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Product
Storage Modules
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Elma offers the most complete line of storage modules in the embedded computing industry. Board sizes include 3 U, 6 U, mezzanine and small form factors in VPX, VME, CompactPCI, PMC and XMC standards. Environmental capabilities address commercial and rugged applications with SSDs (solid state drives) and rotating drives (HDD) and surface mount NAND flash. Choose from features including RAID, front panel removability, high capacity conduction cooled mezzanine storage, secure erasure or write protection.
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Product
ONFi
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Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications.
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Product
SSD
M.2 SSD (MLC)
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Innodisk M.2 (S42) 3ME4 is characterized by L3 architecture with the latest SATA III (6.0GHz) Marvell NAND controller. Innodisk’s exclusive L3 architecture is L2 architecture multiplied LDPC (Low-Density Parity Check). L2 (Long Life) architecture is a 4K mapping algorithm that reduces WAF and features a real-time wear-leveling algorithm to provide high performance and prolong lifespan with exceptional reliability.
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Product
Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
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In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Product
3U CompactPCI Serial Intel® Xeon® W Processor Blade
cPCI-A3535 Series
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- Intel® Xeon® W-11555MRE 6-Core processor- Max. 64GB DDR4-3200 by 2x SODIMMs- 80GB 3D Nand flash SSD in SLC mode- USB 3.2, USB-C and RJ-45 iAMT front panel service ports- 2x M12 2.5GbE front panel ports for on train use
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Product
Universal Automated Programming System
4900
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The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Product
MO300 MSATA3 RunCore Embedded SATA3 “Elite Series” SSD
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RunCore Innovation Technology Co. Ltd.
MO300 mSATA3 utilizes high-performance SATAIII SSD controller and NAND flash, with or with no DRAM buffer to support power failure mechanism. This series SSD compliant with Serial ATA Revision 2.6/3.1 specification, compatible with 6.0Gbps, 3.0Gbps and 1.5Gbps interface rate and support Native Command Queuing (NCQ) up to 32 commands. As a standard SATA drive, it can support mainstream OS, such as Windows/Linux/Unix/Solaris/ Mac OS and so on.
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Product
Memory Test System
T5833/T5833ES
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T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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