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Memory Test Systems
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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NI Vehicle Radar Test System
VRTS provides automated radar measurement and obstacle simulation capabilities for 76 to 81 GHz automotive radar systems. With VRTS, you can perform precision RF measurements and simulate a wide range of test scenarios for radar hardware and software subsystems, including sensors, advanced driver assistance systems (ADAS), and embedded software. Use VRTS for all phases, from design to manufacturing, of ADAS and radar system test.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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SoC Test Systems
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Regenerative Battery Pack Test System
17020
Chroma's 17020 is a high precision system specifically designed for secondary battery modules and pack tests. Accurate sources and measurements ensure the test quality that is suitable to perform repetitive and reliable tests that are crucial for battery modules / packs, for both incoming or outgoing inspections as well as capacity, performance, production and qualification testing. Chroma's 17020 system architecture offers regenerative discharge designed to recycle the electric energy sourced by the battery module ei ther back to the channel s in the sys tem performing a charging function or to the utility mains in the most energy efficient manner. This feature saves electricity, reduces the facilities thermal foot print and provides a green solution by reducing the environmental impact on our planet. Chroma's 17020 system is equipped with multiple independent channels to support dedicated charge / discharge tests, on multiple battery modules / packs, each with discrete test characteristics. The channels can easily be paralleled to support higher current requirements. This feature provides the ultimate flexibility between high channel count and high current testing.
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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In-Circuit Test System Rentals
Forwessun offers flexible test system rental options to meet short-term or seasonal testing demands. Our rental systems are rigorously tested for reliability and performance, giving you access to high-quality equipment without the need for a full purchase commitment. Customised rental agreements allow you to return the equipment when it’s no longer required, providing an ideal solution for scaling up production or filling in during periods of high demand.
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Laser Diode Burn-in Reliability Test System
58604
The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Radio Frequency, Communications, & Navigation Test Systems
Reduce testing time and costs with the Astronics radio test sets for use in military, avionics, and civil security industries.Available in commercial and military grades, these integrated test systems make it easy to develop test program sets and leverage them securely and instantly across all deployed testers at the factory, depot, and operational levels.
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Test System Replication/Build-to-Print
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Systems Integration (SIL) Lab Data Acquisition
Bloomy’s SIL data system allows testing and simulation of every system component on the aircraft. The functionality of these complex integrated systems are fully tested, debugged, and verified safely in the lab prior to flight testing. This reduces cost and schedule for new aircraft. Bloomy has applied its expertise to multiple SILs.
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VXI Digital Multiplier
4152A
The 4152A’s advanced features like limit testing, averaging, speed/resolution trade-offs, and fast function changes provide the high “test system” throughput required in today’s production test environments.
