Deep Packet Inspection
check to examine data within a packet. Also known as: DPI
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Vision Inspection Systems
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We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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Product
Multibeam Echosounder - Deep Water
HydroSweep DS
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The HydroSweep DS is a deep water multiebeam echosounder ideally suited for seabed mapping in deep water up to full ocean depth based on a sonar frequency between 14 kHz to 16 kHz. Beside bathymetric depth information from 10 m to more than 11,000 m, sidescan data and backscatter data for seabed classification are acquired. The HydroSweep DS does not only gather sea floor information, but also uses adaptive bottom tracking windows to identify sonar targets in the water column and can be optionally operated as a parametric sub-bottom profiler without additional transducers and electronics.
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Ultrasonic Inspection For Industrial Preventive Maintenance
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Ultrasound consists of acoustic vibrations with a frequency too high to be perceived by the human ear. These sound waves, with frequencies exceeding 20,000 Hz , are used to monitor a wide range of industrial phenomena invisible to the naked eye.
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Open eVision Deep Learning Studio
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Ease the evaluation of Open eVision’s Deep Learning toolsDataset creation and image annotation for classification, segmentation, and object localizationCreate and configure dataset splits to decide how your images are usedManage the data augmentation transformationsTrain your tools in succession thanks to the training queueValidation and analysis of the results of the trained toolsAvailable on Windows and LinuxFree of charge
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3D X-ray hybrid inspection system
YSi-X
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Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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Non-Destructive Test Resonant Inspection Station
RAM-TEST-FIXTURE
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The NDT Test Station, Model RAM-TEST-FIXTURE Resonant Inspection System is an ideal choice for testing when repeatable manual inspections are required. The innovative Test Station allows precise control of part positioning with an adjustable table ranging up to 6.25 inches (158.75 mm) in height.
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X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Sensor for Filament Inspection
EyeFI
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EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Product
Logger Version 2-D Electro-Magnetic Current Meter for Deep Ocean
INFINITY-Deep AEMD-USB
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INFINITY-Deep is an autonomously deployable data logger for current speed measurements in the deep oceans. The currents in the deep oceans are very weak. It is too hard to accurately measure the deep water currents by some ADVs (Acoustic Doppler Velocimeters) that detect the Doppler-effect by scatter with the suspended particles in the water, because the concentration is very low.
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Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
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Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Specialist Inline Inspection
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NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
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Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
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4U Intel® Xeon® Scalable GPU Server With 4x Double-Deck PCIe Cards For Deep Learning And AI Inference.
SKY-6400
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Processor: Dual 2nd Gen Intel® Xeon® scalable processorsMemory: 12 x DDR4 2666/2933 MHz ECC RDIMM/LRDIMM / Intel Optane DC Persistent Memory, up to 2TBRemote Management: IPMI function supportExpansion: Supporting 4 * PCIe x16 double-deck card + 1* PCIe x8 single-deck FH/HL card + 1*PCIe x4 cardPSU: 2000W 1+1 redundant power supply with 80 PLUS Platinum level certificationEasy maintenance system fan: 3 x 12CM system fan with easy maintenance feature
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PosiTector Inspection Kits
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PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Packet Capture
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When problems and security breaches happen in your network, it’s already too late to start keeping records. The etherExtractor line of packet capture tools offers 0 packet loss and makes it easy to diagnose problems and analyze traffic across your network.
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Digital Inspection Probes
DI-1000
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The ergonomically designed DI-1000 is Lightel’s all digital video microscope probe. It connects directly to your PC through the computer’s USB2.0 port. Featuring easy single finger focusing, a built-in image freeze/capture button, and detectable resolution to 0.5µm, the DI-1000 package includes our free ConnectorViewTM (standard) software, providing digital zoom, image display, image capture, auto-calibration and basic analysis tools.
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Inspection + Cleaning for High Volume Manufacturing Environments
AVIT-2020
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AVIT-2020 is a fully automated system that removes human subjectivity from the entire inspect-clean cycle. With integrated cleaning and fast, robotic mechanics, operators simply press the process button, allowing them to complete a week’s worth of inspections in just a couple of hours with almost zero active operation.
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Inspection Microscope
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This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Mask Foreign Matter Inspection Device
PR-PD2HR
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Efficient foreign matter inspection and measurement with high yield.
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Thick Film Inspection
785
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For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Evolved Packet Core Commander
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A Subscription based solution for vEPC test automation. The rapid evolution of mobile networking technology is changing MNOs and NEMs requirements for EPC test automation solutions. The new solutions have to be flexible, scalable, quickly and easily deployable in a cloud, and most importantly, affordable.
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Magnetic Particle Inspection
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Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Backplane Profiling & Inspection System
603d
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A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.





























