Alignment
-
Product
Laser Shaft Allignment Tools
-
PRÜFTECHNIK Condition Monitoring GmbH
A laser alignment system is the most efficient way to align rotating machinery shafts. Using an adaptive alignment system instead of conventional alignment tools saves you time and money, increases machine availability, prolongs service life and maintenance intervals, and lowers power consumption. Alignment tools from PRUFTECHNIK adapt to virtually any asset, situation, or user skill level.
-
Product
High-Dynamic-Range Polarimeters
-
*Three Wavelength Ranges Available**400 nm - 700 nm**600 nm - 1080 nm**900 nm - 1700 nm*Rotating-Wave-Plate-Based Measurement*High Dynamic Range of 70 dB*Excellent Azimuth and Ellipticity Accuracy of ±0.25°*Sampling Rate up to 400 Samples/s*Beam Terminates Inside the Module*Ø3.0 mm Free-Space Beam Input or FC/PC Fiber Input *Fully Featured Software Includes Alignment Tool and Extinction Ratio Measurement Tool
-
Product
TCoE Setup
-
Alignment of the QA strategy to your business goals is critical to ensure that the QA enterprise is able to deliver on the dynamic expectations of the business. While the quality of your applications is an essential metric for the QA enterprise, it also needs to focus on continuous improvement and to be ready for future technologies. At TestingXperts, we help you transform your QA to a next-gen organization by setting up a Testing Center of Excellence (TCoE).
-
Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
-
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
-
Product
Automated Laser Beam Quality Measurement System
Beamage-M2
-
Large Apertures: The only M2 system on the market equipped with a complete set of 50mm optics. Also, the sensor is 11.3 x 11.3 mm. Simple Alignment: Two beam-steering mirrors are included for quick and easy alignment of your laser into the system. The internal mirrors are factory-aligned and the pre-set height also simplifies the alignment.Available Fall '17
-
-
Product
Nanopositioner
P-616 NanoCube
-
Physik Instrumente GmbH & Co. KG
Compact Parallel-Kinematic Piezo System for Nanopositioning and Fiber Alignment. In a parallel-kinematic multi-axis system, all actuators act directly on a single motion platform. This means that all axes can be designed with identical dynamic properties, which reduces the moved mass considerably. Further advantages: It is possible to make the parallel-kinematic system more compact than serial stacked or nested systems. The errors and masses of each individual axis do not accumulate.
-
Product
CMOS Image Sensor
CIS
-
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
-
Product
Confocal FLIM for Macroscopic Objects
DCS-120 Macro
-
*FLIM of Macroscopic Objects*Scan Field Up to 15 mm Diameter*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Tuneable Excitation by Super-Continuum Laser with AOTF*Two Fully Parallel Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
-
Product
LED Type Wafer Alignment Sensor Controller
HD-T1
-
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
-
Product
ADAS Tools
-
This 12.7-inch wireless touchscreen tablet comes replete with all the functionality expected in an advanced diagnostic and service tablet including the ability read and erase codes, view Freeze Frame and view and graph Live Data, perform Active Tests and perform coding and adaptions, plus it includes ADAS calibration and Wheel Alignment software.
-
Product
Fiber Alignment
-
Fiber alignment tools are essential for taking precise measurements at high speed. The PK product portfolio features many of the industry’s best-performing tools for aligning single fibers, multi-fiber subunits, connectorized assemblies, and multicore fibers.
-
Product
Belt Alignment
Belt Hog
-
The Acoem USA Belt Hog uses the pulley groove as the reference, allowing you to achieve a precise belt alignment which reduces wear, bearing failures and vibrations.
-
Product
Laser Alignment
-
Laser beams are tracing a perfect straight propagating line. A special unique instrument was developed to monitor the direction and position of this laser beam, creating a cornerstone device for alignment. Typical applicationns are mechanical straightness and alignment, calibration articulated arms, accurate positioning, and many more. To facilitate unrestricted movement of the AlignMeter family a built-in wireless system was developed.
-
Product
Radar Cross Section (RCS) Measurement and Evaluation System
XRC
-
KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
-
Product
RF Ports Alignment Software
-
With the R&S®RF Ports Alignment software together with the option R&S®SMW-K545, Rohde & Schwarz provides a standard and tailored solution for calibrating amplitude, time and phase of multi-channel SMW setups. The RF Port Alignment automatically collects the gathered correction data for the multi-channel setup using a connected vector network analyzer such as the R&S®ZNA or R&S®ZNB. Thanks to an intuitive graphical user interface the test engineer is guided through the calibration procedure step-by-step in a convenient way. With a calibrated multi-channel setup, tests of advanced systems in wireless communication or of radar receivers can be performed straightforward.
-
Product
Shaft Alignment
AT-200
-
Connectivity, mobile devices, cloud-based platform, apps are integrated in the AT-200 making it a tool for short response time between machine failures and corrective actions. The smart sensors use CCD technology for a superior measurement performance and precision alignment.
-
Product
Plane Mirror Reflector
10724A
-
The Keysight 10724A reflector is used with the Keysight 10706A, 10706B, 10715A and 10716A interferometers for single-axis measurements. It can also be used with the Keysight 10737L/R Compact Three-Axis Interferometers. Alignment hardware is included.
-
Product
Gross Alignment Funnel / Enhanced Latch Indicator (GAF/ELI)
-
A wet-mate connector system designed to optimize ROV mating efficiency, the Gross Alignment Funnel (GAF) can be used in conjunction with the Enhanced Latching Indicator (ELI) to overcome severe approach angles of ROV connectors during mating. In conditions with low visibility and heavy current, the system aids in aligning the mating halves and providing a clear visual indicator when a successful mate occurs. Easily installed on an existing Nautilus or Rolling Seal bulkhead mounted connector, the system reduces ROV operator variability, resulting in faster mating and demating operations.
-
-
Product
Optical Fusion Slicers
-
ShinewayTech Optical Fusion Splicers - Ribbon, Clad Alignment & Core Alignment Splicers.
-
Product
DUV Mask Aligner
Model 200E
-
OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
-
Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
-
The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
-
Product
Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
-
The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
-
Product
Bare Fiber Aligner
1120
-
The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
-
Product
Tabletop Front & Backside Mask Aligner
Model 200IR
-
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
-
-
Product
Large Substrate Mask Aligner
Model 6020
-
The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
-
Product
Rugged Deployable CMFF Chassis Aligned To SOSA™ With SAVE Tray
ATRSAV07BRN1HVQE4
-
CMOSS Modular Form Factor (CMFF) field-deployable chassis, with a tray compliant with the Standard A-Kit Envelope (SAVE). Includes a 7 slot 3U VPX backplane, chassis manager, and VITA 62 plug-in power supply. it is aligned with the SOSA™ Technical Standard and designed for C5ISR, EW and EO/IR applications. Meets MIL-STDs for shock, vibration, and other environmental standards.
-
Product
Automated Front & Backside Mask Aligner System
Model 6000
-
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
