Defect
other than specified, imperfection .
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Counterfeit Defect Coverage Tool
The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
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Defect Isolation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Defect Review Station Software for electrical test
Faultstation
Centralize all error review for your different testers in a single seat! To capture PCB layout information, FaultStation offers the choice of DPF or IPC input. In combination with a Ucamco data-prep seat, DPF is the obvious choice, while industry standard IPC provides a doorway to all other data-prep systems in today’s marketplace. Once the layout data is available, you combine it with the error information from a variety of different models and makes of testers.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Translating process images into significant tool-defect reduction
Trans-Imager
Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Transistor-Level Defect Simulator
Tessent DefectSim
Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Industrial Tester
Ensures products, materials, or systems meet quality, safety, and performance standards by performing tests like voltage checks, mechanical stress tests, or functional simulations, using specialized equipment or manual methods to identify defects and ensure reliability in manufacturing, construction, and technology sectors, often for electrical, data, or material integrity.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Static Analyzer
Julia
Julia Static Analyzer is best in class for finding defects and security vulnerabilies in C#, Java and Android applications (for C and C++ languages, please have a look to GrammaTech CodeSonar). By using Julia Static Analyzer, you reduce development and maintenance costs and eliminate risks related to security vulnerabilities and privacy leaks. The powerful analysis technology ensures a maximum precision of results. With advanced dashboarding you can flexibly transform the data into useful information for the different stakeholders.
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Assembly Testers
Systems that build products from components and then rigorously test them to ensure they function correctly, meet quality standards, and match specifications, preventing defects early in manufacturing through processes like electrical checks, functional tests, and physical inspections.
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Portable Eddy Current Flaw Detectors
Portable eddy current (EC) flaw detectors inspect metallic parts and perform highly reliable and advanced flaw detection of surface and near-surface defects. Olympus offers portable eddy current equipment to meet a broad range of applications, including the detection of surface or near-surface defects, and the inspection of bolt holes.
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Contour Check Shape
Contour Check Shape has proven itself in hot rolling of long products and is an essential part of the rolling process in many factories. It checks hot and cold steel profiles with the help of three-dimensional surface reconstruction. Thus, it records geometrical errors due to rolling defects including surface defects like scale seams, shells or roller outbreaks.
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Solar Cell PL/EL/IV 3-in-1 Testing System
VS6841
Industrial Vision Technology Pte Ltd.
This luminescence Analyzer integrates a Photoluminescence (PL), Electroluminescence (EL) , and I-V Measurement Technology, has a Device’s PL image, EL image, as well Device’s I-V characteristics in One system. It is being using to quantitatively map Minority-Carrier Lifetime, and to characterize the defect of silicon wafer & solar wafer, and measure the key parameters from solar cell I-V Curve. It is also a useful tool for scientist to develop other methodology & parameters that can be used as a promising technique for online material monitoring and process control.
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Non-contact Ultrasonic Testing System
Yamaha Fine Technologies Co., Ltd.
Contact-free inspection through ultrasonic transmission detecting air bubbles, separation, and foreign materials inside workpieces. With a Yamaha ultrasonic amplifier installed, contact-less inspection in the air is realized. Without damaging or wetting the workpiece, it is possible to inspect the workpiece for packing defects, air bubbles, and even flaw depth.
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Food Quality Analyzer
Hydra F100 BQ
The Hydra is a kiosk like machine with a touchscreen that is installed at a food processing facility. Instead of inspectors manually selecting and inspecting samples, whole trays of samples can now be inserted into the machine to be assessed at once. The Hydra has cameras above and below the fruit to capture images of this bulk sample, which is sent to AgShift’s cloud platform to analyze it for weight, size, color and to check for defects like mold or bruising.
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Automated Visual Quality Control System for Lid Assembly
Angara-form
The automated visual inspection system is designed to identify and reject covers that have defects that have arisen during industrial production, as well as visible defects in the form of black dots or dirt on the surface of the cover.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Scanning Electron Microscope
E5620
The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Advanced 3D Automatic X-Ray Inspection
V810 S2EX
V810 is "3D Automatic X-ray inspection System" that corresponds to the double side mounting SMT-PCB that is not able to be checked by a transmission-type X-ray machine. It has the ability to detect a wide range of defects, and It have 100% complete defect detection capability in the Hip-defective.And, it is the inspection machine of world's highest level that combines the ability of the ultra-fast test speed and the lowest false call positives further.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Partial Discharge Testing Equipment
AR700
PD Defect Location in High-Voltage Equipment Insulation by Acoustic Sensors To act on deteriorating insulation the source of PD must be known.The insulation defects produce partial discharges, which emits electrical impulses, radiation of electromagnetic waves as well as acoustic signals.The AR700 measures acoustic signals with multiple sensors spread over the transformer. Then the software determines the failure location using the time difference of all incoming signals. Finally, these coordinates are shown in a 3D model of the transformer. AR700 device is used for measuring of acoustic signals on the external surfaces of gas-insulated breakers and substations, power transformers and other tank high-voltage equipment. The acoustic signals are caused by partial discharges in the insulation, which is the sigh of the defects.The advantage of “AR700” device is the quick installation of the acoustic PD sensors on the external surface of high-voltage equipment tank. The sensors have magnetic holder that is why there is no need to de-energize the equipment for the sensors installation. “AR700” device has 4 syn-chronic channels for acoustic signal measurement. This gives the possibility not only to find the defects in the insulation, but also to locate them. The location function of the “AR700”device is unique for acoustic devices.
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Surface Paint Quality Scanner
Konica Minolta Sensing Americas, Inc
There is always a challenge to achieve a consistent high quality surface on a car body during production. The goal of the manufactures is to reduce defects and, quickly and accurately fix the ones that occur.
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Website Testing Services
Our Free website verification testing service offers absolutely free usability andaesthetics critique as well as identifying up to 5 defects or issues.
