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SSOP-to-DIP Adaptor
Series 651000
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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PathWave System Design (SystemVue)
PathWave System Design offers the most advanced prototyping and design platform for complex RF systems with faster simulation speed, near-circuit fidelity, libraries for radar, electronic warfare, satellite, 5G, and WiFi, plus enterprise integration with numerous partners.
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Enclosures
No input device can perform optimally if its enclosure or housing isn’t perfect. Successful products rely on enclosures that are built to high quality standards and perfectly suited to their intended applications and operating environments. Hoffmann + Krippner can provide inexpensive standard enclosures with modifications in size, shape, and finish, or complete bespoke solutions using state-of-the-art production capabilities. For both metal and plastic enclosures and prototyping or large-scale production, we and our network of vertically integrated partners can guarantee a complete one-piece input solution produced according to either standard or customer-specific designs.
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PXI Prototyping Module, 1-Slot no Connector
40-225A-001
The 40-225A PXI Prototyping Modules are stripped down versions of the 40-220A PXI Breadboard series. These are very basic, low cost prototype modules. They have no PXI interface but do have access to fused power supplies from the PXI backplane.
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Circbord
8004
VECTOR Electronics and Technology, Inc.
Single sided prototyping area with overall Ground Plane. 0.080” diameter clearance around each hole. Plane surfaces solder coated for user convenience. I/O area with square solder pads for connector mounting. No circuit pattern on reverse side.
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Decade Box, Calibrated W/D & U, Resistance, 7, 1ohm to 11.11111Mohm, 1 %
72-7270 CAL DU
The 72-7270 CAL DU from Tenma is a resistance decade box. It is ideal for service, prototype and experimental use. This useful tool may be set resistance value from 1 to 11,111,110 ohm in one ohm increments. The decade accuracy is ±1% resistors used throughout. It has weight of 320g/0.70lb and dimension 14.7cm × 11.7cm × 5.5cm (5.79" × 4.61" × 2.16"). It is typically used in general applications, troubleshooting, maintenance, education and vocational training, production line testing, radio and TV services, working standards, research design & develop, physics laboratory work.
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Terminal Block
The Terminal Block provides standard back-end connector types, such as BNC, D-SUB, VHDCI, and more. Some models offer screw pin terminals for the front-end connectors as well as different mounting options including DIN vertical rail, DIN horizontal rail, wall, panel, or module. You can use terminal blocks for connecting analog or digital signals, generating signals, prototyping, performing custom circuitry, and more.
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Wireless Cmmunications and Networks
Fraunhofer Institute for Telecommunications
The Wireless Communications and Networks Division has been working on mobile and wireless radio communications solutions for more than 20 years. The work covers a wide range and ranges from information and network theory via channel measurements and radio channel modeling, algorithms and protocol design, systematic reviews at link, system and network level to prototypical implementations in demonstrators and field tests.
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PXI Prototyping Module, 2-Slot, 9-Pin D-Type
40-225A-702
The 40-225A PXI Prototyping Modules are stripped down versions of the 40-220A PXI Breadboard series. These are very basic, low cost prototype modules. They have no PXI interface but do have access to fused power supplies from the PXI backplane.
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LIN Interface Module
C- Series
C Series LIN Interface Modules are bus interfaces for developing applications with the NI-XNET driver. The NI-XNET device-driven DMA engine couples the LIN bus to host memory to minimize message latency. You can import, edit, and use signals from LDF databases in integrated LIN databases. C Series LIN Interface Modules work well for applications requiring real-time, high-speed manipulation of many LIN frames and signals, such as hardware-in-the-loop simulation, rapid control prototyping, bus monitoring, and automation control.
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EMI Products
Sophisticated design, manufacture and assembly facilities at Oxley UK production center, include a ceramic production capability for discoidal, tubular, and multiway planar array capacitors, CNC machining, electro-plating, prototype model shop, tool room and dedicated test area.
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HighFfrequency Test Devices
VI Systems now releases engineering prototype samples of high performance transmitter and receiver optical subassemblies (TOSAs and ROSAs) for 25 Gbit/s and 40 Gbit/s applications and product development.
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Supported Test Systems
TTCI is a leading solutions provider of application development for test systems from Seica, Keysight, Teradyne, Digitaltest, and XJTAG. We offer a wide variety of testers and test solutions to meet your needs. Our Seica Pilot and Digitaltest Condor flying probe systems can handle all of your low- to mid-volume production, prototypes, and PC boards with accessibility issues. The Keysight 3070 and Teradyne TestStation can address your larger production runs and fixture requirements. In addition, we can also address your functional and boundary scan needs.
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Prototyping & Test Consulting Services Solutions
Don’t cut corners on the path to quality. We are experts in Design for Test (DFT), Design for Manufacturing (DFM), agile development, prototyping and standards/best practices in many industries. Speak to our prototyping and consulting services experts to ensure you make the right decisions and investments at the start of your project.
