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CSP
Test connector assemblies that mate with the pads on an integrated circuit's chip size packaging.
See Also: WLCSP
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Universal Programmers
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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ISL911xx Family Of Buck-Boost/Boost Regulators
The ISL911xx buck-boost regulator family is capable of working with the ultra-small inductors and capacitors to fit within less than 14mm2 board footprint, making them the ideal 2A switching converter solution for space-constrained mobile devices. The advanced wafer-level CSP package requires only a single inductor and very few external components, which minimizes overall space requirements. The ISL911xx regulators’ 2.5MHz switching frequency further reduces the power supply solution size.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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End-to-End Network Monitoring
OSIX
Network monitoring with tracing and troubleshooting capabilities to achieve first-class customer experience and to proactively prevent network and service quality degradation. OSIX Monitoring enables Communication Service Providers (CSPs) to detect and resolve network issues or poor performance before end-customers are affected.
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Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Solar Spectrophotometer
INCUS
INCUS is a portable spectrophotometer that allows the measuring of the receiver tube optical properties in the solar field of a parabolic trough CSP plant.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Ultra High Speed Pick & Place
MC889
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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BGA Rework Station
PDR IR-D3 Discovery
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
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Digital Multi Channel Analyzer
DT5770
The DT5770 is a compact portable 16k Digital MCA for Gamma Spectroscopy, integrating analog front-end with programmable gain and possible AC coupling. It is ideally suited for high energy resolution semiconductor detectors, like HPGe and Silicon, connected to a Charge Sensitive Preamplifier (CSP). The unit can also properly operate directly connected to a PMT with inorganic scintillators (e.g. Nal or Csl scintillators), provided exponential pulse shape and decay time above 200 ns.
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Standard 3.06 (86.70) - 4.00 (113.40) RF Probe For SMA Connectors
CSP-30ES-013
Nominal Impedance (Ohms): 50Current Capacity (Amps) @ 20° C: 1.00Bandwidth @ -1dB (GHz): 35.00Return Loss @ -20dB (GHz): 22.00Test Center (mil): 328Test Center (mm): 8.33Recommended Travel (mil): 100Recommended Travel (mm): 2.54Full Travel (mil): 200Full Travel (mm): 5.08Overall Length (mil): 1,033Overall Length (mm): 26.24Rec. Mounting Hole Size (mil): 297Rec. Mounting Hole Size (mm): 7.54
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DC Power Supply
CSP-2
● A wide range selectable to meet various application● 230K~300Khr. MTBF● RoHS version in option● Compact size with DIN rail mounting
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Standard 0.80 (22.00) - 4.00 (114.00) High Frequency Probe
CSP-03G-003
Current Rating (Amps): 6Bandwidth @ -1dB (GHz): 3.70Return Loss @ -20dB (GHz): 1.80Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Test Center (mil): 300Test Center (mm): 7.62Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Overall Length (mil): 1,090Overall Length (mm): 27.76
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Standard 1.90 (53.90) - 8.00 (226.80) High Frequency Probe
CSP-40B-012
Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Full Travel (mm): 5.08Full Travel Remark: Shield: 275 (6.99) including travel of probesRecommended Travel (mil): 133Recommended Travel (mm): 3.38Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,151Overall Length (mm): 29.24
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Standard 0.79 (23.40) - 1.75 (49.60) High Frequency Probe
CSP-40A-024
Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Recommended Travel (mil): 133Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,231Overall Length (mm): 31.28Full Travel Remark: Shield: 225 (5.72) including travel of probes
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Standard 0.80 (22.00) - 4.00 (114.00) High Frequency Probe
CSP-03B-006
Current Rating (Amps): 6Bandwidth @ -1dB (GHz): 3.70Return Loss @ -20dB (GHz): 1.80Dielectric VTE Rating (k VAC): 1Nominal Impedance (Ohms): 50Test Center (mil): 300Test Center (mm): 7.62Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Overall Length (mil): 1,090Overall Length (mm): 27.76
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Hybrid Socket
CSP/Ballnest
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Standard 1.90 (53.90) - 8.00 (226.80) High Frequency Probe
CSP-40L-013
Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Full Travel (mm): 5.08Full Travel Remark: Shield: 275 (6.99) including travel of probesRecommended Travel (mil): 133Recommended Travel (mm): 3.38Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,151Overall Length (mm): 29.24
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Standard 1.59 (40.40) - 7.00 (198.50) High Frequency Probe
CSP-30TS-011
Nominal Impedance (Ohms): 50Current Capacity (Amps) @ 20° C: 1.00Bandwidth @ -1dB (GHz): 35.00Recommended Travel (mil): 67Recommended Travel (mm): 1.70Full Travel (mil): 100Full Travel (mm): 2.54Overall Length (mil): 1,003Overall Length (mm): 25.48Rec. Mounting Hole Size (mil): 213Rec. Mounting Hole Size (mm): 5.40Test Center (mil): 375Test Center (mm): 9.53
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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DC Power Supply
CSP-3
● Universal power AC90~264V/DC127~380V● Build in power factor control circuit in high power model(120W~500W)● Available for series and parallel operation● To be a Back up power function with relay output in option( not available in model 20W and 24W)● RoHS & UL version in option● DIN rail mounting
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Standard 0.79 (23.40) - 1.75 (49.60) High Frequency Probe
CSP-40G-021
Your product description goes here.
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Standard 6.20 (175.20) - 8.00 (226.80) High Frequency Probe
CSP-40A-015
Bandwidth @ -1dB (GHz): 6.00Return Loss @ -20dB (GHz): 2.30Nominal Impedance (Ohms): 50Dielectric VTE Rating (k VAC): 1Test Center (mil): 250Test Center (mm): 6.35Full Travel (mil): 200Full Travel (mm): 5.08Recommended Travel (mil): 133Recommended Travel Remark: Shield: 211 (5.36) including travel of probesOverall Length (mil): 1,231Overall Length (mm): 31.28Full Travel Remark: Shield: 275 (6.99) including travel of probes
