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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
- Pickering Interfaces Inc.
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PXI Instrumentation Modules For Automated Test Systems
PXI-based test systems often require a variety of general-purpose instrumentation such as digital I/O, waveform generators, voltage & current sources and DUT power supplies.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Sealed Beam Bulb Testing System
H710019SSL
EOL test for manufacturing of bulbs with LED for applications requiring to ensure watertightness: vehicles, marine, swimming pools, operating rooms, classified areas (Ex Zone), etc. The test system checks in a short time all the light and electrical characteristics of the bulb. A high precision Micro Leakage Meter also checks that there are no leaks between the environment and the inside of the bulb. The test results are recorded on the PC and can be printed on a quality control label attached to each unit.
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6TL22 Off-Line Testing Platform
H71002200
Learn about our Build to print service for Test Platforms. The 6TL22 Platform is a perfect base for the conception of a real modular Automatic Test Equipment for low to mid manufacturing volumes.A system designed around the 6TL22 is simple, easy to maintain and cost effective. The rack is prepared for the direct integration of the three platform based receivers from Virginia Panel, the S6, G12 and G12X.
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Digital Test Instruments
Conduct pattern-based digital tests incorporating the latest parallel, digital, serial, and bus protocols with the PXIe-6943 digital test instrument.
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In-Circuit Test System Rentals
Forwessun offers flexible test system rental options to meet short-term or seasonal testing demands. Our rental systems are rigorously tested for reliability and performance, giving you access to high-quality equipment without the need for a full purchase commitment. Customised rental agreements allow you to return the equipment when it’s no longer required, providing an ideal solution for scaling up production or filling in during periods of high demand.
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High Speed Test Bench
AT444
AC motor with mechanical multiplying gearbox test benches allow precise programming of all drive parameters required for accurate rotating devices test.The use of special high-speed bearings, mechanical components and parts wear resistant leads to a large life. The supply includes the electronic drive and control as well as the entire oil cooling unit.
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Communication Test System
CTS-2700
The CTS-2700 is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The field-upgradeable, software-defined architecture features easy-to-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets can be created easily using the included TestEZ® software suite.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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VXI Digital Test Instrument
T940 Series
The T940 Series for the VXIbus provides the basis for a complete state-of-the-art digital solution at the subsystem level. The T940 is the solution for both legacy digital replacement and new test stations to be built for digital test including aircraft/ avionics, weapons systems, spacecraft, semiconductors and medical devices.
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Headlamp Test Platform
Leverage 25+ years of automotive test experience, with the specialized design and manufacturing of automotive lighting testers. Using specialized know-how in this field, including photometric, electro-mechanical equipment and software solutions, accelerate your time to market with a higher quality product.
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In-Circuit Test (ICT) Fixtures
At Forwessun we support and manufacture In-Circuit Test Fixtures for a range of Test Systems. We regularly build fixtures that are supported on a range of systems including - - HP3070- Agilent- Keysight- GenRad- TeradyneWith over 50 years in the industry, we provide a weatlth of knowledge and support to our customers. We are a global company and can support businesses all over the world with the help of over 30 experienced test engineers.
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In-Circuit Test Systems For Sale
Forwessun offers a comprehensive range of global services for a variety of Test Systems. We provide refurbished systems that have undergone rigorous testing, giving you reliable performance at a fraction of the cost of new equipment. Whether you’re looking for a long-term solution to enhance your testing capabilities or a temporary setup to meet increased production demands, we have flexible options to suit your needs. - HP3070- Agilent - Keysight- GenRad- Teradyne Our bespoke rental agreements make it easy to scale up without permanent investment—simply return the system when it’s no longer required. For ongoing support, we offer calibration, repair, and maintenance services through convenient service contracts. If you’re looking to retire any outdated or non-functional In-Circuit Test (ICT) systems, we’ll offer fair market prices, helping you maximise value on any surplus equipment.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Functional Test
xUTS
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Custom Test System Solutions
No time to think about test? One-size-fits-all testers not ideal? Existing solution no longer fits your needs? Then count on integrated test solutions from Astronics. We’ll assist you with your test strategy and your test system, setting you on the path to market at a pace and ROI that ensures your program success.
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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FPD Tester Model
27014
Chroma 27014 Flat Panel Display Tester is a complete testing solution that meets the Liquid Crystal Module testing requirements of production line. With integrated video generator, multi-channel precision power supply and process control unit, the system allows a complete test of signal, pattern and electrical parameters of LCM through a PC or remote control box.
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Configurable Functional Test System
ATS-5000
Maximize the uptime of your most critical electronics with the ATS-5000 Functional Test System from Astronics Test Systems. Deployed globally for more than 20 years, the newest version of this tester provides a configurable, affordable solution that delivers just enough test.
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Radio Frequency, Communications, & Navigation Test Systems
Reduce testing time and costs with the Astronics radio test sets for use in military, avionics, and civil security industries.Available in commercial and military grades, these integrated test systems make it easy to develop test program sets and leverage them securely and instantly across all deployed testers at the factory, depot, and operational levels.
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Batterie Inspektor
By combining the most diverse hardware and software modules, Batterie Inspektor™ delivers innovative, automated, and digitalized battery testing at every stage of manufacturing. With this flexible test platform, all modules can be adapted to their respective quality requirements. Manufacturing is simplified through a scalable and standardized framework for both new projects and upgrades.
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Laser Diode Reliability Burn-In / Life-Test System
58602
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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128 DIOs JTAG Boundary Scan Resources Unit
YAV9JTAG
Boundary-scan is a widely practiced test methodology that is reducing costs, speeding development, and improving product quality for electronics manufacturers around the world. By relying on an industry standard, IEEE 1149.1, it is relatively quick, easy, and inexpensive to deploy a highly effective test procedure. In addition, today’s PCBs have little alternative because of limited access to board-level circuitry.
