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Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Virginia Panel Corporation
product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Measurement
Multichannel Strain Gauge Meter
The Software Multichannel strain gauge meter is used for performing all types of strain gauge measurements using strain gauge sensors (for instance, force and torque sensors, bridge and semi-bridge circuits based on resistive strain sensors), strain measurement data acquisition modules ZET 017-T and digital strain gauge sensors of ZETSENSOR series. The program enables simultaneous processing of up to 128 measuring channels using strain gauge station and up to 500 measuring channels in the case if digital sensors are used.
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UV Measurement
The UV measuring system with the tesa UV Strip and the UV Scan from Hönle is suitable for the reliable testing of the UV dose on the object.
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Level Measurement
Displacer level gauge for liquids from KOBOLD Instruments operates on the Archimedes principle. The level gauge's displacer tube rests inside the tank and is connected to the measuring unit via a spring. As liquid level increases, the buoyant forces of the liquid act on the displacer tube to reduce spring tension, allowing the spring to expand. The spring connects to a magnetic actuator, and the motion of the actuator is picked up by a magnetically linked indicator to yield the tank level measurement. The displacer level gauge is calibrated at the factory for the user's specified liquid density. Special designs with higher pressure or temperature ratings, as well as those made of exotic materials, are always available on request.
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Measurement Systems
Systems used in the process of associating numbers with physical quantities and phenomena.
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Measurement Software
Measurement Software – Comfortable software solutions from MCD allow the user an efficient acquisition and evaluation of specific test data. Especially in the audio and video analysis areas they are most often the cheaper solution to expensive hardware.
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Test & Measurement
Test & Measurement refers to all industrial applications in which microscopic structures have to be displayed and analyzed.
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Temperature Measurement
HighReach Measuring & Controlling System Co.,Ltd
Describes the process of measuring a current temperature for immediate or later evaluation.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Measurement Systems
MicroMeasure3D
Sciences et Techniques Industrielles de la Lumière
STIL MicroMeasure3D, PORTICO3D and MAESTRO3D are measurement systems designed to achieve true 3D metrology of each point for the most demanding applications adapted to Industry 4.0 standards.
