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Thermal Test
Designed to produce a temperature change in a device. The magnitude and rate of this change should induce a sufficient thermal stress fatigue to identify sources of potential failure without causing catastrophic failure of all components. (sigmasystems.com)
See Also: Thermal, Thermal Shock
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Thermal Test Chip
Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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Thermal Shock Test Chamber (Three Zone)
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Test Chamber (3 Zone) consist of the Test Zone, Heat Storage Zone and Cold Storage Zone. The specimen stay in test zone, hot and cold air will be blew from the storage zones to achieve rapid temperature change for thermal shock.
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MCB Thermal Verification Test Bench
The test system is a special version of the thermal test test system in the sense that the test jig is primarily designed to hold and connect multi pole MCBs for thermal verification so that each pole can be verified to trip within the IEC time band after the MCB has been riveted. This test ensures the trip verification of MCB so as to trip all the 4 poles at once when overload is detected in one single pole. In short, this is a verification-only bench.
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Thermal Abuse Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's Thermal abuse test chamber is suitable for standard IEC 62133-2017, UL 1642 and GB 31241-2014.
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Thermal Test Enclosure, -90°C To +220 °C, ≥100 DB, 300 MHz - 18 GHz
dbSAFE TSE
Compatible with all platforms of temperature forcing units and thanks to the DVTEST “waveguide” technology; isolation performance will not be impacted. The temperature range of the units will be -90°C to +220°C.
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Device Thermal Test Systems
Thermal Engineering Associates, Inc.
Thermal test system combines the test and measurement capability of dedicated instruments with the ease of operation and data collecting capability offered by graphical-user-interface-driven software operating on an integrated computer.Diodes (PN, Schottky, LED, varactor, PIN), Stacked Diodes (Hi-V Rectifiers & LEDs), Laser Diodes, Transistors (Bipolar, MOSFET, IGBT) & Diodes, Integrated Circuits (Application & Thermal Test Die).
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Thermal Shroud
BC8-55/150C
When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Climatic Test Chamber
Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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Environmental Testing
Environmental testing typically involves hot or cold temperatures, humidity, altitude (vacuum) or thermal shock. This testing can even be combined with other test methods such as vibration or shock.
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Temperature Chambers For Thermal Tests
Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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EV Battery Pack Test Equipments
Guangdong Bell Experiment Equipment Co.,Ltd
All industrial battery tester from BELL lithium battery test chamber supplier meet the standards of GB31467.3, ECE-R100 and UL2580. The tests mainly simulating all the condition that driving an EV meet, including battery crush test, battery drop test, flammable test, temperature cycle test, short circuit test, thermal test, explosion test, and environmental test, etc.
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OSFP 800G
OSFP800 has emerged as a leading standard to drive the development of 800G ecosystem. The MultiLane OSFP800 development kit is an essential tool to ensure the validity of your OSFP800 products. The module compliance board (MCB) is used to test transceivers, AOCs, active cables and DACs, while the host compliance board (HCB) enables the testing of system host ports. The loopback modules (LB) provide an economical way to test thermal capacity and signal integrity of system host ports at every stage of the process: R&D validation, production testing, and field testing.
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Environmental Test Chamber
High and Low Temperature Test Chambers, ESS Environment Stress Screening, 2 Zone Thermal Shock Test Chamber, 3 Zone Thermal Shock Chambers, Walk-In Chambers, Burn-in Room and Aging Test Chambers, Altitude Chambers, Industrial Drying Oven, Salt Spray Test Chambers, Temperature Humidity Vibration Comprehensive Test Chamber, Test Machine Series, Custom Made Environmental Test Equipment, Double-Layer High and Low Temperature Chamber, Explosion Proof Temperature Chamber For Power Battery, etc.
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Primary Current Injection Testers
Primary current injection tests are carried out during commissioning and certification of various types of switchgear and current transformers (CT), as well as during diagnostics of grounding circuits, testing circuit breakers and other devices. Primary current injection testers can also be used for determining the terminals polarity and transformation ratio of current transformers, thermal testing of electrical devices, testing automatic reclosers and sectional disconnectors.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Thermal imagers
Thermal imagers sensitive in MWIR and LWIR spectral bands are one of crucial surveillance technologies for defense/security sector. These imagers have also found mass applications outside defense sector. Testing thermal imagers is needed for both manufacturers, maintenance workshops and final users for a set of different and important reasons. Hi-tech test equipment can help significantly in manufacturing, maintenance, training, purchase optimization, and optimal use of these expensive imagers.
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Temperature Calibration System
Thermal Engineering Associates, Inc.
Systems for determining relationship between temperature-sensing junction voltage versus junction temperature of diodes, integrated circuits and thermal test die. Provides internal current sources, voltage measurement to 1 mV, and temperature measurement to 0.1ºC. 16-channel capability with optional printer and serial port data output.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Targets
Targets from group A are developed to support mostly testing infrared imaging systems understood as thermal imagers. These targets can be used also in testing visible/near infrared cameras or SWIR cameras but such application is not optimal. IR targets are mostly used in DT systems for testing thermal imagers and in MS systems for testing multi-spectral systems.
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OSFP-XD Thermal Load with a Controller Board
In an everchanging industry, new form factors are launched to support higher speeds like 800G and later, 1.6T. With the speed per lane increasing exponentially, the need for thermal and cooling tests also rises with new requirements and demands.MultiLane is offering a OSFP-XD thermal load with a controller board, with the goal of emulating transceiver thermal behavior, but also to test cooling systems.
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Thermal Shock Test Chambers
How well does your product stand up to the shock of extreme thermal temperature changes? Tenney Environmental's thermal shock test chambers take products from 200°C to -65°C in just seconds.
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Mechatronics
MERA performs design, construction, supply, installation and certification of stands for various testing types:● static loading● dynamic and life-cycle● transporting testing (vibration table)● thermal testing● centrifuges● modeling of take-off, landing modes, etc.
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Hybrid Single Site Test Handler
3110
Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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Singlebeam Hydrographic Echosounders
Teledyne Marine Odom Hydrographic
Odom Hydrographic provides an extensive range of hydrographic level single beam echosounders with the flexibility of frequency agility supporting existing transducer installations. Models include modern PC screen based interfaces as well as support for tried and tested thermal record printing.
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Thermal Shock Environmental Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc. The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.
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Relay Test Equipment
Vanguard Instruments Company, Inc.
The VIC Model PCI-600 is a programmable, high-current source that is designed specifically for utility-substation applications. This alternating current(ac) test device is used primarily for injection testing of protective relays. This same device can also be used for testing thermal, magnetic and solid-state motor-protection relays and molded-case circuit breakers. The PCI-600 is versatile and can also be used in many other applications that require a high-current source.
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
