Image Processors
algorithmically enhances image characterization.
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
MEC Server
- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Product
ATX Motherboard With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® Q87, USB 3.0, SATA 3.0, Dual LANs, DisplayPort, VGA, HDMI And MSATA
IMB211
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The IMB211 is industrial-grade ATX motherboard with a full-range of integrated peripherals for general industrial and embedded applications. The IMB211 is based on 4th Generation Intel® Core™ i7/i5/i3/ Celeron® processors in LGA1150 socket with Intel® Q87 Express chipset. Four 204-pin DDR3-1333/1600 slots provide a maximum memory capacity of 32 GB to improve overall system performance. This industrial-grade high performance motherboard also supports Intel® Active Management Technology 9.0 (iAMT 9.0), SATA RAID, and triple-display capability through DisplayPort, HDMI and DVI-I interface. The board helps users to deploy more responsive, high-performance, graphic performance systems for advanced communication, gaming, industrial and automation applications.
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Product
18.5" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-318W TGL
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Industrial-grade 18.5" LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panel1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100, TPM2.0 hardware security and Type C (USB only)
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Product
Fanless Embedded System With Intel® Atom® Processor E3845/E3827 For Railway, Vehicle And Marine PC
tBOX810-838-FL
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The tBOX810-838-FL fanless box PC is certified with eMark, ISO7637, EN50155, EN50121 and IEC60945 for transportation applications. The tBOX810-838-FL is powered by the Intel® Atom® processors E3845 quad-core 1.91GHz and E3827 dual-core 1.75 GHz with onboard DDR3L memory up to 4GB. Measuring only 164 x 108 x 44 mm and 0.77kg, the mini fanless embedded system supports a wide operating temperature ranging from -40°C to +70°C and 9 ~ 36V wide DC input for wide range of harsh environmental conditions. Additionally, the vehicle/railway/marine box PC has high integration ability with two full-size PCI Express Mini Card slots, one SIM card which makes it a multi-function device for transportation applications. The tBOX 810-838-FL is definitely the top choice for M2M intelligent system for railway, marine, and vehicle solutions.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF
Model 6353
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- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
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The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
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Product
Measuring Microscopes, Image Processing + Optics Test Equipment
Development And Production Services
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Optik Elektronik Gerätetechnik GmbH
Development and assembly of opto-mechanical building groups, including software development.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
19" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-319S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Qseven Module With Intel® Atom® X5 And X7 Processors
Q7M310
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*Intel® Atom® x5 and x7 processor (Apollo Lake)*8GB DDR3L memory onboard*4 lanes of PCI Express slot*2 SATA-600*2 USB 3.0 and 4 USB 2.0
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Product
17" SXGA Elkhart Lake Thin-Client Terminal With Intel® Atom™/ Celeron® Processor
TPC-317 EHL
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Intel® Elkhart Lake (EHL) Atom™ x6425E 2.00 GHz quad-core / Celeron® J6412 2.00 GHz quad-core processor with 4 GB DDR4 SDRAM.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F).Front-facing LED indicators to show operating status.Built-in Advantech iDoor technology, SSD/HDD bay and VESA mount.Compact, fanless system with aluminum alloy front bezel and chassis grounding protection.Supports Advantech’s SNMP Subagent software.Supports Advantech’s WISE-PaaS/RMM remote management software.
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
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Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
3U CompactPCI Quad-Core Intel Atom® Processor Blade
cPCI-3620
Processor Blade
The ADLINK cPCI-3620 Series is a 3U CompactPCI® processor blade featuring a quad-core 4th generation Intel® Atom SOC and soldered DDR3L-1333 ECC memory up to 4GB.
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Product
High-Performance Gaming Platform Based On 12th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA2X-AD
Gaming Platform
ADLINK's ADi-SA2X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th Generation Intel® Core™ processors, the ADi-SA2X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-AD fully satisfies the needs of your gaming application.
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Product
Audio Signal Processors
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Two balanced mic or line level inputs24-bit A/D convertersAdjustable input gainPhantom powerPhoenix-style terminal block connectors
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Product
2U Rackmount Network Appliance With Dual Intel® Xeon® 6 Processors
FWA-6173
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Dual Intel® Xeon® 6 processors with up to 86 P-cores & 144 E-cores per socket. 16 x DDR5 RDIMM memory with up to 1TB, 1 x PCIe Gen5 x16 double-deck 10.5” or 2 x PCIe Gen5/Gen4 x16 FH/HL. 8 x Advantech network module expansions w/ PCIe Gen5 bandwidth with up to 200GbE bandwidth per slot. High availability system with redundant design such as PSU, fan, storage, BIOS, and BMC solutions.
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
Computer on Module
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-289
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsRich expansion: M.2 B key for SSD Storage, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via DC Jack or ATX 4pin+5VSB pin headerWindows 10/11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOnTriple independent 4K displays with 1 DP1.4, 1 HDMI, and 1 LVDS
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Thermal Imaging Cameras
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Thermography tools are indispensable when it comes to non-contact detection of thermal differences. Thermal imagers can be used to find defects in buildings, discover damage during maintenance, or analyze thermal processes.
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Product
Configurable Processor Modules
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Cyclone FPGA based configurable processor modules for embedded control and measurement applications.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
COM Express Type 10 Mini Module With Intel® Pentium® & Celeron® N3000 Series Processors
CEM300
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The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
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Product
THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
Motherboard
12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
cPCI-6636(KL) Series 6U CompactPCI Processor Blade
20040260
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The cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
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Product
Remote Manageable 1U Network Appliance For UCPE/SD-WAN And NGFW Base On Intel® Xeon D-2100 Series Processor. Ideal For SD-WAN Deployments.
FWA-3050
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Intel® Xeon D-2100 Series Processors, up to 16 Cores with Optional 100G QAT4 x DDR4 ECC RDIMM slots8 x 1GbE RJ-45, 4 x 10GbE SFP+ slots with 2 pairs of LAN bypassIntel® QAT with up to 100G crypto supportIPMI v2.0 compliant BMC1 x Advantech network module expansions2 x internal 2.5" SATA HDDs/SSDs
