ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
Categories
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product
3U Intel® Celeron® 2000E 2.2GHz Processor-Based PXI Controller
PXI-3930
The ADLINK PXI-3930 PXI embedded controller, based on the Intel® Celeron® 2000E 2.2GHz processor matches superior performance with an unprecedented price point. Specifically conceived for hybrid PXI-based testing systems, the ADLINK PXI-3930 delivers a rugged and stable platform for a wide variety of testing and measurement applications.
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PICMG® 2.11 47-pin Hot-Swap Redundant 3U CompactPCI® 8HP 250 W Power Module
cPS-H325/110
- PICMG® 2.11 CompactPCI® Power Interface compliant- Internal OR-ing Diodes for N + 1 redundancy- PICMG® 2.11 47-pin CompactPCI® in-rack power module interface- 250 W DC output- Active PFC (Power Factor Correction) meets IEC1000-3-2 Harmonic Correction
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SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Control/Gateway/Display All-In-One Industrial Panel PC
PanKonix Series-HMI Panel PC
The PanKonix® series HMI is an Intel® Core™ i3/i5 and Intel Atom® x5/x7-based panel PC equipped with user-friendly, full-featured HMI software. It ensures seamless PLC connectivity through Modbus protocol support and incorporates trend charts, data logging, alarms, and cloud connectivity functions with RESTful API, MQTT, and OPCUA support for efficient data visualization and machine monitoring.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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32-CH Discrete Input Daughter Board Module
HSL-DI32-DB-N
*Slave ID consumption: 2 - N: for 32-CH NPN sinking type sensor inputs or dry contact*Photo couple isolation voltage: 2500Vrms*Input impedance: 4.7KΩ*Input current: ??10mA (Max), ??12.5mA (Peak)*Input voltage: ??40V (Max)
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Encoder & Trigger
High performance counter and multifunction I/O cards and trigger boards provide a variety of mapping functions between comparator and trigger output.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Industrial Mini-ITX Motherboard With 14/13/12th Gen Intel® Core™ I9/i7/i5/i3 Processors
AmITX-RL-I
- 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 processors and Q670 chipset, up to 65W- Dual-channel DDR5 4800 MHz memory up to 64 GB- Quad. independent display: HDMI 2.0b, HDMI 1.4b, DP 1.4a, LVDS or eDP- Dual GbE ports: 1x 1GbE, 1x 2.5GbE- Expansion slots: 1x PCIe x16, 4x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 2x M.2 M-key- Support ATX (24+4 pin) or 12V DC-in power input
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9U 8-Slot CompactPCI® Chassis with Redundant Power Supplies
cPCIS-3330 Series
The cPCIS-3330 Series is a 19" 8-slot 6U CompactPCI Subsystem ideally suited to Network Equipment Providers, Computing Telephony Integrators and Voice over IP applications. This flexible and reliable development platform with optimized I/O and storage provides the best solution for equipment manufacturers and system integrators and shortens time-to-market for fast growing business revenues.
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Data Sharing Software Framework
Adlink DDS
ADLINK DDS is a ubiquitous data sharing software framework based on the open and proven DDS standard that supports a wide range of device technologies, operating systems and programming languages. Combining deterministic data delivery, system-wide data sharing and support for data analytics, ADLINK DDS helps system integrators, OEMs, device platform vendors and Cloud service providers (SaaS, PaaS and DaaS) deliver software solutions for many vertical markets, including: Aerospace and Defense, Energy, Robotics, Healthcare, Transportation / Automotive and Industrial Automation.
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PICMG 2.11 3U CompactPCI 47-pin Power Backplanes
cBP-3061/cBP-3062
- PICMG 2.0 CompactPCI Specification Rev. 2.1 compliant- Design for 47-pin 3U CompactPCI redundant power supply*- cBP-3061 for single power supply, cBP-3062 for dual power supply- AC (and DC) Screw terminal input
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Embedded MXM GPU Module with NVIDIA® Quadro® Embedded T1000
EGX-MXM-T1000
The EGX-MXM-T1000 module features advanced NVIDIA® Turing™ GPU technology in MXM 3.1 Type A form factor. It’s compact, slim and reliable design makes it suitable for mission critical environment. EGX-MXM-T1000 provides improved performance per watt. This MXM GPU module offers a flexible and easy solution for deep learning solutions for applications including medical, image processing, and gaming applications.






















