Defect
other than specified, imperfection .
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Transistor-Level Defect Simulator
Tessent DefectSim
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Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Surface Defect Inspection System
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Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Pipeline Defect Mapper
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The non-intrusive measuring device takes measurements along the pipeline and plots the results directly onto the screen of the receiver. There is no need to carry extra logging and display devices. All the data is displayed and logged into the receiver for downloading to a spreadsheet or dedicated analysis program.
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Product
Translating process images into significant tool-defect reduction
Trans-Imager
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Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Product
Surge Tester
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They are designed to detect quality defects in the insulation between winding turns, ensuring the reliability and performance of electrical components.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Fixture Self-Test Controller and Calibration Check
AQ818
Test Fixture
The module AQ818 includes all the electronic blocks required to perform an effective test platform self-test. Thanks to this module, a chain of tests can be performed, which will end up not only with a report of the defective instruments or switch modules, but also with the relay contacts live expectancy report.
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Product
Upsetting Testing Machine
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JINAN PRCISION TESTING EQUIPMENT CO., LTD
The full-automatic rapid upsetting testing machine adopts hydraulic loading and manual control. The metal material applies pressure along the axis of the sample at room temperature or hot state to compress the sample, test the ability of the metal to withstand upsetting plastic deformation under the specified forging ratio, and display metal surface defects. It is mainly used in the upsetting test of metal materials such as iron and steel enterprises, standard parts manufacturers, and tool manufacturers to test the ability of metal to withstand upsetting plastic deformation under the specified forging ratio and display the metal surface characteristics.
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Product
Contour Check Round & Edge
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Laser measuring systems are of central importance for rolling mills to check the contours of steel profile for defects during the production process. A slight deformation on the surface of the profiles reduces the quality of the product, and in the worst case, a broken roll can even destroy the entire batch. With our systems Contour Check Round & Edge you identify and evaluate deviations at an early stage. Increase the process efficiency of your production - regardless of temperature and profile shape.
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Product
SOLAR CELL TESTER
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The tester is designed for terrestrial solar cell incoming/outcoming inspection with the purpose of checking and optimizing parameters and preventing manufacture defects of solar modules. Solar cells are not heated in process of inspection due to the use of xenon pulse lamp installed in the tester.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Receptacle Tester
RT500
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Designed to detect the most common wiring problems in standard 120V receptacles.Test for correct wiring, open ground, reverse polarity, open hot, open neutral, hot and ground reversed.Conditions NOT indicated: Quality of ground, multiple hot wires, combinations of defects, reversal of grounded and grounding conductors.Large light indicators for greater visibility.Reinforced prongs for increased durability.Push-pull design with slip-resistance ribbing.Made in USA of U.S. and imported parts.
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Product
Software
Interface Analysis
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Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Product
Bridge Decking Testing Equipment
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The testing process can detect blow holes, inclusions or thin areas in 'sprayed-type' membranes. Because the concrete contains a small amount of water, it is electrically conductive and a DC Pinhole Detector can be used to create a high voltage which is passed over the surface by the use of a brush electrode. An alarm will sound to identify any small defects which can be rectified so that the integrity of the coating can be verified.
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Product
E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Product
Solar EL Defect Detector
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Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Product
(AOI) Automated Optical Inspection Systems
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For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Product
ClicManage
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ClicManage is an easy to use and seamless test management solution that improves test productivity by managing requirements, releases, test plans, milestones and defects with reduced maintenance effort. It helps in building a strong foundation for your QA practice by providing visibility to better maneuver testing via one easy-to-use planning, delegating, tracking and reporting hub. Moreover, ClicManage can be interfaced with any third party defect tracking tools along with our proprietary ClicBug.
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Product
Automated Live Fish Measuring System
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The system for measuring and identifying aquatic organisms is designed to measure the linear dimensions and volume of live fish on a conveyor. The conveyor speed can reach 2.5 m / s, that is, up to 5 fish can pass through the installation in one second.The measurement of the thickness and volume of fish is carried out using a specialized camera Sick Ranger D40, which works on the principle of laser triangulation.The camera operation is synchronized with the conveyor movement using the Sick DGS-60 encoder.The industrial color camera Basler Scout scA1300-32gc is used for measuring the linear dimensions of fish (length and width), as well as highlighting characteristic features of different types (color of scales and fins) and possible defects.
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Product
MicroDetect Basic
MDb-01
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Hachmann Innovative Elektronik
MicroDetect basic is a handy, exact and simply useable voltage detector and interface-tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-tester warns against defect interfaces.
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Product
Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Product
T8090 Dual Absolute Leak Tester
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The Dual Absolute.The new Dual Absolute technology makes it possible to eliminate the disadvantages of a classic differential system, improve its advantages and renew an industry that has been standing still for decades. Thanks to the new Dual Absolute technology, ForTest has combined the simplicity of a classic absolute decay system with the precision and sensitivity of a differential system, bringing leak testing instruments to a level never seen before.The new algorithms and measurement hardware eliminate typical defects in a differential system, such as differences in stabilization between the test part and the reference sample.The new range of instruments is able to work in 3 different ways: Pure Differential, Dual Absolute and Central Zero.The new Dual Absolute technology is so powerful and reliable that ForTest has decided to stop developing the classic differential system.
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Product
Leak Testing
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Leak testing is a non-destructive method to verify the presence of a leak in a component or device.It is implemented as a control methodology for monitoring production process and product quality control. Leak tests are used to find out possible leaks due to non-suitable material (porosity, blowholes, cracks), or in the machining process to find out machining errors or defective parts, and ultimately in assembly, to find out missing or defective gaskets, wrong positioning or assembly. The presence of a leakage could jeopardize the correct functioning of the component, device or its life span, and can also be potentially dangerous for the environment and the safety of its user.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
