC connector interface.
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Ascom IP-DECT
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Ascom IP-DECT combines Voice over IP with Digitally Enhanced Cordless Telephony (DECT) technology. Ascom IP-DECT a reliable wireless communication solution that offers enterprise-grade telephony, professional messaging, personal alarm, and positioning over secure dedicated frequency bands. It is developed based on open standards, such as SIP, which maximizes interoperability with leading vendors.
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Product
SIP-90-5 Test System Interface Probe
SIP-90-5
ICT/FCT Probe
Overall Length (mil): 1,000Overall Length (mm): 25.40Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
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Product
UDP Test Tool, Flood Generator, VoIP Readiness Test Tool
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The Multiprotocol Network Tester is a freeware, open source tool which enables you to measure quality of your IP network. It can also be used to generate UDP flood or to simulate UDP DoS attack. SIP call is usually established using a SIP session with a bidirectional RTP stream. SIP and RTP protocols are based on UDP transport protocol. UDP uses a simple transmission model without implicit reliability, ordering and data integrity. Each single UDP packet is transferred independently. The quality of a SIP call depends on delays and loss of IP packets in a network. Long delays lead to large RTP jitter and bad sound quality of a SIP call.
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Product
Home Automation
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PLANET’s Home Automation product lines include home automation control gateway, IP intercoms and Z-Wave devices. Compliant with international standard protocols including Z-Wave Plus, Power over Ethernet, SIP 2.0 for Voice over IP and H.264 video codec for IP surveillance standards, PLANET’s home automation products create a safe and energy-efficient environment for modern homes and SMBs.
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Product
Enterprise Session Border Controller
eSBC
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Session Initiation Protocol (SIP) is the communication technology employed to set up and tear down VoIP phone calls
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Product
Signal Chain µModule Receivers
µModule®
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Analog Devices µModule® (micromodule) receivers consist of high performance, high speed ADCs with fixed-gain, high speed amplifiers and antialias filters. Our integrated ADC and driver products include integrated bypass capacitance and simplify the high frequency layout required to preserve ac performance. The board space savings are significant for instrumentation applications such as spectrum analyzers, oscilloscopes ,and communications test equipment, or for communications applications such as high sensitivity receivers, software-defined radio (SDR), or signal intelligence receivers. Our portfolio uses system-in-package (SiP) technology similar to multichip modules (MCM) to integrate components with different technologies, along with passive components to make an integrated subsystem.
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Product
Hamburg Wheel-Tracking Tester
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The Hamburg Wheel-Tracking Tester is used to test submerged, compacted Hot Mix or Warm Mix Asphalt specimens as per standard.The device consists of a reciprocating wheel that is rolled over the specimens while measuring the rate of permanent deformation. A constant load of 705 N ±4.5 N is applied to the specimens with a sinusoidal wheel speed of 1 ft/sec in a constant temperature controlled water bath up to 70 °C (± 1.0 °C). An LVDT jig is used for continuous measurement of permanent deformation along the path of the rolling wheel. Accommodates cylindrical or slab specimensSoftware for automatic determination of Stripping inflection PointNumber of passes to SIP, number of passes to failure and other calculated parametersStainless steel construction with temperature controlled water bath up to 70ºC
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Product
AC/DC - On-board Converter Module
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Mornsun Guangzhou Science & Technology
Mornsun AC/DC On-board Converter, one of the best-selling AC to DC converter power supplies, has a good market in the wholesale of AC to DC converter modules. On-board AC to DC converter modules are more frequently used in emerging applications. MORNSUN is expanding and enhancing its portfolio of board mount AC to DC converters to provide customers with a diverse selection of AC/DC converter module power supply in terms of package configurations (SIP, DIP, open-frame, chassis mount, etc.), input/output voltage options and multiple protections. These PCB mount AC to DC power converter modules cover power levels from 1W to 1000W, featuring compact size, standard or extra wide input voltage range, wide operating temperature range, high reliability, etc. Perfectly meet your design requirements for AC to DC converter power supply modules in different industrial applications.
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Product
Sanitary Pressure Transmitter
681
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The Series 681 Sanitary Pressure Transmitter is designed to meet 3A standards for applications in food, dairy, beverage and pharmaceutical processing, liquid level control, and sanitary pipelines. The unit is fully sealed to withstand high pressure washdown in Clean-in-Place (CIP) and Sterilize-in-Place (SIP) installations.
