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- Pickering Interfaces Inc.
product
50-Pin D-Type Male Solder without Backshell
92-960-050-M
This connector is designed to allow users to directly terminate cables with soldered connections. 50-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Grypper "Y"
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Ball Pressure Tester
4710
The ball pressure tester is used to test the thermal properties of insulating materials. The test sample is placed in an oven and a steel ball is pressed against the surface. The impression of the steel ball is measured to see if it meets the requirements.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Heavy Load Ball Screw with Caged Ball Structur
HBN
Heavy Load Ball Screw with Caged Ball Structure. Heavy load ball screws with the caged ball structure (HBN model) drastically improve the rated load compared to the conventional products by utilizing the optimum internal structure for use in heavy load condition. In this model, the caged ball structure is adopted between balls to eliminate collisions and mutual frictions of the balls and improve the lubricant maintenance. This modification brings about a longer lifetime under heavy load conditions.
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Ball Pressure Test
Premier Electrosystems' Ball Pressure Test is used to determine dimensional stability under stress at elevated temperatures. It analyses the relationship between the degree of deformation and the temperature when the test specimen is subjected to a constant load.
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Ball Rebound Tester
Hildebrand Prüf- und Meßtechnik GmbH
The ball rebound tester is used to determine the resilience of foam materials in accordance with DIN EN ISO 8307 and ASTM D 3574.
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Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Ball Pressure Test Device
ZBP-T
Made up by the related item according to IEC60695, IEC884-1, GB/T5169.21-2006, GB4706.1-2005, GB2099.1-2008, etc. • R = 2.5mm Pressure: 20N • Base with thermocouple hole • Material: 304 stainless steel
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Slides (Ball & Crossed Roller)
Del-Tron’s linear ball slides and linear crossed roller slides offer engineers and designers the flexibility to choose the right linear slide technology for their application. Our ball slides and crossed roller slides offer several levels of precision ranging from a straight line accuracy of 0.0005” per inch of travel in our standard precision ball slides to 0.0000040” per inch of travel straight line accuracy in our high precision ball slides and crossed roller slides.
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Ball Pressure Test Apparatus
CX-Q03
Shenzhen Chuangxin Instruments Co., Ltd.
The Ball Pressure Apparatus is used to check the integrity of dielectric materials by exerting 20N force. The BPA10 is called out in IEC 60335, 60950, 61010, UL, CSA and European Norms. It is used to check the integrity of dielectric materials by exerting 20N force. The Ball Pressure Apparatus is made of stainless steel for long life. Since accelerated life procedures are used for this oven test, more than one apparatus may be useful for parallel testing.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Surface Mount Ball & Socket Test Point
SMOX
SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Ball Rebound Resilience Tester
UI-FT95
Ball Rebound Resilience Tester is used to test foam resilience by vertically dropping a steel ball on foam from required height.
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Socket with Bifurcated Contact Solder Tail Pins
Series 0511
Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
