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Thermal Shock
stress testing by rapidly changing temperature.
See Also: Thermal, Shock, Thermal Test, Thermal Shock Chambers
- Pickering Interfaces Inc.
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LXI EMR Low Thermal EMF Matrix 14x33
60-511-004
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Security/Detection
ST120 Dual
A two-channel silicon-based thermopile in a TO-5 package. Each small active area is 1.2mm x 1.2mm . Time constant of 25ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Temperature Measurement IR Sensors & Detectors
ST60 TO-5
A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 0.61mm x 0.61mm in a TO-5 package. Time constant of 18ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Thermal Shock Chambers
Shanghai Morningtest Environmental Chambers Co.,Ltd.
Thermal Shock Chambers are designed for the safe, efficient, and accurate environmental testing of electronics and consumer products, and aerospace, telecommunications, and military and defense components.
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Thermal Shock Chamber
The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Flash Diffusivity Analyzers
The Light Flash technique provides information on a material’s ability to store and transfer heat through measurements of thermal diffusivity, thermal conductivity, and specific heat capacity. Thorough understanding of these properties is critical for any process or material which experiences a large or fast temperature gradient, or for which the tolerance for temperature change is exacting. Accurate values of these properties are essential for modeling and managing heat, whether the component of interest is called on to insulate, conduct, or simply withstand temperature changes. Information about these properties is routinely used in heat transfer models of all complexities. Heat transfer property measurements also reflect important information about material composition, purity and structure, as well as secondary performance characteristics such as tolerance to thermal shock.
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Thermal Shock Chambers
Weiss Technik Thermal Shock chambers are designed to give quick transitions between a HOT and COLD temperature zones. Available in vertical, horizontal and liquid models. Thermal stock chambers are used in all industries including Automotive, Electronics, Aerospace, and others to help find product defects in electronic components and product assemblies. Thermal shock is important with MIL -STD 883 test standard.
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Lithium Battery Test Chambers
Dongguan Amade Instruments Technology Co., Ltd
Lithium battery test chambers are used to simulate various extreme conditions such as crush, impact, penetration, overcharge etc the lithium ion cells and batteries are subjected to during use, transportation, storage and disposal to determine the safety performances, tests including altitude simulation test, thermal test, vibration test, shock test, external short circuit test, impact/crush test, overcharge test, discharge test etc based on UN38.3, IEC62133, UL1642 standards. Applicable to communication products, computer products, consumer electronics, automobile power supplies and so on.
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Liquid Thermal Shock Baths
TSB Series
CSZ's Liquid thermal shock chambers consist of separately controlled hot and cold baths. Product is submersed in fluid and thermally stressed between the hot and cold baths, resulting in immediate product temperature changes. CSZ uses perfluorinated fluid that does not coat the product or conduct electricity for use in both the hot and cold baths to eliminate cross contamination and reduce evaporation losses.
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Thermal Shock Testing
Thermal shock is a very important test for determining the reliability of a product when subjected to sudden changes in temperature and how this stress source can accumulate deterioration or physical damage in performance.
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Temperature Measurement IR Sensors & Detectors
ST150 With Diffractive Lens
A single-channel silicon-based thermopile with integrated diffractive lens and internal baffle that delivers a very low Temperature Coefficient of Responsivity of -0.04%/C with a high output voltage, 19.5 FOV and a quick time constant of 38ms. This Low-cost detector comes in a TO-5 package and has a very short thermal shock response to ambient temperature change.
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500W to 1500W - Single Output
LZSA Series
*Five year warranty*-40°C to +71°C Operation*MIL-STD-810E Vibration / Shock*Input transient protected*UL508, SEMI F47, Factory Mutual (Cl 1, Div 2)*Rugged design with conformal coating*Superior thermal design
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Temperature Measurement IR Sensors & Detectors
ST120 TO-5
A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 1.2mm x 1.2mm in a TO-5 package. Time constant of 25ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Thermal Shock Testing
DATASYST Engineering & Testing Services, Inc.
Thermal shot testing is a accomplished through the use of two-zone temperature chambers where the unit under test is shuttled between chambers.
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Thermal Shock Chamber
Allows for the rapid transfer of products between temperature extremes, or the alternating heating and cooling of test articles in cyclical manner.
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2 Zone Thermal Shock Test Chamber
2-Zone Thermal Shock Testing Equipment with programmable electronics.
