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Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
- Pickering Interfaces Inc.
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LXI EMR Low Thermal EMF Matrix 28x33
60-511-003
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Thermal Imaging
Is a sophisticated and non-invasive technique that utilizes infrared technology to detect heat emissions from various objects.
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Fluids And Thermal
Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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Thermal Testing
A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)
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Thermal Desorption
Scientific Instrument Services, Inc.
The SIS Short Path Thermal Desorption units sit directly on top of a GC injection port to provide for the direct desorption of both volatile and semi-volatile samples into the GC injection port and column. Due to the "short path" of sample flow, these new systems overcome the shortcomings of previous desorption systems by eliminating transfer lines, which are easily contaminated by samples, and by providing for the optimum delivery of samples to the GC injector via the shortest path possible--the direct, syringe-like injection into the GC.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Thermal Management
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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True-rms Thermal Multimeter
279
Thermal imaging multimeters are a first-line troubleshooting tool for electrical equipment that can check hot spots on high-voltage equipment and transformers, and detect heating of fuses, wires, insulators, connectors, splices and switches. Scanning with the 279 FC's thermal imager reveals many electrical issues rapidly and from a safe distance. By combining two tools into one, the thermal multimeter lightens the load and increases productivity.
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HD Thermal Camera
T1010
The T1010 uses the power of FLIR Vision Processing™ to deliver detailed, smooth pictures with very little image noise. FLIR Vision Processing combines HD resolution, MSX®, and UltraMax® image enhancement with FLIR's proprietary adaptive filtering algorithms to produce brilliant thermal images with up to 3.1 million pixels. Plus, the T1010 is sensitive enough to detect temperature differences down to <20 mK, for clear, low-noise results that keep you from missing any potential issues during inspections. 1024 × 768 true HD resolution images, with thermal measurements up to 650°C (1202°F).
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Thermal Shock Chambers
Shanghai Morningtest Environmental Chambers Co.,Ltd.
Thermal Shock Chambers are designed for the safe, efficient, and accurate environmental testing of electronics and consumer products, and aerospace, telecommunications, and military and defense components.
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Field thermal needle system for thermal resistivity / conductivity measurement
FTN01
Hukseflux Thermal Sensors B.V.
The FTN01 Field Thermal Needle System allows performing fast, on-site measurements of the thermal resistivity or conductivity of soils, in particular around the typical depth of burial of high voltage cables. FTN01 is designed with a focus on robustness and saving time, while still offering sufficient accuracy for typical field measurements. The sensor is a Non-Steady-State Probe (NSSP), TP09, which is mounted at the tip of the Lance LN01. The system is operated using a hand-held Control and Readout Unit CRU01.
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Thermal Shock Chamber
The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Thermal Imager with App
testo 872
The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.
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Thermal Shroud
BC8-55/150C
When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Thermal Imaging Cameras
Thermography tools are indispensable when it comes to non-contact detection of thermal differences. Thermal imagers can be used to find defects in buildings, discover damage during maintenance, or analyze thermal processes.
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Thermal Cameras
Megger's thermal cameras are professional and easy-to-use, and provide fast accurate readings.
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Thermal Profiler
SPS Smart Profiler
The SPS Smart Profiler stands out as the best and “smartest” temperature profiling data collection system available. The hardware is the best in temperature tolerance design using an LCP (Liquid Crystal Polymer) enclosure for better protection and faster cool down between profiles. The design of the SPS thermal shields allows for easy and secure opening and closing, durability that meets the most stringent of drop tests, and temperature tolerance capabilities that exceed all previous KIC profiler and shield models.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
