Product

Small Pellets Testing Kit

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Fiaxell Sàrl

Fiaxell Sàrl

The ceramic pellets that generally have a diameter between 6 to 12 mm and a thickness of 2 to 4 mm are blocked on a special flange with a disc of soft vermiculite (mica) that has the same high of the ceramic sample and prevents the latter (or the flanges) to toggle. Gold or other appropriate M_Grid™ materials are placed on both sides of the pellet for potential and current measurement. After this operation, the double ceramic felt caps are covering the sample as for any other cell mounting in the Open-Flanges™ test set-up.

Product

IR Inspection System

EVG®20

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EV Group

EVG®20 - EV Group

The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.

Product

ICT/FCT-Fixtures Max UUT 370 × 300 mm (wxd)

CK-2-228X (Large IF) / 230532

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Columbia Elektronik AB

CK-2-228X (Large IF) / 230532 - Columbia Elektronik AB

The series of In-Circuit testers that are Teradyne for the 228x and TestStation are dedicated tools that rely on the tester hardware for diagnostics and test pattern delivery. The integration of the stand-alone BTS with the Teradyne ICT can enhance the system’s capability. In other words, it can provide access to additional tools. It provides the user with a common platform and portability of test patterns from stand-alone to ICT and later on to functional test and depot test stations.

Product

Compact Micro-Translation

M-112

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Physik Instrumente GmbH & Co. KG

M-112 - Physik Instrumente GmbH & Co. KG

M-110, M-111 and M-112 are ultra-high resolution motorized translation stages providing linear motion of 5 to 25 mm in an extremely compact package. They feature a precision leadscrew with sub-micron resolution and precision linear ball bearings guaranteeing <0.5 m straightness of travel.

Product

Premium Sony CMOS Pregius cameras with USB3 Vision

xiC

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XIMEA GmbH

xiC - XIMEA GmbH

Smallest camera featuring Sony Pregius™ sensors - Compact with only 26.4 x 26.4 x 33 mm and lightweight with 38 grams (1)

Product

Calipers

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MRC ltd.

MRC ltd.

Measuring Range 0 - 150 mm The internal jaws measurement accuracy can accord with DIN862. Zero-setting at any position. Data output.

Product

Soil Temperature Probe

TP32MTT.03.A

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Senseca

TP32MTT.03.A - Senseca

Probe for soil temperature at a depth of 50 mm - protective shield from solar radiations.

Product

Calibration Kit

S2611

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Copper Mountain Technologies

S2611 - Copper Mountain Technologies

*S2611 Calibration Kit, * Frequency Range: up to 26.5 GHz, * Impedance: 50 Ohm, * Connector type: 3.5 mm female.

Product

Standard 1.08 (31.00) - 4.00 (114.00) Long Travel Bead Probe

BPLT-25C-4

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ECT

BPLT-25C-4 - ECT

Current Rating (Amps): 8Average Probe Resistance (mOhm): 8Test Center (mil): 100Test Center (mm): 2.54Full Travel (mil): 350Full Travel (mm): 8.89Recommended Travel (mil): 317Recommended Travel (mm): 8.05Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,460Overall Length (mm): 37.08Full Travel Remark: Standard Spring: 400 mil / 10,16 mm, Alternate Spring 400 mil / 10,16 mm, High Spring: 400 mil / 10,16 mm, Ultra High Spring: 350 mil / 8,89 mm

Product

ZIO Module With Four COM Ports And One PCI Express Mini Card

AX93262

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Axiomtek Co., Ltd.

AX93262 - Axiomtek Co., Ltd.

*Specification: 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card*Dimension: 80 x 55 mm*Accessory: 2 x COM with bracket cable*Compliant Product: CAPA840, CAPA843, CAPA880, CAPA500, CAPA313

Product

LED Solar Simulator

LumiSun-50

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Innovations In Optics Inc.

LumiSun-50 - Innovations In Optics Inc.

The LumiSun-50™ is a high power, multi-wavelength LED solar simulator that meets IEC 60904-9 Class AAA for spectral match, uniformity of irradiance, and temporal stability. The LumiSun-50 achieves a spatially uniform illumination field from a chip-on-board (COB), multiple-wavelength LED die array. The field of illumination is 50 x 50 mm at a working distance of 200 mm. The LumiSun-50 includes a driver/controller which individually provides constant current to each die in the COB array. Total irradiance of 1.1 sun units is provided and can be decreased to 0.1 suns. The LED light source of the LumiSun-50 is contained within an air-cooled housing that can rotate the angular beam alignment. Adjustment and setting of the optimum light path working distance is visually facilitated by a converging pair of red dot laser pointers.

Product

Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe

POGO-1UN-7-S

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ECT

POGO-1UN-7-S - ECT

Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02

Product

Car Accessories Material Burning Tester

ZRS-4H

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Lisun Electronics Inc.

ZRS-4H - Lisun Electronics Inc.

• Test Gas Source: Gas or Liquefied Petroleum Gas (Suggestion: Use good quality gas if possible) • Burner inner diameter: ￠9.5±0.5mm, about 100mm long with air adjusting hole • Height of flame: Can be adjusted from 20 mm to 100 mm according to the standard requirement • Applying time of flame: Burning time can be adjusted from 0 to 99 minutes 99 seconds • Test process: Automatic control • Inner volume: 0.05m³ • Material: Stainless steel or iron plate spray • Power: AC 220V; 50Hz/5A

Product

IC Cap, 1.0 mm Pitch (Brown)

PK007-011

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Teledyne LeCroy

PK007-011 - Teledyne LeCroy

IC Cap, 1.0 mm Pitch (brown)

Product

Futureproof Your Control PLD And Bridging Designs

MachXO3

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Lattice Semiconductor

MachXO3 - Lattice Semiconductor

*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch

Product

High Speed And High Resolution Cameras (PCI Cameras)

XiB

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XIMEA GmbH

XiB - XIMEA GmbH

*High speed interface with bandwidth of 20 GBit up to 64 Gbit / sec*CMOSIS / ams sensors: CMV12000, CMV20000, CMV50000*High image resolution and high throughput with 12 Mpix, 20 and 50 Megapixel*Speed of 133 - 333 Fps, 33 and 30 Fps respectively*Fast speed models with 1 Mpix at 3500 and HD at 2500 Fps*Robust PCI Express and Power/GPIO connectors*Integrated Canon EF-mount control with dynamic aperture and focus control*Support for Windows, macOS, Linux, ARM*Suitable for OEM customization and Embedded vision systems*Distances up to 300m over fiberoptic cable*Compact housing: 60 x 60 x 38 mm