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MEMSIC 2125 Dual-axis Accelerometer
28017
The MEMSIC 2125 is a low cost, dual-axis thermal accelerometer capable of measuring tilt, acceleration, rotation, and vibration with a range of ±3 g. For integration into existing applications, the MEMSIC 2125 is electrically compatible with other popular accelerometers. MEMSIC provides the 2125 in a surface-mount format. Parallax mounts the circuit on a small PCB, providing all I/O connections so it can easily be inserted on a breadboard or through-hole prototype area.
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Cloud Edition
HES-DVM Proto
HES-DVM Proto CE is the Cloud Edition of Aldec’s HES-DVM software product used for design compilation and partitioning into multi-FPGA prototyping platforms. It is available in Amazon AWS Marketplace as an Amazon Machine Image (AMI) built upon the Amazon Linux image as a base with preinstalled Aldec HES-DVM software. The HES-DVM Proto CE combines Electronic Design Automation software for design partitioning and compute platform scalability of Amazon Elastic Compute Cloud (Amazon EC2).
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HES Prototyping Boards
HES™ is a feature-rich family of SoC/ASIC pre-silicon physical prototyping and hardware emulation boards. The family features boards with high-performance devices from either Xilinx (including Virtex-7, Virtex UltraScale, Virtex UltraScale+ and Zynq UltraScale+) or Microchip (PolarFire and SmartFusion2).
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Force Sensors
Custom FlexiForce
With its paper-thin construction, flexibility, and force sensing ability, the FlexiForce FSR Sensor can measure force between almost any two surfaces and is durable enough to stand up to most environments. The unique construction and durability of these FSR sensors enables Tekscan to create custom-designed FSR sensors to meet the specific needs of many OEM customers. We also offer standard off-the-shelf sensor products for prototyping and low-quantity requirements.
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EIA Based VectorPak
VECTOR Electronics and Technology, Inc.
VectorPak™ subracks offer versatility within a 19” rackmount format. All racks are adjustable in both height and depth, offering standard product solutions for standard and custom requirements. All Subrack sizes are compatible with Vector prototyping boards (see Vectorbord® Plugbord™ section), and can accommodate other sizes as well.
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STD, S-100 Bus Plugbord
VECTOR Electronics and Technology, Inc.
Card edge board for STD and S-100 bus specification card size and edge contacts on tabs. Available with different circuit patterns for prototyping applications.
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PXIe-8510, 2-Port PXI Vehicle Multiprotocol Interface Module
784121-01
2- or 6-Port PXI Vehicle Multiprotocol Interface Module—The PXIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PXIe-8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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Solid Edge
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Real-Time Target Machines
Speedgoat offers a range of high performance multi-core, multi CPU target computers (target machines) with i3 and i7 CPUs up to 4.2 GHz, and up to 20 cores. Each is optimized for a different application area, from mobile controller prototyping (RCP) to multi-target rack systems for Hardware-in-the-Loop (HIL).
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Off-The-Shelf Control Systems
Circaflex Family
Circaflex is a family of off-the-shelf control systems that help engineers develop sophisticated devices and instruments without the risk and cost of custom-designed circuit boards.Using Circaflex, engineers and scientists can develop feature-packed embedded systems from prototyping in just a few weeks, and ready for deployment in just a few months, saving 50-75% of the effort, time, and risk of a custom board!
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SSOP-to-DIP Adaptor
Series 351000
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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PCIe-8510, 2- or 4-Port, PCIe Vehicle Multi-Protocol Interface Device
785325-01
2- or 4-Port, PCIe Vehicle Multi-Protocol Interface Device—The PCIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PCIe‑8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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PathWave EM Design (EMPro)
Electromagnetic (EM) simulation brings you insight before physical prototyping. Customize EM simulations for speed and accuracy. Integrate EM analysis with your circuit simulations.
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PXI LIN Interface Module
The PXI LIN Interface Module is a bus interface for developing applications with the NI-XNET driver. The NI-XNET device-driven DMA engine couples the LIN bus to host memory to minimize message latency. You can import, edit, and use signals from LIN Description File (LDF) databases in integrated LIN databases. PXI LIN Interface Modules work well for applications requiring real-time, high-speed manipulation of many LIN frames and signals, such as hardware-in-the-loop simulation, rapid control prototyping, bus monitoring, and automation control.
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Open Frame Panel PC
By highly flexible configuration with a high level of modularization, ADLINK's Open Frame Panel PC, leveraging Intel® x86 and NXP ARM-Based solutions, with ready-to-use design helps system integrators, integrated solution providers, and brand vendors quickly deliver cutting-edge functions to individual HMI applications. Leveraging our unique Function Module (FM) design, these industrial panel PCs accelerate prototyping according to the application's requirements while saving considerable time, money, and effort. The SP2 series is ideal for industrial automation, transportation, retail, healthcare, gaming, and other industries.
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PXI Prototyping Module, 1-Slot, Dual 20-Pin GMCT
40-225A-811
The 40-225A PXI Prototyping Modules are stripped down versions of the 40-220A PXI Breadboard series. These are very basic, low cost prototype modules. They have no PXI interface but do have access to fused power supplies from the PXI backplane.
