SODIMM
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Product
260pin SODIMM ECC DIMM
SQR-SD4(ECC)
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ECC SODIMM DDR4 2133/2400/2666, Data transfer rate: 2133/2400/2666 MT/sCapacity: 2GB~16GB. Original IC chip (Samsung/Hynix) ECC function support, Wide temperature range support -40oC~85oC.
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Product
DDR3 SODIMM
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compact type of RAM designed for laptops, all-in-one PCs, and small form-factor computers. It is roughly half the size of standard desktop RAM (DIMM) and uses 204 pins to transfer DDR3-generation data at speeds of 800–2133 MT/s.
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
DDR2 SODIMM
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a type of 2nd-generation Double Data Rate (DDR2) memory module designed in a Small Outline Dual In-line Memory Module (SODIMM) format. It is a 200-pin, compact RAM stick designed primarily for laptops, notebooks, and small-form-factor computers to provide faster data rates and lower power consumption than its predecessor.
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Product
Industrial Grade SODIMM DDR4 3200
SQR-SD4I
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30u” Golden Finger, Wide Temp range: -40oC~85oC. Tier one original chip adopt, lifetime warranty, DRAM Software Monitoring.
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Product
FPGA Card
PC820
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The PC820 is a high-performance, PCI Express card with advanced DSP capabilities and multiple I/O options. It supports one FMC+ VITA 57.4-compliant HPC FPGA Mezzanine Card (FMC) that is closely coupled to the Virtex or Kintex UltraScale FPGA and a DDR4-2133 SDRAM SO-DIMM. The PC820s PCIe Gen3 interface can support up to eight lanes.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
PCIe FPGA Card
PC821
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The PC821 is a high-performance, PCI Express card with advanced DSP capabilities and multiple I/O options.It supports one VITA 57.4-compliant FMC+ and one VITA 57.1 compliant HPC FMC site. Both FMC sites are closely coupled to the Virtex or Kintex UltraScale FPGA and a DDR4-2133 SDRAM SO-DIMM.
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DDR1 SODIMM
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small-form-factor RAM module designed for laptops and compact systems from the early 2000s. It features a 200-pin connector, operates on 2.5 volts, and supports speeds up to 400 MHz (PC-3200). It is not compatible with modern DDR4 or DDR5 slots, offering significantly lower capacity and speed.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
ECC SODIMM DDR5 5600
SQR-SD5(E)
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Data Transfer Rate: 5600 MT/s, Capacity :16GB/32GB, Original Hynix/Samsung/Micron IC adopted, ECC function support.
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Product
PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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Product
Robust DIN-rail Fanless Embedded System With Intel® Celeron® Processor N3350, 2 COM, LAN, 2 USB And DIO
ICO100-839
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The ICO100-839 is a DIN-rail fanless embedded system designed to support the low-power Intel® Celeron® processor N3350. This DIN-rail industrial IoT gateway supports one DDR3L SO-DIMM slot with up to 8 GB system memory. Its proven rugged construction ensures reliable operation in harsh environments with an extended temperature range of -20°C to 70°C and anti-vibration up to 2G. Additionally, the wide range 12V-24V DC power input with a lockable terminal block type connector is suitable for industrial automation fields. The overvoltage and reverse protection lowers the risk of crucial data loss. The outstanding Intel® Atom™-based ICO100-839 is a perfect solution for industrial IoT applications such as smart factory automation and smart energy. The DIN-rail industrial IoT gateway offers an outstanding price/performance ratio with good quality. It comes with sufficient I/O connectivity while measuring only 31 x 100 x 125 mm. The I/O interfaces include two RS-232/422/485 ports, two USB 2.0 ports, one Gigabit Ethernet, one VGA and one DIO. Furthermore, the Intel® Apollo Lake-based ICO100-839 is equipped with two PCI Express Mini Card slots, one for mSATA storage card and another for 3G/GPRS/Wi-Fi connections.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
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The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
Intel® SDM Player With 4K Output
DS-230
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Intel SDM-L (Smart Display Module - Large) form factor. Intel® 13th/12th Generation Core™ Processor. Dual channel DDR4-3200 SO-DIMM, up to 32 GB. 3 independent displays: Golden Finger (HDMI 2.0, DP1.4a), Front Bracket (DP1.4a)
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Product
Logic Analyzer Probe
FS2512
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The FS2512 is a logic analyzer probe used to test DDR4 SO-DIMM memory. When used with the triggering and analysis capabilities of Keysight’s U4154A/B/64A logic analyzer modules, it gives the user an extremely effective tool for debugging, testing and verifying DDR4 SO-DIMMs.
