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Chucks
Hold DUTs in place.
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Probe Station
EPS500
Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided. - Maximum 6pcs of manipulators can be installed on the base unit of probe station EPS500.
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Torque Gauges
Digital torque gauges are designed for clockwise and counter-clockwise torque testing. The Jacob’s chuck is a versatile attachment and can be used for a variety of applications.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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ECHO VS System with Image Enhancement
Echo VS
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Optical Fiber Identifier
OrienTek Optical Technology Ltd.
Optocal Fiber Identifier Economical Solution for Integrated Fiber Preparation Tool Demand● 4 easy-change chucks for:bare fiber, patch cords & ribbon fiber● Identifies 3 common test tones● Identifies dominant traffic direction, audible alarm● Approximate core power reading● Low false detection & insertion loss● Very easy to operate● Battery low indication
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High Temperature Chucks
High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Coordinate Measuring Machines
ScopeCheck® V
Precise measurement of cylindrical workpieces (tools, shafts etc.) using application-specific sensors in a production environmentHeavy duty granite base with CNC air bearing rotary axisIntegrated vertical rotary axis for rapid measurement of diameters, planes, holes, and cutting and clearance angles with optical and tactile sensorsAll industry standard tool holders and chuck systems are available on the rotary axisUnique design allows easy integration of additional sensors for increased flexibilityProtected enclosure for measurement on the production floor
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±3 kV Electrostatic Chuck Supply
Model 646
Trek’s Model 646 software-driven Electrostatic Chuck Supply offers an array of features that provide significant benefits while accommodating a variety of demanding applications. Model 646 incorporates Trek technology which has demonstrated increases in efficiency and throughput equal to three times that of other supplies. Virtual elimination of sticky wafer and wafer popping issues ensures better control over particle contamination. Given the versatility and performance of the Model 646, it can be used in multiple unique tools/processes, thus eliminating the need to specify a new supply for each unique tool/process in a facility.
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Probe Card Analyzers
PB6800
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Probe Station
EPS300
Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Spring Stiffness Testing Machine
STB Series
Jinan Testing Equipment IE Corporation
STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.
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Tabletop Mask Aligner
Model 200
The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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TLP Probe Arm Kit
TPA-95
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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Heavy Duty RV Tire Pressure Gauge
DURABLE BUILD: Superior quality steel and components are protected by a rugged rubber guard; Tough, anti-slip grip holds up to any job; Built tough to measure from 0-230 PSI with accurate readingSPECIALIZED CHUCK: Extended chuck tip to form a great seal with no air leakage; Dual-head air chuck painlessly reaches all your vehicles' valves from any angle; Durable rubber hose and an extended head chuck make it easier to get a good fit on awkward valves
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Probe System for Life
PS4L
The Probe System for Life, or PS4L, is SemiProbe’s patented adaptive probe system architecture. Unlike traditional probe systems, all of the basics components of our systems, including the bases, stages, chucks, microscope mounts, and manipulators, are interchangeable, upgrade-able, and configurable. The PS4L Adaptive Architecture ensures and optimal test configuration for each individual customer application.
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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High Voltage Power Supplies
DR5 Series
The DR5 system comprises: DR5A host controller; and DR5V high-voltage chuck power supply with adaptive grip and release.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Metal Foil Chucks
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
