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BGA
Surface mount chip package, which uses solder balls for its connectors.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Digital Demultiplexers
Advanced Science and Novel Technology, Co., Inc.
24:48 digital demultiplexer (DMUX) with SSTL1.5 input and output interfaces.Supports data rates from 1.0Mbps to 2.0Gbps.User-controllable independent internal delays for data and clock signals.1.5V I2C control interface with a user-defined 3-bit chip address.Preset function for synchronization of multiple parallel devices.Full-rate output copy of external high-speed clock input signal.Two pairs of clock divided-by-2 and synchronous clock enable outputs for supporting the tree-type demultiplexation structure.Additional synchronous clock divided-by-4 output.Dual power supply of +3.0V and +1.5V.Industrial temperature range.Low power consumption of 2.1W at 2.0Gbps.Available in custom 256-pin BGA package (13mm x 13mm x 2.5mm).
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Write!BEFORE Socket Programmer
Socket Adapters are printed circuit boards that connect the programming sites to the base unit. The Socket Adapter (SA) includes the appropriate socket (DIP, SDIP, SOIC, QFP, BGA) and the appropriate electrical connections for programming a specific device.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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JTAG / Boundary-Scan Circuit Debugging Software
TopJTAG Probe
TopJTAG Probe is an easy-to-use boundary-scan (IEEE 1149.1 JTAG) based software for hardware debugging. The software allows to view and control pin states of the devices in a JTAG chain. TopJTAG Probe can be of invaluable help to monitor/control pins of fine-pitch and BGA chips and to check PCB interconnects for shorts and opens.
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DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Automatic Test System
Star-Rec
Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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HDMI/DVI Receivers
HDMI® receivers and DVI receivers remain in high demand for professional, consumer, and automotive video applications, with HDMI nodes constantly increasing. Analog Devices offers a range of HDMI/DVI receivers that enable high quality conversion of digital video data to formats such as HDMI, MIPI, and TTL. Applications include video distribution, gaming, and HDMI/DVI consumer device connectivity for automotive infotainment systems. Our portfolio of HDMI receivers and DVI receivers offers competitive advantages such as automotive qualification, superior HDMI/DVI equalizer performance, comprehensive audio extraction, and small packages (6 mm × 6 mm, 0.5 mm pitch BGA).
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Futureproof Your Control PLD And Bridging Designs
MachXO3
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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SMT Rework Station
RW1210
Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Detective Logic Analyzer
DDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsRow Hammer Analysis for potential data corruptionInteractions among up to 8 ranks, over two slots are analyzed.Mode Register Listing providedSupports Auto-Clock rate detect and clock stoppage Connects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Single Site Test Handler
3210
Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