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Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
Test And Product Engineering Services
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Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
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Product
Absorption Probe
ASD25-N
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ASD25-N probe for direct installation into bioreactors, pipelines and vessels measuring absorption, cell growth and optical density of various liquid samples under sanitary process environments. The probe is suited for Sterilization In Place (SIP) / and Clean In Place (CIP) procedures.
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Product
GL Products Online & Interactive Demos
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*NetSurveyorWeb™ is a centralized VoIP network monitoring system. A number of GL's PacketScan™ probes and/or,PacketProbes™ are deployed in remote locations across the network to passively monitor VoIP traffic. Whenever a monitored call completes, the scan/probe calculates a variety of quality metrics (MOS, loss, delay, jitter, etc) and sends the metrics to the central Oracle database for storage.**The PacketScan™ is a feature-robust Windows® based software tool that captures and monitors live IP traffic. In the VoIP world, it can monitor and measure SIP, H323, Megaco, MGCP, T.38 and video calls. In addition to quality metricsPacketScan™ also captures signaling information and sends that to the NetSurveyorWeb™ database as well.**GL's PacketProbe™ is an advanced CPE(Customer Premises Equipment) based VoIP monitoring reporting and diagnostic appliance, stemming from GL's suite of market leading voice analysis tools.
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Product
Single-in-Line Reed Relays from Pickering Electronics
SIL / SIP
Reed Relay
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 119 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications. Features include:
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Product
SIP-90-4 Test System Interface Probe
SIP-90-4
ICT/FCT Probe
Overall Length (mil): 693Overall Length (mm): 17.60Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
Digital Matrix Intercom System
Gemini
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A system that interfaces with existing communication assets such as SIP telephones.A way to reduce costs for linking remote sites by using standard IP infrastructure.An intercom system that operates over LAN or WAN or Internet.Works on any terrestrial or satellite-based network.Virtual and hardware operator panels to configure and manage each unit.Private one-to-one, group and conference calls with the ability to manage simple to complex conference and private conversations simply and quickly.Interfaces for telephony, 4 wire, and other audio devices such as Radio base station or Presenter systems.Sophisticated SIP integration for modern telephony interconnection options.Camera Mix interfaces for 6 cameras to/from Engineering and Production.
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Product
Single-in-Line (SIL / SIP) Reed Relays From Pickering Electronics
Reed Relay
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding application
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Product
Energy Equipment
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Atec, Inc. has been designing and manufacturing instruments for energy exploration for over 50 years. We apply the same meticulous approach in providing failsafe equipment for downhole energy exploration as we do in our aerospace projects. Our corporate energy ancestry includes CATCO, SIP, Lymco Electronics, Kestran, Amtex Supply, Coastline Exploration, Coltex Drilling, and Atec Resources. Atec subsidiaries – Vital Link (Sealy, TX), Celtech (Carlsbad, NM), and Hager Machine & Tool (North Houston) – all bring extensive additional capabilities to our oil patch support operations.
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Product
SIP-90-2 Test System Interface Probe
SIP-90-2
ICT/FCT Probe
Overall Length (mil): 700Overall Length (mm): 17.78Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
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Product
Media Gateway
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A Media Gateway is a networking device that provides valuable and essential functions for organizations, service providers, and network operators. When interconnecting traditional time-division-multiplexed (TDM) telephony systems with modern voice-over-internet protocol (VoIP) systems, a VoIP media gateway works by providing protocol conversion (translation) and interoperability between the two network technologies. Also known as an IP media gateway or SIP media gateway, the device converts a traditional analog plain-old-telephone-system (POTS) voice signal or related digital telephony signals such as T1, DS3, STM1 or OC3 into packets for transmission over a data network such as the Internet, private IP Network or a corporate LAN. When the legacy system is based on digital integrated services digital network (ISDN) technology, the device may be called a digital VoIP gateway or ISDN media gateway. Some manufacturers combine gateway functionality with WAN-access (internet-access) capability into a single device or network appliance. Such a dual-purpose device may be known as an access media gateway.
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Product
IMS-SIP Network Emulator Software
E6966B
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Wireless telephony networks are increasing capacity for high throughput Internet Protocol (IP) packed-data by utilizing radio access technologies such as LTE and HSPA. Session Initiation Protocol (SIP) and IP Multimedia Subsystem (IMS) are progressively being adopted as part of the network infrastructure to carry traditional wireless telephony services over an all-IP network. SIP provides control of communication sessions whilst IMS is the framework that allows delivery of multimedia services over IP. With this new capability comes the need for developers and operators to move their focus to testing user equipment (UE) in this new network environment.
