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FIB
Focused Ion Beam
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product
Focused Ion Beam Scanning Electron Microscopes
FIB-SEMs
Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB).
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Defect Isolation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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MultiBeam System
FIB
An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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Microelectronics Test & Engineering Services
EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