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Liquid-To-Liquid Thermal Shock Chambers
TSB Series
Purchasing a liquid thermal shock chamber needs close consideration of the long term operating costs. The specialized liquids used can easily evaporate, causing the loss of thousands of dollars of fluid per year, if not properly contained. ESPEC has led the industry in developing a sophisticated test chamber with multiple mechanisms to significantly reduce fluid usage. The new TSB-51 loses just 1.4 grams per test cycle, or less than a liter per 1,000 cycle test.
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CompactPCI
6U PMC Carrier
This conduction cooled 6U CompactPCI dual slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens the carrier and PMC module enabling the board to resist high shock and vibration.
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RELIABILITY BOARD (Reliability Test Board)
The reliability test board is used for testing of HAST, THB, HTOL, BURN-IN, etc. It is a product that evaluates the environmental test and durability when applied to actual products such as lifetime test, high temperature, low temperature, high humidity and thermal shock
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Small Form Factor Mission Computers
Curtiss-Wright Defense Solutions
Our commercial off-the-shelf (COTS), small form factor (SFF) mission computer systems feature modular, expandable designs that pair powerful graphics and data processing capabilities with ultra-reliable mechanical robustness. The Parvus DuraCOR line of field-tested, MIL-STD qualified mission processors has been proven in the harshest C5ISR applications, performing reliably under thermal, shock, and vibration extremes.
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Vertical Thermal Shock Chambers
FSV Series
Bemco FSV Series Vertical Thermal Shock chambers are available in two zone (FS2V - hot and cold) and three zone (FS3V hot - cold - hot) versions, with two temperature ranges (-75 C to +200 C or -160 C to +200 C), and two types of cooling systems (all mechanical cooling - no expendable refrigerant required, or all LN2). Very low temperature, -160 C chambers, are always liquid nitrogen cooled. Two zone chambers are offered in four standard sizes, while three zone chambers are offered in three standard sizes.
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Capacitance Standard Frame
AH 1100
The AH 1100 capacitance standard frame containing from one to four AH 11A fused-silica capacitance standards provides reference capacitors of unexcelled stability. The inherent stability of this system when subjected to mechanical or thermal shock makes it the ideal transfer standard for capacitance. The built-in precision temperature controllers make it a simple, reliable system to use.
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Laser Power and Targeting
ST60 Quad
A four-channel silicon-based thermopile detector in a TO-5 package. Each small active area size is 0.61mm x 0.61mm. This is our lowest-cost and fastest time constant four-channel detector. It delivers a time constant of 18ms with Nitrogen encapsulation gas combined with a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Material Test/Cure Rooms
Our walk-in Materials Test and Cure Rooms offer reliable, efficient environmental controls for a variety of applications including shelf-life testing and storage, ceramic and concrete wet and dry cure regimens (including ASTM-compliant units), thermal shock chambers, general, medical and packaging materials.
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Silicon Based Thermopile Detector: 4 Channels
ST150 Quad
A four-channel silicon-based thermopile detector in a TO-8 package. Each active area size is 1.5mm x 1.5mm. Affordable four-channel design with strong output and a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Environmental Testing
Environmental testing capabilities include: High and Low Temperature Testing including Thermal Shock. Humidity Testing to 100% Relative Humidity at High and Low Temperatures. Altitude Testing to 100,000 Feet. Combined Vibration, Temperature and Altitude Testing. Mass Spectrometer for Leak Testing. Vibration Testing to 50 G's and 3000 Hz including Resonance Scan, Cycling, and Endurance. Free Fall Half Sine Wave Mechanical Shock Testing to 100 G's
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Environmental Test Chambers
Infinity Machine International Inc.
Environmental Test Chambers by Infinity Machine International Inc. - for applications such as hydrostatic test chamber for soles, thermal shock chambers, temperature and humidity test chambers, rainproof testers, UV light testing, and more.
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Temperature Measurement IR Sensors & Detectors
ST60 TO-18
A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 0.61mm x 0.61mm in a small TO-18 package. Time constant of 18ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Temperature Measurement IR Sensors & Detectors
ST60 LCC
A single-channel silicon-based thermopile in a LCC package for surface mount assembly in a small active area of 0.61mm x 0.61mm. Time constant of 18ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature chang
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CompactPCI
3U PMC Carrier
This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.