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3D
three dimensions.
- Artec 3D
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3D Scanner
Artec Eva Lite
Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
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3D Audio Servers
GoldSeries
AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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3D Design
Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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Sensor for High-End Applications
ARAMIS SRX
The new ARAMIS SRX is a 3D measurement system for dynamic evaluation of 3D coordinates, 3D displacement and surface strain. It comprises the latest camera technology including 12-megapixel cameras. Capturing up to 2000 images per second, the sensor is especially designed for rapid testing applications. It comes with an additional setup for crash applications providing an image acquisition rate of 1000 images per second in HD format. With the combination of high resolution and high speed, the ARAMIS SRX sensor is perfectly suited to high-end applications. The sensor is designed for high stability, process reliability and user-friendliness, which is why it is primarily used in industrial environments and applications.
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Geospatial services
Siradel develops advanced solutions that turn data into powerful decision-making tools with our innovative approach that combines advanced mapping, AI-driven analysis, and 3D modeling.From in-depth analysis to strategic planning and optimization, we help you visualize, interpret, and maximize the value of your data—empowering smarter, more efficient project execution.
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3D Scanning Reverse Engineering Services
Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Metrological Software
InnovMetric PolyWorks
Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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Industrial Computed Tomography
TomoScope® L
High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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RZ Family of 64-Bit & 32-Bit Arm-Based High-End MPUs
RZ/G
RZ/G Series MPUs extends the capabilities of RZ/A Series to deliver high-end performance for graphics, multi-stream video, and embedded vision thanks to features like camera input, 3D graphics accelerators, Full HD video codec, and GbE. Renesas also offers the RZ/G Linux platform, which is a user-friendly software development environment for customers who wish to lower the barriers and cost of Linux adoption and maintenance. The RZ/G Linux Platform enables super-long-term Civil Infrastructure (CIP) Linux support in an industrial grade verified Linux package, which complements Renesas’ high quality silicon.
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Visual Analysis Tool for GNSS Receiver Data
Panorama
Panorama is the flagship tool when it comes to analyzing receiver data. When engineers use Panorama they spend more time looking at plots and making decisions, instead of making plots and writing reports. Panorama takes receiver data (.csv files) from PANACEA and RxStudio (other ODS products) and turns it into over 60 engineering plots ready to view at the click of your mouse. These plots give engineers and analysts the ability to view summary level data, head to head comparisons, receiver specific results, and 3D LLA replays using STK.
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Sapphire 3D Microscope
WDI-2000
The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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Measurement Systems
MicroMeasure3D
Sciences et Techniques Industrielles de la Lumière
STIL MicroMeasure3D, PORTICO3D and MAESTRO3D are measurement systems designed to achieve true 3D metrology of each point for the most demanding applications adapted to Industry 4.0 standards.
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3D And 2D Visualization Software
3DViz
The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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SMARC
ROM-5780 B1
Advantech ROM-5780 B1 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3399 SOC which includes dual-core Arm Cortex-A72 and quad-core Arm Cortex-A53 processors and Arm Mali-T860MP4 3D graphics engine. It provides rich display interface: HDMI 4K@60Hz, eDP and LVDS to meet different requirement. It also features USB3.0, PCIe 2.0, SATA, Gigabit Ethernet, MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
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Stylus Profilometers
Tencor™
KLA Instruments™ Alpha-Step®, Tencor P- and HRP®-series stylus profilometers deliver high-precision, 2D and 3D surface metrology, measuring step height, surface roughness, bow and stress with industry-leading stability and reliability for your R&D and production requirements.
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Inspection System
Pixie
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Confocal Raman Microscope
LabRAM HR Evolution
The LabRAM HR Evolution Raman microscopes are ideally suited for both micro and macro measurements, and offer advanced confocal imaging capabilities in 2D and 3D. The true confocal Raman microscope enables the most detailed images and analyses to be obtained with speed and confidence. With guaranteed high performance and intuitive simplicity, the LabRAM HR Evolution is the ultimate instrument for Raman spectroscopy. They are widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods.
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Solid Optical 3D Measurement Instrument
IF-SensorR25
The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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Laser Scanners
RTC360ScannersDelivering outstanding range, speed and highest quality 3D data, Leica Geosystems laser scanners are the perfect partner for any tasks in 3D laser scanning.
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3/4D Image Visualization and Analysis Software
Imaris
Our latest release, Imaris 8.4, introduces a new and innovative approach to tracing neuron structures in 3D images. Torch™, a patent-pending tool which intuitively highlights structures in close proximity to the cursor while darkening the rest of the image, enables users to efficiently and accurately trace individual neurons within dense and thick samples. Improved depth visibility makes tracing in thick samples easier than ever before, allowing for the selection of a dynamic region of interest for tracing. All of this possible with terabyte-sized datasets.
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Video Signal Generator
MSHG-600 Plus
MSHG-600Plus supports a exclusive HDMI 1.4a Signal and output signal to five(5) channels. It is also built-in CEC function according to current market request. *3D video Format Support *It can be On/Off Audio Return Channel with ARC switch separately.
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AS-Interface for Hazardous Areas
*I/O modules for field applications with quick mounting technology*Airboxes for the combination of AS-i inputs and pneumatic output valves*Valve position feedback with solenoid actuation*For silo level applications in hazardous areas*Approval for zone 22, category II 3D
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PDS Slope Protection Software
A number of special features are implemented in Teledyne PDS for underwater slope protection purposes.Guidance features are used to position a work vessel and monitor the laying of slope protection material. 3D images and 3D views display all movements of the vessel, crane, and the slope protection system.
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Handheld 3D Scanner
Peel
Accurate handheld 3D scanner for fast and easy data collection. A next-generation companion to Verisurf software for digitizing/reverse engineering & high volume pointcloud inspection.
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Profiling Systems
ICK profiling systems measure, detect, classify, count, and check vehicles in 3D. They determine the number of axles on heavy goods trucks for vehicle classification and measure vehicle dimensions to rectify loading errors. The systems recognize overheated vehicles approaching tunnels and other entrances and activate diversions. They also monitor external train contours. If a limit value is exceeded, the system triggers an alarm. All this contributes to safety on roads and railroads.
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SUNTEST Family
Atlas Material Testing Solutions
SUNTEST instruments are compact material test chambers for accelerated lightfastness and weathering testing based on filtered xenon lamp technology. All SUNTEST chambers offer a horizontal test plane which is particularly useful for testing 3-D specimens. Lightfastness testing aims at testing a material under solar radiation and temperature only – Weathering testing adds water and moisture to the test.
