Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Thickness Gauges
Precision Thickness Gauge is specifically designed to quickly and accurately measure the thickness of a variety of substrates including film, paper, board, foil, tissue and textiles.Operated via an intuitive touch screen interface the instrument will allow the user to define batch size, dwell time & measuring speed.Full test statistics can be easily viewed or printed to label for easy documentation control.
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Ultrasonic Thickness Gauge
UTG-2800
State of the art, digital ultrasonic thickness gauge is packed with features typically found on high end models only. This multi-functional ultrasonic thickness gauge offers everything from basic measurement, Scanning Capabilities, Adjustable Sound Velocity, extended memory and USB output capabilities.
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Compact Passive and Active Resistor Trimming for Thick and Thin Film
LRT 2000C
*Travel: 6" x 6"*Laser : Fiber Laser Ytterbium 1064 nm*Kerf: 30 to 80 micron Adjustable*Pulse width : 80 nano second*Rap Rate: 1 to 1 million Pulse Per Second*Average Power: 20 watts
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Concrete Coating Thickness Gauge
500
The Elcometer 500 Coating Thickness Gauge accurately measures the thickness of coatings on concrete and other similar substrates* - non destructively.
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Ultrasonic Material and Coating Thickness Gauge
CMX Series
Ultrasonic Material and Coating Thickness Gauge - CMX Series is a full function ultrasonic thickness and coating gauge with a widest variety of modes and features for extra versatility.
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Ultrasonic Thickness Gauge w/A & B Scan and Thru Coating Capability
UTG-4000
Utilizing color waveform A-scan and time based B-scan for absolute correctness, this new state of the art ultrasonic thickness gauge is packed with useful features allowing users to be confident of the displayed values on the most critical of applications. This multi-functional ultrasonic thickness gauge offers everything from basic measurement, Scan mode with Min/Max viewing, GO/NO GO display, Adjustable Sound Velocity and Thru-Coating Capabilities.
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Thickness Gauges
CMX DL
The CMX DL has all the features of the CMX, plus a huge storage capacity, using multiple file structures. Select between to file formats: Sequential, with auto identifiers or, our standard alpha numeric grid format.
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Thickness Measurement Products
Our film thickness measurement products are available for every application. We stock most of the products listed below for fast delivery. Browse through them or contact one of our Application Engineers, who can immediately assist you with your film thickness measurement needs.
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High Voltage Thick Film Chip Resistors
HVTK (HVR)
*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Coating Thickness gauges.
PELT gauges provide data for the precise control of exacting coating-applications including for automotive paints, wind turbine blade protective coatings, steel coil coatings, and shipping container anti-corrosion coatings. PELT gauges measure coatings on substrates including steel, aluminum, plastics, carbon fiber, composites, glass, and wood.
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Thick Film Passive Element
GBR-403
GBR-403 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications requiring high stability and resistance.
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Flatness, Bow, Warp, Curvature, Glass Thickness
Standard Warp Measuring System
Optik Elektronik Gerätetechnik GmbH
Optical, non contact measurement of warp and bow of specimen with size up to (1600 x 1200) mm. The system is designed for the contactless, optical measurement of the curvature (Warp) horizontal, coated float glass substrates. For that measurement the heights on different measuring points is evaluated.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Thick Film Passive Element
GBR-182
GBR-182 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-182 series elements are used both for general, and professional applications.
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Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN 650 3D
Optik Elektronik Gerätetechnik GmbH
High accurate flatness & thickness measuring system for large substrates.
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Destructive Coating Thickness Gauges
Designed for measuring on a non-metallic substrate or assessing the thickness of a multi-coat paint, Elcometer offer a range of destructive coating thickness gauges such as the Elcometer 121/4 and Elcometer 141 that are portable and easy to use.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8822
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1000um- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm - Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA(UM-3)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Mechanical Coating Thickness Gauge
211
This is one of the most popular mechanical coating thickness gauges in the world.Factory calibrated - with user calibration adjustmentFoils supplied to check calibration on siteIdeal for cold surfaces and underwater useSmall and portable with an accuracy ±5%The “V” grooved base, ideal for pipeline inspectionAvailable in either Metric or Imperial versions, the Elcometer 211 measures coatings up to 6mm (250mils)
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Underwater Thickness Gauges
Cygnus have created a range of versatile underwater and subsea thickness gauges for use by divers and engineers. These measuring devices provide a simple and time-saving method of obtaining ultrasonic thickness measurements in underwater conditions.
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Radar solution for thickness measurememt of steel & metal
Our radar sensor solution determines the thickness and the thickness profile of steel plates, steel strips or steel slabs (up to 1600 °C hot) with an accuracy of up to ±10 µm on the roller conveyor. Thanks to robust radar technology, sophisticated signal processing and intelligent radar algorithms, OndoSense radar sensors achieve this high level of precision in thickness measurement even under the difficult production conditions of the steel industry with smoke, steam, dirt, vibrations, fire and extreme temperatures.
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Pile Thickness Tester
TF640
TESTEX Testing Equipment Systems Ltd.
The gauge is positioned on the carpet and six loaded needles penetrate the pile until they make contact with the denser backing. The pile surface is located by a flat probe. The pile thickness can then be read directly from the digital gauge.
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Ultrasonic Thickness Gauge
QTG Series
Ultrasonic Thickness Gauge - QTG Series are economical, user-friendly, menu driven, and multi-functional units offering extensive features from basic measurements (model: QTG I) to extended memory (5000 reading storage) and USB output capabilities (model QTG II). The instrument can measure with very high resolution (0.01 mm or 0.001 inches) the thickness of metallic and non-metallic materials such as steel, aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave conductor. The Ultrasonic Thickness Gauge - QTG Series accurately displays readings in either inches or millimeters and is equipped with special features like Automatic recognition of probes with different frequencies and Automatic zeroing of the unit.
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Coating thickness XRF Standards
We manufacture high accuracy reference standards capable of calibrating virtually any X-Ray Fluorescence (XRF) coating thickness and composition analysis system.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
