Bump
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Product
Bump Tester
KD-163
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King Design Industrial Co., Ltd.
*Comply with IEC-68-2-29 testing specification(10g/ 16ms、15g/6ms、 40g/6ms、100g/2ms).*Easy installation and simple operation; Low noise; no maintenance required; function holds long.*Well-designed and no resonant-structure, air anti- vibration pad can effectively isolate floor vibration.*Accelerometer adopts repeated measurement and adjustable half-sine wave generator; to control the data is precise.*Magnesium alloy platform is anodized, Servo motor cam to drive, and can adjust the frequency automatically.*The adjustable acceleration value and shock domain is patent design (1ms-13ms).
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Product
Bump Test Machine
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Labtone Test Equipment Co., LTD
Bump test systems for electrical products repeating impact testing during transportation
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Product
Compact Bump Gas Solution
Eco Bump
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Teledyne Gas & Flame Detection
Importantly, bump testing is the only way to validate that gas detectors will respond to gas and trigger user alarms.Simplified configuration (no software).Measuring only 7.2” (180mm) in height (including the push button regulator), the pocket-sized EcoBump can easily be stored and transported with minimal shipping costs.With 5.5L of bump gas capacity, EcoBump provides approx. 250 bump tests from a single cylinder making it our most cost effective bump solution.
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Product
Pneumatic Bump Test Machine
KRD20 series
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The KRD20 series pneumatic bump test machine replaces the traditional mechanical cam-type crash bench and is suitable for repeated impacts on electronic components, equipment and other electrical and electronic products during transportation or working.
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Product
Cantilever Probe Card
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MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Product
Shock/Bump Test System
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HIACC Engineering & Services Pvt. Ltd.
HIACC’s Shock/Bump Test System is a specialized, automated, and high-performance testing apparatus designed to simulate the impact, shocks, and repetitive jolts that electronic components, electronic products, and packaging experience during transportation or operational use.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Structural Dynamics
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Structural Dynamics by OROS - bump tests, operating deflection shapes, modal analysis, and more
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Product
Vertical Shock/Bump Tester (Pneumatic)
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HIACC Engineering & Services Pvt. Ltd.
The pneumatic vertical shock and bump test system features an advanced design with a high degree of performance and automation. The testes is easy to use and have low maintenance requirements.
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Product
IC Test Services
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With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Product
Environmental Test Chamber
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Labtone Test Equipment Co., LTD
Environmental test system, Electro-dynamic Shaker, Shock Test Systems, Drop Tester, Bump Test Systems, Combined Environmental Test Systems
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Shock Tester
DP-1200
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King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Product
330 System
NSX
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With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Product
C-Band Separate Dispersion Compensation Raman Fiber Amplifier
DRA5228/F
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Hangzhou Huatai Optic Tech. Co., Ltd.
Raman Fiber Amplifier (RFA) utilizes the optic gain in the Stimulated Raman Scattering (SRS) in the optical fiber and realizes the amplification of the signal optic. FRA, with very low equivalent noise and a wide gain scope, can further widen the gain bandwidth by adopting multi-wavelength optical bump, which represents the development direction of the new optical fiber amplifier.
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Product
Auto Bump/Calibration Station
PS500
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Teledyne Gas & Flame Detection
To provide accurate performance and results, the PS500 has to be properly used and maintained. The Auto Bump & Calibration Station (ABC) provides bump testing, calibration and data management options and is compact, robust and intuitive to use.Two versions of the ABC are available allowing either a single gas cylinder or up to three cylinders to be connected. Additionally, a special three cylinder version is available for reactive gases.
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Product
Easy3DMatch
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Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
G3 System
Dragonfly
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Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Advanced Packaging & TSV
FilmTek 2000M TSV
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Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Product
Analysis
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External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Product
Test Connector Components
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Any flat substrate, or bumped substrate, can be compressed against Z-Axis Elastomeric Connectors to make contact. The picture illustrates a Z-Thru Z-Alloy Connector Frame used to connect the DUT (Device Under Test) to a circuit board.
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Product
Shock/Bump Multifunctional Tester
DP-201
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King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Light and Energy Meter
Model 656
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OAI Model 656 Meter is designed for use with all mask aligners and flood exposure systems. For over 45 years, OAI is a world leader in UV Light & Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries.
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Product
Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Product
Light and Energy Meter
Model 659
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UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
