Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Edge AI Box
EPC-R5710
Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Extreme Performance Edge Servers
Ark-7000 Series
ARK-7000 series feature Intel Xeon processors and multiple expansion slots, delivering high-speed data transfer rates and enhanced remote management.
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Fanless Scalable Railway Edge AI Platform
AVA-7200
- EN 50155:2021 certified Edge AI platform.- NVIDIA Ampere GPGPU (A2000/A4500) and Intel® 13th Gen Raptor Lake mobile processor.- Isolated DC 24-110V (200W) or 72-110V (300W) input, configurable by BOM.- Operates at -25°C to 55°C (OT1, ST1) or -25°C to 70°C (OT3, ST1).- 8x 10GbE/2.5GbE M12 X-coded Ethernet, 5x USB, 4x SATA, 4x DI/DO, 2x Serial ports, audio, and DP.- Internal expansion for 1x NVME M.2 slot, 1x 5G M.2 slot with 2x SIM slots, 1x Wifi/BT M.2 slot, 1x mPCIe, accessible by lid opening- QMA antenna on the rear side- Fanless rugged design, conformal-coated for durability, flexibility, and longevity support
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Edge AI & Intelligence Solutions
Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Edge Press Technology Bed of Nails Testers
Protector Edge Press Family
Designed for testing heavy massive boards. Boards with heavy components like large transformers and inductors can destroy normal test fixtures. This design utilizes a 3 plate system where an internal lever actuated sub plate containing the test pins raises to probe the circuit board when the handle is pulled. Heavy boards can bend and break exposed test pins. Similarly large boards which need to be probed by very small delicate test pins can also benefit from this protected test fixture design. This fixture is recommended in situations where there is a high board mass to pin size ratio and pin protection is required. Front and rear panel modular inserts allow for easy updates and customizations to the user hardware interface.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Edge AI Acceleration Modules
Powered by Intel® Movidius™ Myriad X VPU and Intel® OpenVINO™ toolkit, Advantech VEGA-300 series provides compact, low power plug-in modules to help accelerate deep learning inference on the edge for a wide range of AI-based and computer vision vertical applications.
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Edge Gateway
UBC-330
UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
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Azure IoT Edge
Azure IoT Edge is a fully managed service built on Azure IoT Hub. Deploy your cloud workloads—artificial intelligence, Azure and third-party services, or your own business logic—to run on Internet of Things (IoT) edge devices via standard containers. By moving certain workloads to the edge of the network, your devices spend less time communicating with the cloud, react more quickly to local changes, and operate reliably even in extended offline periods.
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Edge Gateway
EPC-R3220
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Edge AI System
Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
