BGA Inspection
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Inspection Bundle
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Cost effective bundle of eVision's inspection librariesIncludes EasyImage, EasyGauge, EasyMatch, EasyObject and EasyColor
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
STEEL PLATE INSPECTION MACHINE
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Yubain Steel Plate Inspection Machine can effectively detect steel plate problems, including pinholes, hole breaks, hole deviations, leaks, multiple holes or few holes... and other shortcomings, which can help customers efficiently inspect incoming materials and inspections in the manufacturing process. , To avoid product damage due to steel plate problems, reduce financial losses and customer complaints.
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Product
Inspection System for Die Casting
X-eye 7000BS
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Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
High-precision Surface Inspection for Wind Turbine Blades
waveCHECK™
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8tree's waveCHECK is a handheld-portable 3D-inspection tool for inspecting wind turbine blades in manufacturing and operation. Its efficient detection of surface defects and instant visual feedback revolutionize surface inspection.It can detect wrinkles, steps, gaps, rain erosion and any other surface damage.
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Product
Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
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The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Product
2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
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Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
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TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Product
X-ray inspection system for BLU, LED Long bar products
X-eye 9000LED
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X-ray Tube100kV / 200uAMin. Resolution5µmTable Size1,500mm X 500 mmDetectorFlat Panel Detector (High sensitivity)Dimension3,620(W) x 1,065(D) x 1,590(H)mm / 850kg
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Product
X-ray Inspection System
TruView Prime
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The TruView Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Prime is professionaly built - something hard to find in entry level systems in the TruView Prime's price range.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Product
Terahertz Imager for Material Inspection
T-SENSE FMI
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This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
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Product
X-Ray and CT Inspection
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Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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Product
Non-Destructive Test Resonant Inspection System
RAM-AUTO
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Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
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Product
Manual Spin Rotary Table for Optimal Circular Geometry (TIR) Inspection
TruMotion
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Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
Furnace and Electrical Inspection Camera
FLIR GF309
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The FLIR GF309 is designed for high temperature industrial furnace applications. These infrared cameras are ideal for monitoring all types of furnaces, heaters, and boilers, particularly in the chemical, petrochemical, and utility industries. Custom-built to see through flames, the FLIR GF309 also features a detachable heat shield designed to reflect heat away from the camera and camera operator, providing increased protection.
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Product
Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Product
Solar Power Plant Inspection Service
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We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Product
In-line Inspection And Integrity Services
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The safety, integrity, and operating efficiency of your assets are at the core of what we do. Baker Hughes Process & Pipeline Services (PPS) unique portfolio of services helps you confidently manage the lifecycle of your pipeline—delivering timely and stress-free startup, supporting day-to-day reliability, and enabling controlled decommissioning.
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Product
Offshore Inline Inspection
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Data quality and first-run success represent the founding principles of NDT Global. By providing highly accurate results, in the first instance, our customers can have confidence in the inspection data to make fully informed decisions on future interventions - be that extending the inspection interval or making required repairs while, at the same time, also limit the requirement for costly verification's. Our latest generation of tools represent a step change in pipeline inspection accuracy and can significantly reduce overall project cost.
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Product
Articulating Inspection Cameras
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Articulating Inspection Cameras with probes whose tips can be precisely turned (articulated) by the user up to 150 in two directions. Articulation enables inspection of targets located off-axis (even "behind" the probe) or in a tight space without removing the probe. The Inspection Cameras currently offered include the DCS16HPART, its wireless cousin the DCS18HPART, and the DCS665-ART Articulating Inspection Cameras.
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Product
PWB Visual Inspection Machine (AOI/SPI)
RV-2
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PWB size: 50mm×50mm - 410mm×360mm 630mm×360mm（longer sized PWB)*. Item of inspection: Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*
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Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