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Product
Mini-ITX Embedded Board with AMD® Ryzen™ APU
AmITX-RZ-G
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- AMD® Ryzen™ Embedded V1000 processor family- Up to 32GB dual SODIMM socket DDR4- PCIe x16, PCIe x1, M.2 and Mini-PCIe expansion- 4x DisplayPort
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Product
Pico-ITX SBC With 4th/5th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, DisplayPort/LVDS, LAN And Audio
PICO880
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The PICO880 is an extremely compact Pico-ITX SBC with onboard 14nm 5th generation Intel® Core™ i7/i5/i3 and Celeron® processors. The palm-sized PICO880 enhanced performance enables greater multitasking at low power meeting the needs of the growing retail mobile device marketplace. The industrial grade embedded SBC is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). Designed with expandability in mind, the tiny embedded board has a full-size PCI Express Mini Card slots with mSATA support. The Axiomtek PICO880 also provides two flexible board-to-board connectors that integrate audio, four USB 3.0, one PCIe x1, one DisplayPort, two UARTs, LED, and power on/off interfaces. The pico-ITX motherboard PICO880 is equipped with standard features such as one DDR3L SO-DIMM with up to 8 GB memory capacity; one USB 2.0 port; one SATA-600 interface, one 10/100/1000Mbps Ethernet port that supports Wake-on-LAN, PXE; one DisplayPort and LVDS display interface with integrated Intel® HD graphics 5500 and 6000 that delivers high-resolution Ultra HD 4K display support for immersive visual retail experience. The single board computer also offers two optional expansion boards, AX93275 and AX93276 for additional RS-232/422/485, USB 3.0, HDMI, VGA and LAN ports. This outstanding embedded SBC runs well with Windows® 7 and 8.1 operating systems.
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
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The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
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Product
Mini-ITX With Intel® Celeron® Processor J1900 (up To 2.42 GHz), VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card And HD Audio
MANO842
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The MANO842 Mini-ITX motherboard features quad-core SoC, fanless design, advanced graphics performance, and 12VDC/STD ATX power input. The powerful MANO842 is equipped with a quad-core Intel® Celeron® J1900 processor with Intel® HD Graphics engine, delivering outstanding computing, graphics and media performance at a competitive price. The cost-effective industrial-grade motherboard utilizes high bandwidth DDR3L-1333 SO-DIMM with system memory up to 8 GB and a rich set of I/O features. With 12V single voltage DC power or STD ATX jack, the ultra-compact Mini-ITX mainboard can be widely applied to automation and embedded industries, including medical healthcare, in-vehicle infotainment, kiosk, digital entertainment, digital signage, POS and much more.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L8GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Fanless Embedded System With Intel® Core™ I5-6300U 2.4 GHz/i3-6100U 2.3 GHz/Celeron® 3955U 2.0 GHz, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM And 9 - 36 VDC
eBOX565-500-FL
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The eBOX565-500-FL is designed to support the 6th generation Intel® Core™ i5-6300U or Celeron® 3955U processor with one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB system memory. The eBOX565-500-FL is designed for reliable use in industrial environments with an IP40-rated enclosure, a wide range 9 to 36 VDC power input, a wide temperature ranges from -10°C to 50°C (14°F to 122°F), as well as up to 3G vibration endurance. To fulfill various needs, the palm-sized industrial embedded computer, which measures 141.6 x 106 x 73 mm in size, provides rich I/O connectivity including two HDMI ports, one RS-232/422/485 port, one RS-232 port, four USB 3.0 ports, two Gigabit Ethernet ports, and two SMA type connector openings for antenna. One PCI Express Mini Card slot enables the addition of Wi-Fi, 3G, or LTE wireless cards.
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Product
ECC SODIMM
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compact, small-outline memory module designed for laptops, workstations, and small-form-factor servers that automatically detects and corrects single-bit data corruption.
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Product
3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
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- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Fanless Ultra Compact Embedded System With Intel® Core™ I5-7300U &Intel® Celeron® 3965U Processor, DisplayPort++, 2 COM, 4 USB And 2 GbE LAN
eBOX100-51R-FL
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The eBOX100-51R-FL is a fanless ultra-compact embedded system with weight 600 grams only. As the smallest embedded system with Intel® Core™ ULT processor onboard, the eBOX100-51R-FL continues the design elements of eBOX100 series – ultra-slim form factor, rugged design, and rich I/O connectivity, allowing greater flexibility and a wider range of application in edge computing, IIoT gateway and extended fields. The eBOX100-51R-FL is powered by the high-performance Intel® Core™ i5-7300U or Intel® Celeron® 3965U processor. The front-facing I/O connectivity design provides convenient access for easy installation and maintenance. It comes with one DDR4-2133 SO-DIMM slot with system memory up to 16 GB. The eBOX100-51R-FL offers two RS-232/422/485, two USB 3.0 ports, two USB 2.0 ports, two Gigabit Ethernet ports, one DisplayPort++, one AT/ATX quick switch, and two SMA type antenna openings; moreover, the embedded system is equipped with one M.2 Key E 2230 slot for Wi-Fi, one M.2 Key B 2242 for SATA storage, and one screw-type 12VDC power input connector.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
