Aligners
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Product
Custom Solutions for Mask Aligners
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OAI offers custom designed solutions built to your unique specification.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
µMLA Maskless Aligner
µMLA
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The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Bare Fiber Aligner
1120
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The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
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The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
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Single Fiber Aligner
1100
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The 1100 Single Fiber Aligner uses patented fiber alignment concepts to produce virtually instantaneous temporary couplings for OTDR, dispersion, or any other optical fiber or component test that requires a fiber-to-fiber connection. It delivers low loss, low reflectance couplings on the first try virtually every time, without the need for test instrument feedback. As a result, temporary coupling times are minimized and manufacturing costs are reduced without compromising product quality.
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Product
MLA 150 Maskless Aligner
MLA 150
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The MLA 150 Maskless Aligner is poised to revolutionize photolithography by offering an advanced, fast, and flexible solution that replaces traditional photomask techniques. With its high-resolution capabilities providing sub-micron accuracy, this aligner is designed for efficiency, making it ideal for rapid prototyping, advanced research, and low to mid-volume production. By utilizing a two-dimensional spatial light modulator (SLM), the MLA 150 directly exposes the resist-coated wafer, facilitating an unmatched ease of use and operational performance. Its application spans various sectors including MEMS, micro-optics, sensors, and electronic components, highlighting its versatility and effectiveness in nanofabrication environments.
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Product
DUV Mask Aligner
Model 200E
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OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
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Product
ResMap or DualMap Auto Load Table Top
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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ResMap or DualMap Auto Load Floor Standing
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Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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ResMap or DualMap Manual Load
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
Shaft Alignment
EVO
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The evolution of laser shaft alignment towards simplicity and confidence continues with the EVO.
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Product
Fiber Alignment
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Fiber alignment tools are essential for taking precise measurements at high speed. The PK product portfolio features many of the industry’s best-performing tools for aligning single fibers, multi-fiber subunits, connectorized assemblies, and multicore fibers.
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Laser Alignment
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Laser beams are tracing a perfect straight propagating line. A special unique instrument was developed to monitor the direction and position of this laser beam, creating a cornerstone device for alignment. Typical applicationns are mechanical straightness and alignment, calibration articulated arms, accurate positioning, and many more. To facilitate unrestricted movement of the AlignMeter family a built-in wireless system was developed.
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Bi-Directional Alignment Laser
LA-01MB-AK
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These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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Product
Small Alignment Scope
FLUFE
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F. W. Breithaupt & Sohn GmbH & Co.KG
*Diameter of socket 37mm, length 50mm*Accuracy ±0,2mm*Magnification 20x*Aperture 30mm*Measuring range 400mm to infinity*360° adjustable eypiece unit*Custom specific adaptors and modifications possible*Made in Germany
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Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
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Product
RF Ports Alignment Software
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With the R&S®RF Ports Alignment software together with the option R&S®SMW-K545, Rohde & Schwarz provides a standard and tailored solution for calibrating amplitude, time and phase of multi-channel SMW setups. The RF Port Alignment automatically collects the gathered correction data for the multi-channel setup using a connected vector network analyzer such as the R&S®ZNA or R&S®ZNB. Thanks to an intuitive graphical user interface the test engineer is guided through the calibration procedure step-by-step in a convenient way. With a calibrated multi-channel setup, tests of advanced systems in wireless communication or of radar receivers can be performed straightforward.
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Core Alignment Splicer
Model：95S
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OFS-95S fiber optic fusion splicer is designed as a highly flexible instrument with 6-motor precise micron levelcontrol and splice loss lower than 0.02dB for G.652 fiber. Equipped with removable universal fiber holders (250μm/900μm/patchcord/FTTx indoor fiber etc.), SOC holder and internal thermometer / barometer, OFS-95S can be deployed anywhere. Fast 5s startup, 9s splicing and automatic heating features enable the splicer an efficient tool for large volume splicing operation during fiber installation and maintenance.
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Product
Compact Alignment Scope
ALSCO
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F. W. Breithaupt & Sohn GmbH & Co.KG
*Magnification 6x*Measuring range 0,3m to infinity*Optional: with adjustable reticule*Either for integration in spindle or revolver*Different reticule designs available*Customer specific modifications possible*Made in Germany
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Belt Alignment Sensors and Misalignment Switches
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Electro-sensors belt alignment sensors are mounted along the conveyor belt that needs to be monitored for misalignment. The rub block assemblies are mounted so that the brass surface area is in-line with the edge of the conveyor belt. When the belt wanders it then rubs up against the brass block. The contact with the belt creates friction and heat that the sensor in the brass block records as a rise in temperature.
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Beam Geometry & Alignment Testing
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Perform quality control testing of your Digital Radiography (DR), Computed Radiography (CR) and Fluoroscopy X-ray systems with ease. Comply with local, state, federal, and governing bodies for digital and traditional analog radiographic imaging technologies.
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IPMI Controller & Software For VPX Systems Aligned With SOSA
IPMI-C-VP-S1 and 79-V48-3-IPMC-TB-S1
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Elma‘s VITA 46.11 Intelligent Platform Management Controller (IPMC) for VPX is a pre-programmed part and source-code package created to give designers a quick path to integrating VITA 46.11 system management functionality onto their board designs.
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Shaft Alignment
AT-200
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Connectivity, mobile devices, cloud-based platform, apps are integrated in the AT-200 making it a tool for short response time between machine failures and corrective actions. The smart sensors use CCD technology for a superior measurement performance and precision alignment.
