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Ion Beam Deposition
Create ultra-precise, high-purity, thin film layer devices with maximum uniformity and repeatability with Ion Beam Deposition (IBD) Systems.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Aerosol Generators & Dispersers
Aerosol generators and dispersers play a vital role in producing the defined aerosol required for an array of aerosol testing, production, and research. Applications requiring aerosol generation are very diverse, and include, but are certainly not limited to, filter testing, deposition of nanoparticles onto surfaces, vacuum-cleaner performance tests, and calibration of aerosol instruments.
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Pulsed-DC Systems
Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova Measuring Instruments Inc.
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Ozone Generators & Systems
MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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2 MHz RF Plasma Generators
NOVA® Series
The NOVA ; RF Plasma Generators are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Vapor Concentration Monitor
IR-300 Series
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Ozone Gas Generators
SEMOZON® Ozone gas generators and subsystems are the industry standard for compact, high concentration, ultra-clean ozone gas generation. Applications include Atomic Layer Deposition (ALD), Atomic Layer Etch (ALE), Chemical Vapor Deposition (CVD) and Wet Cleaning.
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kSA RateRat Pro
kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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Excitation Sources
SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
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In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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Burnbox & Scrubber Systems
MODEL BBS-10-LM
Safe, low costing, and minimal maintenance exhaust gas abatement equipment designed for years of continuous operation. Systems designed to significantly diminish toxic, corrosive, flammable, and pyrophoric gas exhaust to safe levels. Ideal for treating the exhaust effluents from process systems such as a deposition and etch reactor. Burnboxes, scrubbers and combinations are available, tailored to suit your exact requirements.
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Handheld Ultrafine Particle Size Distribution Measurement.
partector 2 Pro
Naneos Particle Solutions gmbh
The naneos partector 2 Pro version is a further development of the well-established Partector 2. The Pro version of the partector 2 can additionally switch through different deposition voltage levels and therefore scan an 8-channel size distribution of an aerosol of interest.
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Grid Electrode
Grid electrode is produced by the deposition of the platinum, gold or carbon onto the quartz glass. The dimension of the glass is 8 x 27 mm, with a 1 mm of the thickness, and the grid line is 100 m width with a distance of the 150 m between lines.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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Vaporizers
Vaporizers are the backbone of gas phase processes, serving as the catalyst for converting liquids into essential gases. This transformative process is indispensable in a myriad of applications, ranging from precision thin film deposition to critical procedures like metal etching and doped epitaxial growth.
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Particle Deposition Systems
MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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PLD/PED Components
Neocera offers a variety of components that can be fitted and combined into new or existing PLD and PED systems to provide improved functionality and enhanced capability. Components include:*Oxygen-compatible substrate heaters for epitaxial oxide film depositions..*Automated Target Carousels for preparing multilayer heterostructures.*Deposition chambers design specifically for PLD and PED systems.*Manual and automated laser window-change Accessories.*Pulsed Electron Deposition (PED) sources for laser transparent materials.*Ideal for retrofitting existing systems or construction of new systems.
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Liquid Flow Controller
Built upon field proven technology, the Turbo™ Liquid Flow Controller (LFC) 2950 was engineered to pair with MSP Turbo II™ Vaporizers to provide a reliable, high-performance liquid vapor delivery solution for semiconductor thin film deposition processes (including CVD, PECVD, ALD, and MOCVD). The diagram below shows how the LFC fits into the liquid vaporization system MSP offers.
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Particle Deposition Systems
Sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Parylene Deposition Equipment
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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High Temperature Absolute Pressure Transducers
Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Chemical Vaper Deposition R&D System
MODEL CVD-300-M
High Temperature, 1080 C (24" Hot Zone: 126 Cubic In.) High Purity Quartz Tube with Water Cooled End Caps. Broad Pressure Range of Atmosphere to 10-3 Torr. Upgradable to High Vacuum. Computer Interfaceable. Small Footprint (26" x 48"), Portable with caster mounts.
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Copper PCB
The Amitron process is capable of producing 20 plus ounces of finished copper and reliably spray coat a protective and consistent solder mask with imaged nomenclature. Amitron utilizes a unique process referred to as "Laminated Deposition". This combination of processes allows extreme copper thickness requirements to become very practical and cost effective. The process utilizes heavy base copper that when placed in our plating and etching systems will deliver consistent and reliable high power circuits.
