Product

Lo-PRO®file Collet Socket with Solder Tail Pins

Series 513

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Aries

Series 513 - Aries

LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options

Product

Replacement Solder Tip Lead Set for D410/D610

Dx10-SI

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Teledyne LeCroy

Dx10-SI - Teledyne LeCroy

- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead

Product

Pin-Line™ Collet Socket with Solder Tail Pins

Series 0513

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Aries

Series 0513 - Aries

Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.

Product

3D Solder Paste Inspection Machine (3D-SPI)

3Si Series

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Saki Corporation

3Si Series - Saki Corporation

Saki's 3D SPI identifies critical defects and assists with process improvement.

Product

Solder Paste Inspection System

KY8030-3

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Koh Young Technology

KY8030-3 - Koh Young Technology

The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.

Product

Portable Strain Gage Welding and Soldering Unit

700

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Micro-Measurements

700 - Micro-Measurements

A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.

Product

Ball Pressure Test

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Premier Electrosystems

Premier Electrosystems

Premier Electrosystems' Ball Pressure Test is used to determine dimensional stability under stress at elevated temperatures. It analyses the relationship between the degree of deformation and the temperature when the test specimen is subjected to a constant load.

Product

Dual Projection 3D In-Line Solder Inspection System

KY8030-2

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Koh Young Technology

KY8030-2 - Koh Young Technology

The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization

Product

20" Ball Bearing Slides Pair

DRS-20

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ELMA Electronic, Inc.

DRS-20 - ELMA Electronic, Inc.

20"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet

Product

Selective Wave Soldering Optical Inspection Machine

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Landrex Technologies Co., Ltd.

Landrex Technologies Co., Ltd.

Selective Wave Soldering Optical Inspection Machine

Product

GENERAL INSPECTION MACHINE AFTER SOLDER MASK

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Tester Soft Ltd.

Tester Soft Ltd.

DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.

Product

IEC60950 Ball Drop Impact Test Apparatus

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Shenzhen Chuangxin Instruments Co., Ltd.

Shenzhen Chuangxin Instruments Co., Ltd.

It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.

Product

Soldering Test

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Aero Nav Laboratories, Inc.

Aero Nav Laboratories, Inc.

The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.

Product

96-Pin 1.27mm Pitch Female Solder Pad Connector Without Backshell

C096SFX-XSP-5A

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Pickering Interfaces Inc.

C096SFX-XSP-5A - Pickering Interfaces Inc.

This connector is designed to allow users to discrete wires using solder pad connections to the 96-Pin 1.27mm pitch connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.

Product

3D Inline Solder Paste Inspection System

TROI 7700 SERIES

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Pemtron Co., Ltd

TROI 7700 SERIES - Pemtron Co., Ltd

Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.

Product

Slides (Ball & Crossed Roller)

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Del-Tron Precision, Inc.

Del-Tron Precision, Inc.

Del-Tron’s linear ball slides and linear crossed roller slides offer engineers and designers the flexibility to choose the right linear slide technology for their application. Our ball slides and crossed roller slides offer several levels of precision ranging from a straight line accuracy of 0.0005” per inch of travel in our standard precision ball slides to 0.0000040” per inch of travel straight line accuracy in our high precision ball slides and crossed roller slides.

Product

Replacement Solder Tip Leadset for Use with D420/620

Dx20-SI-HiTEMP

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Teledyne LeCroy

Dx20-SI-HiTEMP - Teledyne LeCroy

The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.

Product

3D Solder Paste Inspection system

PI Series

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Vi Technology

PI Series - Vi Technology

PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.