Transceiver Test
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Product
Optical Fiber Transceivers
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Optical Fiber Transceiver Module is a self-contained component that can both transmit and receive. Usually, it is inserted in devices such as routers or network interface cards which provide one or more transceiver module slot (e.g GBIC, SFP, XFP). Fiberinthebox provide a full range of optical transceivers, such as SFP+ (SFP Plus) transceiver, X2 transceiver, XENPAK transceiver, XFP transceiver, SFP (Mini GBIC) transceiver, GBIC transceiver, CWDM/DWDM transceiver, 40G QSFP+ & CFP, 3G-SDI video SFP, WDM Bi-Directional transceiver and PON transceiver.
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Product
Noise Figure Analysis Using NI PXI RF Test Instruments
NI-RFmx Noise Figure
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Measure noise figure, gain, Y-factor, effective temperatures, hot and cold power, and moreOptimized calibration and measurement routines for multi-DUT test using Y-factor and cold sourceSupports the PXIe-5668R 26.5 GHz VSA, the PXIe-5698 26.5 GHz preamplifier, and VSTsDesigned for use with industry-standard noise sources such as the Noisecom NC346 Series
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Product
Bottom Electrode SMD Test Fixture
16197A
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The 16197A is designed for impedance evaluations of bottom electrode SMDs. It achieves stable frequency characteristics up to 3 GHz and provides highly repeatable measurements. The Keysight 16197A supports various SMD sizes, as small as 1005 (mm)/0402 (inch) and as large as 3225 (mm)/1210 (inch). Accommodation of the 0603 (mm)/0201 (inch) size is available with option 001.
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Product
RF-Antenna Communication Links Functional Test
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The application encompasses functional tests of very large quantities of automotive antenna amplifiers, plus parallelization of tests by implementing several test stations in a rotary indexing table. The DUTs are inserted manually and after final assembly, they are loaded into the rotary table; this requires manual triggering by the operator.
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Product
Memory Test System
T5230
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T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Product
PXI Express Board Virtex-5 DVI Transceiver
SMT739
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Sundance Multiprocessor Technology Ltd.
The SMT700 is one of the first of a new range of Sundance cards that includes a direct connection to SLB (Sundance Local Bus) compatible mezzanine card, without the need for a Sundance TIM. This enables a variety of cards to be added to a system, for example extra Ethernet ports, video in/out, High speed ADC / DAC etc. Data from these extra cards (along with data from the SMT700’s own inputs – up to 1Gb/s Ethernet, 2.5Gb/s optical links, and RSL links) can be processed via the Virtex 5, or by another linked card or module.
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Product
Optical Transceiver FMC Modules
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Sundance Multiprocessor Technology Ltd.
FMC Modules with Optical Transceivers
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Product
PCI Express 4.0 Test Platform
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The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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Product
TD-SCDMA Analysis Using NI PXI RF Test Instruments
NI-RFmx TD-SCDMA
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The NI-RFmx TD-SCDMA personality is a highly optimized API for performing physical layer measurements on TD-SCDMA cellular standard signals. NI-RFmx TD-SCDMA is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development efforts.
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Product
Automated Aerospace and Defense Test
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Obsolescence management, evolving RF requirements, and design for test (DFT) challenges every test organization in the aerospace and defense industry. Organizations are transitioning from rack-and-stack box instruments and closed-architecture automated test equipment (ATE) systems to smarter test systems built on a modular platform that scales to meet current and future needs.
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Product
Automotive Test Solutions
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The testing and simulation systems from this division are used primarily in the automotive and automotive supplier industry. These are, for example, modular function-testing systems and diagnostic tools for automotive ECUs or bus communication systems for a wide variety of electronic components in automotive production. Electromechanical assemblies and entire car seats are also tested to ensure they function
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Product
Open Test Platform for High Performance Automotive Applications
TSVP
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The R&S®TSVP family of products is an open test platform from Rohde & Schwarz ideal for high performance automated test equipment (ATE) applications. The chassis contains a mechanical frame, digital backplane, analog backplane, mains switching and filtering, power supply and diagnostic extensions. A highlight is the analog bus for routing measurement signals between different slots without additional external wiring.
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Product
Wafer-Level Parametric Test
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Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Product
Headlamp Test Platform
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Leverage 25+ years of automotive test experience, with the specialized design and manufacturing of automotive lighting testers. Using specialized know-how in this field, including photometric, electro-mechanical equipment and software solutions, accelerate your time to market with a higher quality product.
