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- Virginia Panel Corporation
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Tool, Inspection Depth Gauge, Micro Coax, Receiver
910121179
Tool, Inspection Depth Gauge, Micro Coax, Receiver
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Making Invisible Visible
Quadra 3
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Can Inspection
Whether they are 14oz cans, 28oz cans, 12oz bottles, or some other size or format – they typically all look fine, as they fly by on your production line or sit on pallets ready to go out to customers. The challenge is, most companies have some kind of sealing issue at some point. Tops go on crooked, lids don’t seal, vacuums don’t set right – and it’s nearly impossible to tell by physical or visual inspection.
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X-Ray Inspection
X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Dimensional Inspection
Initial Inspection Sample Reports (ISIR's)• Production Part Approval Process (PPAP)• Capability Studies• Production Surveillance• Reverse Engineering• Third Party Arbitration• Will Provide Same Day Quotation With Part and/or Print• Immediate Service Available
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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BGA Socket And BGA Adapter Systems
Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Inspection Software
At ISRA VISION / GP Solar we offer easy-to-use, time-saving software solutions to help you achieve global quality standards in PV production. We continuously develop our existing solutions, working toward a new generation of digital production monitoring and controlling.
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Thickness and Flaw Inspection
FOCUS PX / PC / SDK
Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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Vision Inspection Systems
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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Inspection Tool
AMI DF2400
Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput. The FACTS² delivers state-of-the-art, automated in-line inspection for quality and process control.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Value Inspection Cameras
General's Value Inspection Cameras offer excellent savings on certain Inspection Cameras such as the DCS280 Rugged Video Inspection System & the KT280 Professional Inspection Kit. Take a look & see if one will meet your needs.
