Reflow
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Product
Resister
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Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Product
OM Thermal Stress System
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Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
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Product
Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