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Product
TRC-8543, CAN HS/FD or LS/FT Transceiver Cable
783701-03
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The TRC-8543 is designed to provide flexibility in connecting a CAN bus to the NI-9860, PXIe-8510, and/or the native NI-XNET port on a cDAQ-9134 or cDAQ-9135 controller. You can connect the TRC-8543 to the port to support a CAN HS/FD or LS/FT interface. The TRC-8543 is an isolated cable that includes the necessary transceiver for the bus type. It also features termination resistors that you can enable or disable in software.
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Product
Radar Test System
UTP 5065
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Radar sensors are core elements to realize autonomous driving. The UTP 5065 radar test system from NOFFZ Technologies has a compact vertical design and contains everything needed to allow State-of-the-Art measurement and sensor calibration. The test bench setup and component selection are tuned to get best possible results for highly accurate and cost-efficient testing in production of automotive radar sensors.
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Product
Eagle Test Systems
ETS-200T
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The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.
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Product
Universal In-Line Test Platform
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UniLine brings 20+ years of test & quality experience to your manufacturing floor and test automation delivers accurate results, without bias. By standardizing test, product quality improves as costs decrease. Equipment becomes understandable and manageable across departments and station support becomes simple.
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Product
Functional Test
xUTS
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Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Product
Parallel Electrode SMD Test Fixture
16192A
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The 16192A test fixture is designed for impedance evaluations of side electrode SMD components. The minimum SMD size that this fixture is adapted to evaluate is 1(L)[mm].
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Product
Environmental Testing
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Environmental Testing is the evaluation of a product in conditions which simulate the physical environments that may harm or adversely affect the products performance. Environmental testing can play an important role throughout a product's development cycle to ensure that the materials and manufacturing processes can survive the stresses of the environment in which the product is likely to operate. These environments may include high and low temperatures as well as quickly changing temperatures. Also, temperature humidity environments may also be a factor. Environments with an added media such as dust, ice and freezing rain may also have an adverse effect on products. Listed below are some of Global Testing Services Environmental Testing capabilities
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Product
32 Channel Multi-Purpose DIOS/TAP Modules/Interfaces for Spare JT 2148 QuadPOD Transceiver Slot
JT 2149/MPV eMPV
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The JT 2149/MPV and the JT 2149/eMPV are a 32 channel multi purpose DIOS/TAP pod modules/interfaces that can be plugged into any spare JT 2148 QuadPOD transceiver slot. The DIOS channels of these units I/O interface pods enable increased fault coverage and thus improved diagnostic resolution during boundary-scan testing. The principal difference between the two versions is the use of an extended case on the eMPV that allows standard 0.1″ connections to be used to access ths TAP and static IO signals (see tab below)- on the standard /MPV unit these signals are available at the front face 0.05″ connector. The units are fully supported by JTAG Technologies’ development tools. Additional DIOS modules can be serially connected if more parallel access points are required.
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Product
Test Systems
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In-Circuit Test (ICT) tests populated circuit boards by means of electronic measurements through thin needles on test fixtures. We offer in-circuit testers for various testing strategies – from the flexible 19“ rack to the ergonomic high-performance tester. And all of our in-circuit testers are also available in the Lambda edition for true parallel testing. The flying probe test checks your printed circuit boards using four movable test heads. This requires no fixtures and allows for flexible test program generation. That makes our flying probe test systems ideal for a high mix of printed circuit boards and small to medium test volumes, such as for prototype testing.
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Product
Magnet Testing
Helmholtz Coils
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A coil arrangement consisting of two coils with the same radius or edge length is called a Helmholtz coil. At the correct distance, these coils are arranged in parallel on the same axis and current flows through them in the same direction. Their magnetic field is then characterized by a large homogeneous area in the center of the coil, which is freely accessible for experiments and measurement tasks. Helmholtz coils can have a circular or square geometric shape.
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Product
ATE Test Probes
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For contacting loaded PCBs in automatic test equipment (ATE) with vacuum, pneumatic or mechanically operated fixtures. Available in 2.54mm, 1.91mm & 1.27mm test centre spacings.
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Product
Test Accelerometer Sensitivity And Noise Test
Accelerometer Test Unit
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*Quick and Accurate Accelerometer Test*Battery operation*All tests use 32-bit resolution A to D Converter*All data downloaded to PC via Ethernet link*Records all data to a flexible easy to use database*Records time and date of tests
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Product
Spring Clip Fixture
16092A
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Use this test fixture with parallel electrodes for impedance evaluation of both lead and SMD components.
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Product
Test Programming
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Terotest offers a full test programming service for all of our Automatic Test Equipment. In many cases test programs can be generated from CAD data on the product or component under test, or from autolearn facilities within the test system. Such techniques maximise accuracy and test program fault coverage, and allow quick and easy test program generation.





























